Mezzanine Strips

Board-to-board systems to 28+ Gbps performance featuring integral ground planes, rugged Edge Rate® contacts, slim body and low profile stack heights.


Q Strip®Q Strip® High-Speed Interconnects

Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential.

Features
  • Performance: Up to 14.0 GHz /28 Gbps
  • Integral ground/power plane
  • Connector to connector retention options
  • Vertical, perpendicular, and coplanar applications
  • Contacts: Up to 180 I/Os
  • Stack height: 5.00 mm - 25.00 mm
Series
V
  • QSE
  • QSE-EM
  • QSH
  • QSH-RA
  • QSS
  • QSS-RA
  • QTE
  • QTH
  • QTH-RA
  • QTS
  • QTS-RA
Q Strip®

Q Pairs®Q Pairs® Differential Pair Interconnects

Samtec Q Pairs® connectors are designed for high-speed board-to-board applications where signal integrity is essential.

Features
  • Performance: Up to 10.5 GHz / 21 Gbps
  • Optimized for 100 ohm systems
  • Integral ground/power plane
  • Stack height: 5.00-25.00 mm
  • Contacts: Up to 100 pairs
Series
V
  • QSE-DP
  • QSH-DP
  • QSH-DP-RA
  • QSS-DP
  • QTE-DP
  • QTH-DP
  • QTH-DP-RA
  • QTS-DP
Q Pairs®

Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects

Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features
  • Performance: Up to 15 GHz / 30 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Series
V
  • QRF8
  • QRF8-DP
  • QRF8-RA
  • QRM8
  • QRM8-DP
  • QRM8-RA
Help Me Choose?
Q Rate®

Q2™Q2™ Rugged, High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features
  • Performance: Up to 8.5 GHz / 17 Gbps
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power and RF ends options
  • Contacts: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Series
V
  • QFS
  • QFS-DP
  • QFS-EM
  • QFS-PC
  • QFS-RA
  • QFSS
  • QFSS-DP
  • QFSS-DP-PC
  • QFSS-PC
  • QMS
  • QMS-DP
  • QMS-EM
  • QMS-PC
  • QMS-RA
  • QMSS
  • QMSS-DP
  • QMSS-DP-PC
  • QMSS-PC
Help Me Choose?
Q2™

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
Help Me Choose?
Edge Rate®

Edge Rate® High-DensityEdge Rate® High-Density Multi-Row Mezzanine Strips

These 0.635 mm pitch high-density multi-row mezzanine strips feature up to 240 high-speed Edge Rate® contacts in a slim, low-profile design.

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height and slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact systems optimized for signal integrity performance
  • Supports 28+ Gbps applications
  • Solder ball technology for simplified processing
  • Even thinner 2-row version and additional stack heights in development
Series
V
  • EDF6
  • EDM6
Edge Rate® High-Density

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • JSO
  • LSEM
  • LSHM
  • LSS
Razor Beam™

Today’s electronics industry not only demands higher speeds in smaller form factors, but it also expects these demands to be met with interconnects that hold a reliable connection in any application. Rugged contact systems, micro power interconnects and rugged signal integrity ar...
One of several demonstrations at DesignCon 2017 shows the variety of Samtec interconnects supporting the Xilinx® Virtex® UltraScale+ FPGA VCU118 Development Kit.  Included in the kit is an FMC+ Active Loopback Card, which carries Samtec’s direct attach Flyover™ QSFP28. In the Fly...
In this video, Kevin Burt of Samtec’s Optical Group explains one of Samtec’s product demonstrations at DesignCon 2017.  The demo features a disaggregated computing platform with PCIe® Gen 3 fabric enabled by the patented FireFly™ mid-board optical technology. PCIe® Over Fiber PCI...
At DesignCon 2017, Jim Nadolny, Samtec’s Principle SI and EMI Engineer, presented(1) a technical paper entitled “Design of Flyover QSFP28 (FQSFP Series) for 56+ Gbps Applications.” This white paper discusses the Flyover QSFP (FQSFP) approach for 56+ Gbps applications to overcome ...
In our previous web update post, we rolled out a new streamlined sampling feature for our Solutionator® parametric search tool, which gave users the capability to place a sample request very quickly by filling out all required sampling information on a single screen. This month, ...
View Full Site