HDAM-23-12.0-S-13-2-TR 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
Features
Solder charge termination for ease of processing
Up to 299 I/Os
HD Mezz is a trademark of Molex Incorporated
Intermateable with Molex HD Mezz Arrays
Integrated guide posts to minimize contact damage when mating and unmating
Performance: Up to 9 GHz / 18 Gbps
Current rating: 1.8 A max
Voltage rating: 230 VAC/325 VDC max
2.00 mm x 1.20 mm pitch
Open pin field design
- 2D view may not be representative of the configured product. Please see 3D preview or CAD download for actual representation.
- Read our 3D Models Disclaimer.
- Please confirm configuration with the Series Print before final design in.
- For assistance with 3D Models, please contact [email protected].
- For 3D Models suitable for EM Field Solvers, please contact Samtec’s Signal Integrity Group.
| Stock |
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| Distributor Stock: 0 pieces |
| OEM Pricing | |||||||
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| Breaks | 1 | 10 | 25 | 50 | 100 | 250 | 500 |
| Price | $88.962 | $85.400 | $81.984 | $77.885 | $71.658 | $65.923 | $59.326 |
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| Part Number | Ships Tomorrow | Packaging Type | Min | Mult | Difference | ![]() |
|---|---|---|---|---|---|---|
| HDAM-23-12.0-S-13-2 | 0 | Tray | 18 | 18 | Packaging | No |
| Packaging Notes |
|---|
| Packaging Type: Tape & Reel (25 parts per package) |
| Tape & Reel products ordered in less than full reel quantities will be provided without leader and trailer. Only products ordered in full reel increments will have a leader and trailer. |
