Compression / One-Piece

One-piece connectors for rugged, high-shock and vibration applications featuring robust designs, mechanical hold downs, screw downs, and low profile designs on 1.00 mm, 1.27 mm, 2.54 mm and .100" pitch.


Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® High-Density, Ultra-Low Profile, Highly Customizable Arrays

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA8
  • ZA1
  • ZA8H
  • ZD
  • ZSO
  • ZHSI
Z-Ray® Ultra-Low Profile Arrays

Low Profile One-Piece ArraysLow Profile One-Piece Compression Arrays

High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

Features
  • 1.27 mm and 2 mm standard body heights
  • 1.00 mm pitch
  • Dual compression or single compression with solder balls
  • 100 – 400 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
Series
V
  • GMI
Low Profile One-Piece Arrays

Micro Pitch One-PieceMicro Pitch One-Piece

1.00 mm and .050" pitch one-piece interfaces for rugged and power applications.

Features
  • For high-shock, vibration, rugged applications
  • Elevated and low profiles from 3 mm to 10 mm
  • Optional screw mounts and alignment pins
  • Single and double row designs
Series
V
  • SEI
  • FSI
  • SIBF
Micro Pitch One-Piece

.100" (2.54 mm) Pitch One-Piece.100" (2.54 mm) Pitch One Piece

One-piece interconnects in vertical and right-angle designs with large contact deflection.

Features
  • Current Rating: 2.4 A per pin
  • Contacts: Up to 30 I/Os
  • Screw insert option for rugged environments
  • Alignment pins on either side of connector
  • Large contact deflection
  • Optional alignment pins
Series
V
  • OPP
  • SIB
  • SIR1
  • PGP
.100" (2.54 mm) Pitch One-Piece

Many of our Samtec blogs focus on high-speed, high-bandwidth, cutting-edge connector applications. This makes sense because Signal Integrity is a critical issue for many of our customers, and because it’s a more flashy, attention-grabbing, sexy topic. And yes, I did just use the ...
Many electronics experience a wide range of climates while in operation and storage. Because of this fact, connector humidity testing is used to determine the ability of a product to withstand elevated humidity and cycling temperatures. Humidity testing is conducted in combinatio...
In this new video, Samtec’s Kevin Burt introduces Samtec Direct Connect™. Direct Connect gives the benefit of exiting a higher number of lanes at low loss from the chip package, which can be very useful in both high performance computing and network switching applications, especi...
This is the first release of a few phases of a new login system for Samtec.com. This replaces a system that was built in 2011 and has been running well ever since. But, technology changes over time, and it was time for an upgrade. Here are some additional details about the featur...
Modern electronic devices are getting smaller with every new generation, and as a result, they are becoming more portable.  At the same time, the performance of these devices is growing as the demands of consumers become greater.  We expect to be able to connect to the internet w...