AcceleRate® Extreme Density & Performance Systems

AcceleRate® Extreme Density & Performance Systems

Samtec’s AcceleRate® family of interconnects provides incredible flexibility with extreme density up to 1,000 total I/Os and 112 Gbps PAM4 performance.


Overview

The AcceleRate® product family includes 0.635 mm pitch board-to-board and cable assemblies with incredible density in small form factors to achieve next gen speeds.

AcceleRate® HD – High-density arrays with up to 240 Edge Rate® contacts in a slim, low profile design.

AcceleRate® HP – 112 Gbps PAM4 extreme performance arrays with a flexible open-pin-field design.

AcceleRate® Cable – The industry’s slimmest cable system with direct attach technology for 56 Gbps PAM4 speeds.

AcceleRate® HP Cable – The industry’s highest density 112 Gbps PAM4 system for cable-on-substrate applications.

Accelerate Family Board

Features

Extreme Density

AcceleRate® HD (ADF6/ADM6 shown)
  • Up to 400 total I/Os in a 4-row design
  • 0.635 mm pitch
AcceleRate® HP (APF6/APM6 shown)
  • Up to 800 total I/Os; roadmap to 1,000+
  • 0.635 mm pitch
AcceleRate® Cable (ARC6 shown)
  • 8, 12 & 24 differential pairs in a 2-row design
  • 0.635 mm pitch
AcceleRate® HP Cable (ARP6 shown)
  • 32 to 72 total differential pairs (up to 96 pairs on roadmap)
  • 0.635 mm pitch within the row; 2.20/2.40 mm pitch row-to-row
  • The industry’s highest density 112 Gbps PAM4 cable-to-board system.
Accelerate HD 4 Row
APM6 APF6 Arrays
Accelerate Slim Body Cable Assembly
Accelerate

High-Performance

Performance up to 112 Gbps PAM4 with a roadmap to support next gen speeds.

Cable Assemblies

AcceleRate® HP Cable-on-Substrate System
  • Supports today’s 256-channel chip and tomorrow’s 512-channel chip
  • Cable assembly plugs directly into the connector on the chip substrate
  • Signals route directly from the chip through the cable eliminating PCB routing
    • Improves signal integrity
    • Increases signal reach by 5x
112 Gbps Cable Accelerate HP Mojo Rig
AcceleRate® Slim Cable Assembly
  • Direct attach - contacts are soldered directly to the cable
  • Improved signal integrity by eliminating the transition board and its variability
  • Achieves tighter tolerances
  • Supports PCIe® sidebands
56 Gbps ARC6 Inset Detail Cutaway

Board-to-Board Interconnects

  • Open-pin-field arrays allows for maximum routing and grounding flexibility.
  • Edge Rate® contacts optimized for signal integrity performance
  • 112 Gbps PAM4 – AcceleRate® HP High-Performance Arrays
  • 56 Gbps PAM4 – AcceleRate® HD High-Density, Slim Body Arrays
Open Pin Field

Space-Saving Design

AcceleRate® offers extreme density solutions in incredibly small footprints for increased design flexibility.

Space Saving Design

Families

AcceleRate® HDAcceleRate® HD Ultra-Dense Multi-Row Mezzanine Strips

These 0.635 mm pitch high-density multi-row mezzanine strips are rated for 56 Gbps PAM4 and feature up to 240 high-speed Edge Rate® contacts in a slim, low-profile design.

Features
  • Incredibly dense with up to 240 total I/Os; up to 400 I/Os in development
  • Low profile 5 mm stack height
  • Slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning
  • Additional stack heights in development
Products
V
  • ADM6
  • ADF6
  • GPSO
AcceleRate® HD

AcceleRate® HP High-Performance ArraysAcceleRate® HP High-Performance Arrays

AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design.

Features
  • 0.635 mm pitch open-pin-field array
  • 56 Gbps NRZ/112 Gbps PAM4 performance
  • Cost optimized solution
  • Low-profile 5 mm and up to 10 mm stack heights
  • Up to 400 total pins available; roadmap to 1,000+ pins
  • Data rate compatible with PCIe® 5.0 and 100 GbE
Products
V
  • APM6
  • APF6
  • GPSO
AcceleRate® HP High-Performance Arrays

AcceleRate®AcceleRate® Slim Direct Attach Cable Assemblies

AcceleRate® is the industry’s slimmest cable system with direct attach technology and ultra low skew twinax cable for 56 Gbps PAM4 speeds.

Features
  • Incredibly slim 7.6 mm width
  • High-density 2-row design
  • 34 AWG, 100 Ω Eye Speed® ultra low skew twinax cable
  • 8, 16 and 24 differential pair options available
  • Two rows of high-density contacts directly soldered to the cable
  • Improved signal integrity by eliminating transition board and its variability
Products
V
  • ARC6
  • ARF6
  • ARF6-RA
AcceleRate®

AcceleRate® HP Cable SystemAcceleRate® HP Extreme Density Cable System

AcceleRate® HP cable assembly is the industry’s highest density 112 Gbps PAM4 rated solution for cable-to-board applications.

Features
  • Industry's highest density 112 Gbps PAM4 cable-to-board system
  • 32 to 72 differential pairs (up to 96 pairs on roadmap)
  • 4 or 6 rows (8 rows on roadmap)
  • 34 AWG ultra low skew twinax
  • BGA solder ball attach for simplified processing
  • Rugged squeeze latch for quick disconnect or locking tabs for maximum density (removal tool required)
  • Single-ended micro coax configuration and right-angle in development
Products
V
  • ARP6
  • APF6-L
AcceleRate® HP Cable System

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