AcceleRate® HP High-Performance Arrays

AcceleRate® HP High-Performance Arrays

AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design.


FEATURES

  • 0.635 mm pitch open-pin-field array
  • 56 Gbps NRZ/112 Gbps PAM4 performance
  • Cost optimized solution
  • Low-profile 5 mm and up to 10 mm stack heights
  • Up to 400 total pins available; roadmap to 1,000+ pins
  • Data rate compatible with PCIe® Gen 5 and 100 GbE
accelerate

DOWNLOADS

Literature

High-Speed Board-to-Board & Backplane Guide

High-Speed Board-to-Board & Backplane Guide

Download PDF

VIDEOS

Samtec Advanced Interconnect Design Tech Center

Products

APM6

0.635 mm Pitch AcceleRate® HP High-Performance Array Terminal

Features
  • Open-pin-field for grounding and routing flexibility
  • 56 Gbps NRZ/112 Gbps PAM4 performance
  • Up to 400 total pins available; roadmap to 1,000+ pins
  • Low-profile 5 mm and up to 10 mm stack heights
  • Data rate compatible with PCIe® 5.0 and 100 GbE
0.635 mm Pitch AcceleRate® HP High-Performance Array Terminal

APF6

0.635 mm Pitch AcceleRate® HP High-Performance Array Socket

Features
  • Open-pin-field for grounding and routing flexibility
  • 56 Gbps NRZ/112 Gbps PAM4 performance
  • Up to 400 total pins available; roadmap to 1,000+ pins
  • Low-profile 5 mm and up to 10 mm stack heights
  • Data rate compatible with PCIe® 5.0 and 100 GbE
0.635 mm Pitch AcceleRate® HP High-Performance Array Socket

GPSO

Guide Post Standoff

Features
  • Allows for 0.035" of initial misalignment; alignment starts before connectors engage
  • Assists with “blind mate” for ultra micro, fine pitch mezzanine connectors
  • 5 mm - 30 mm stack heights
  • MIL-DTL stainless steel
  • Pairs well with NVAM/NVAF, APM6/APF6, ADM6/ADF6 and UMPT/UMPS
Guide Post Standoff

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