ExaMAX® High-Speed Backplane System

ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.


FAMILY OVERVIEW

ExaMAX® Video

The ExaMAX® contact system achieves two reliable points of contact at all times and minimizes residual stub for improved signal integrity performance, while providing low mating force and excellent contact normal force. Signal wafers incorporate a one-piece, embossed ground structure which improves crosstalk performance.

Traditional backplane and direct-mate orthogonal available with backplane cable and coplanar versions in development.

FEATURES

56 G

  • Enables 56 Gbps electrical performance on 2.00 mm column pitch
  • Meets industry specifications such as PCI Express®, Intel OPI abd UPI, SAS, SATA, Fibre Channel, Infini Band and Ethernet
  • Meets and exceeds OIF CEI-28G-LR specification for 28 Gbps standards
  • Direct-mate orthogonal eliminates the need for a backplane/midplane and shortens the signal path for improved signal integrity
  • Allows designers to optimize density or minimize board layer count
  • Samtec Teraspeed Consulting
    • Experts in design, optimization, and evaluation of high speed backplane systems
  • Offerings:
    • Traditional Backplane
    • Backplane Cable
    • Direct-mate orthogonal
    • Coplanar
ExaMAX®

Contact System

  • Two reliable points of contact
    • Even when subjected to angled mating
  • Meets Telecordia GR-1217 CORE specification
  • 2.4 mm mating surface area (contact wipe)
  • Minimizes residual stub
  • Clear separation between contact points
  • Lowest mating force on the market
  • Excellent contact normal force
ExaMAX® Contact System

Wafer Design

  • Individual signal wafers
    • Staggered, differential pair design
    • 24-72 pairs
  • Ground Plane
    • One-piece, embossed ground structure
    • Increased isolation significantly reduces crosstalk
    • Ground signal placement engineered for 92Ω impedance
      • Addresses both 85 and 100Ω applications
    • Balanced differential pairs are arranged in columns with zero skew
Wafer Design

Stub-Free Mating

  • Fully protected terminals on both backplane and daughtercard connectors ensure stub-free mating
  • Hermaphroditic mating interface provides reliable mating, protects pins
Stub Free

Specifications

  • Mating force: 0.36 N max per contact
  • Unmating force: 0.12 N min per contact
  • Current rating: 0.5 A per signal contact
    • 0 < 30 ᵒC temp rise above ambient
  • -55 ᵒC to +85 ᵒC operating temperature
  • Press-fit termination
  • Discrete or integrated guidance, keying and power modules available
  • Manufacturing friendly 0.36 mm PTH for signals and 0.50 mm for grounds
ExaMAX® Specifications

DOWNLOADS

Literature

High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get
High-Speed Interconnect Solutions Guide

High-Speed Cable Interconnect Solutions Guide

Get
Broadcast Video

Broadcast Video Solutions Guide

Get

VIDEOS

Samtec Advanced Interconnect Design Tech Center

Samtec ExaMax HD

SERIES

EBTM

ExaMAX® 2.00 mm Vertical Header Assembly

Features
  • 4 or 6 pairs per column
  • 2.00 mm (.0787") pitch
  • Press fit termination
ExaMAX® 2.00 mm Vertical Header Assembly

EBTM-RA

ExaMAX® 2.00 mm Right Angle Header Assembly

Features
  • 4 or 6 pairs per column
  • 2.00 mm (.0787") pitch
  • Press fit termination
  • Right-angle orientation
ExaMAX® 2.00 mm Right Angle Header Assembly

EBTF-RA

ExaMAX® 2.00 mm Right-Angle Receptacle

Features
  • 4 or 6 pairs per column
  • 2.00 mm (.0787") pitch
  • Press fit termination
ExaMAX® 2.00 mm Right-Angle Receptacle

EBDM-RA

ExaMAX® 2.00 mm Direct Mate Orthogonal Header

Features
  • Eliminates the mid-plane improving airflow and requiring fewer connectors
  • 2.00 mm (.0787") pitch
  • 6 pairs per column
  • Shorter signal path for improved signal integrity performance
  • Integral guide post
ExaMAX® 2.00 mm Direct Mate Orthogonal Header

EBCM

ExaMAX® Backplane Cable Header

Features
  • Improves signal integrity and increases signal path length at higher data rates
  • Intermateable with all ExaMAX® connectors
  • Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
ExaMAX® Backplane Cable Header

EBCF

ExaMAX® Backplane Cable Socket

Features
  • Improves signal integrity and increases signal path length at higher data rates
  • Intermateable with all ExaMAX® connectors
  • Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
ExaMAX® Backplane Cable Socket

EGBM

ExaMAX® Terminal Guide Module

Features
  • Vertical or right-angle orientation
  • Guide module for EBTF-RA and EBTM Series
ExaMAX® Terminal Guide Module

EGBF

ExaMAX® Socket Guide Module

Features
  • Right-angle orientation
  • Guide module for EBTF-RA and EBTM Series
ExaMAX® Socket Guide Module

EPTT

ExaMAX® Terminal Power Module

Features
  • Right-angle orientation
  • Power module for EBTF-RA and EBTM Series
ExaMAX® Terminal Power Module

EPTS

ExaMAX® Socket Power Module

Features
  • Vertical or right-angle orientation
  • Power module for EBTF-RA and EBTM Series
ExaMAX® Socket Power Module

EBCL

Vertical Latching Shroud for ExaMAX® Backplane Cable Socket

Features
  • Provides retention for EBCF-VT to EBTM-VT
  • Surrounds and protects EBTM-VT
  • Screw mounts secure the EBCL to the board (M2 thread)
Vertical Latching Shroud for ExaMAX® Backplane Cable Socket

EBCB

Panel Retention Bracket for ExaMAX® Backplane Cable Header

Features
  • Provides retention for EBCM through a backplane
  • Screw mounts secure the EBCB to the backplane
Panel Retention Bracket for ExaMAX® Backplane Cable Header

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