HDAF-23-08.0-S-13-2 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket
Features
HD Mezz is a trademark of Molex Incorporated
Up to 299 I/Os
Solder charge termination for ease of processing
Intermateable with Molex HD Mezz Arrays
Integrated guide posts to minimize contact damage when mating and unmating
2.00 mm x 1.20 mm pitch
Open pin field design
Application specific capability to build any height from 20 mm to 35 mm
Performance: Up to 9 GHz / 18 Gbps
Current rating: 1.8 A max
Voltage rating: 230 VAC/325 VDC max
- 2D view may not be representative of the configured product. Please see 3D preview or CAD download for actual representation.
- Read our 3D Models Disclaimer.
- Please confirm configuration with the Series Print before final design in.
- For assistance with 3D Models, please contact [email protected].
- For 3D Models suitable for EM Field Solvers, please contact Samtec’s Signal Integrity Group.
| Stock |
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| Distributor Stock: 0 pieces |
| OEM Pricing | ||||||
|---|---|---|---|---|---|---|
| Breaks | 15 | 30 | 45 | 90 | 240 | 495 |
| Price | $90.082 | $86.486 | $83.026 | $78.870 | $72.565 | $66.752 |
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| Part Number | Ships Tomorrow | Packaging Type | Min | Mult | Difference | ![]() |
|---|---|---|---|---|---|---|
| HDAF-23-08.0-S-13-2-FR | 0 | Bulk | 1 | 0 | Packaging | No |
| HDAF-23-08.0-S-13-2-TR | 0 | Tape & Reel | 1 | 100 | Packaging | No |
| Packaging Notes |
|---|
| Packaging Type: Tray (15 parts per package) |
