HLF6 Halo® Rugged, High-Density Socket

Features

  • High-density up to 76 pins in a single row around the perimeter (38 pins per side)

  • Allows for vertical mating with Halo® optical systems and Halo Cu™ copper systems

  • Integrated locking latch mechanism simplifies mating/unmating of the cable assembly

  • Low profile with a 2-piece contact system designed to withstand high shock and vibration

  • Surface mount

  • Samtec Halo® optical transceiver kits and Halo Cu™ copper cables are not affiliated with HALO® front panel or other products sold by Halo Electronics (www.haloelectronics.com)

Halo® Rugged, High-Density Socket
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Protocols
PDR IB EDR 32GFC 64GFC IB HDR 128GFC IB NDR 256GFC IB XDR
25.8 Gbps 28.05 Gbps 28.9 Gbps PAM4 53.13 Gbps PAM4 56.1 Gbps PAM4 106.25 Gbps PAM4 112.2 Gbps PAM4 200 Gbps PAM4
Gbps Capable Capable Capable Capable Capable Capable Capable No
How is this calculated?
Mates and Related Components

Mating Connectors

Halo Cu™ Copper Mid-Board Cable System
HALO-PE

Halo Cu™ Copper Mid-Board Cable System

halo connector and cable
HALO-C

IN DEVELOPMENT - Halo® Next Gen Mid-Board Optical Transceivers

Compliance
Compliance Tools
Material Declaration
EU RoHS and REACH Compliance

For assistance with Compliance, please contact [email protected].
What is Risk Mitigation?