Compression / One-Piece

One-piece connectors for rugged, high-shock and vibration applications featuring robust designs, mechanical hold downs, screw downs, and low profile designs on 1.00 mm, 1.27 mm, 2.54 mm and .100" pitch.


Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra-Low Profile Arrays

Low Profile One-Piece ArraysLow Profile One-Piece Compression Arrays

High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

Features
  • 1.27 mm and 2 mm standard body heights
  • 1.00 mm pitch
  • Dual compression or single compression with solder balls
  • 100 – 400 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
Series
V
  • GMI
Low Profile One-Piece Arrays

Micro Pitch One-PieceMicro Pitch One-Piece

1.00 mm and .050" pitch one-piece interfaces for rugged and power applications.

Features
  • For high-shock, vibration, rugged applications
  • Elevated and low profiles from 3 mm to 10 mm
  • Optional screw mounts and alignment pins
  • Single and double row designs
Series
V
  • FSI
  • SEI
  • SIBF
Micro Pitch One-Piece

.100" (2.54 mm) Pitch One-Piece.100" (2.54 mm) Pitch One Piece

One-piece interconnects in vertical and right-angle designs with large contact deflection.

Features
  • Current Rating: 2.4 A per pin
  • Contacts: Up to 30 I/Os
  • Screw insert option for rugged environments
  • Alignment pins on either side of connector
  • Large contact deflection
  • Optional alignment pins
Series
V
  • OPP
  • PGP
  • SIB
  • SIR1
.100" (2.54 mm) Pitch One-Piece

SEARAY™ is a family of high speed, high density connectors. SEARAY gives designers tons of design flexibility, much more than any other array product in the connector industry. DESIGN FLEXIBILITY SEARAY is on a 1.27 mm X 1.27 mm grid. This is an open pin field grid array, which m...
Samtec’s FFSD, FFMD Series are micro-pitch, high reliability, high cycle IDC cable assemblies. TIGER EYE™ CONTACT The connector systems incorporate the Tiger Eye™ contact. Tiger Eye is a rugged contact for micro pitch interconnects; it is ideal for high reliability and high matin...
In this short video, Steve Groothuis, Chief Technology Officer for Samtec Microelectronics, explains Glass Core Technology (GCT), why it matters in advanced substrate packaging, and the solutions it provides. GCT is a proprietary process that leverages the performance benefits of...
Since we released Samtec Solutionator 2.0, our updated parametric search tool, the most requested feature from users has been the ability to export the results of the data grid. We’re happy to announce that with our most recent update, you can now export up to 1,000 rows of data ...
Interconnects for the military/aerospace industry are used in a variety of applications, including communication and navigation equipment, radar, airborne, marine and space guidance control, and electronic warfare, to name a few. While Samtec products are used in commercial appli...
View Full Site