Compression / One Piece

One piece connectors for rugged, high shock and vibration applications featuring robust designs, mechanical hold downs, screw downs, and low profile designs on 1.00 mm, 1.27 mm, 2.54 mm and .100" pitch.

Low Profile One Piece ArraysLow Profile One Piece Arrays

Low profile, high density one piece arrays with compression contact system.

  • Low Profile - 1.27 mm and 2.00 mm standard heights
  • Dual compression contacts
  • Single compression with solder ball
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Up to 400 I/Os
  • 1.00 mm (.0394") pitch
  • GMI
Low Profile One Piece Arrays

.100" (2.54 mm) Pitch One Piece.100" (2.54 mm) Pitch One Piece

One piece interconnects in vertical and right angle designs with large contact deflection.

  • Current Rating: 2.4 A per pin
  • Contacts: Up to 30 I/Os
  • Screw insert option for rugged environments
  • Alignment pins on either side of connector
  • Large contact deflection
  • Optional Alignment Pins
  • OPP
  • PGP
  • SIB
  • SIR1
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.100" (2.54 mm) Pitch One Piece

Micro Pitch One PieceMicro Pitch One Piece

1.00 mm and .050" pitch one piece interfaces for rugged and power applications.

  • For high shock, vibration, rugged applications
  • Elevated and low profiles from 3 mm to 10 mm
  • Optional screw mounts and alignment pins
  • Single and double row designs
  • FSI
  • SEI
  • SIBF
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Micro Pitch One Piece

Z-Ray® Ultra Low Profile InterposersZ-Ray® Ultra Low Profile Interposers

Ultra low profile, high density one piece array interposers with compression contacts.

  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
  • ZA1
  • ZA8
  • ZD
  • ZSO
Z-Ray® Ultra Low Profile Interposers


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