Compression / One-Piece

One-piece connectors for rugged, high-shock and vibration applications featuring robust designs, mechanical hold downs, screw downs, and low profile designs on 1.00 mm, 1.27 mm, 2.54 mm and .100" pitch.


Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra-Low Profile Arrays

Low Profile One-Piece ArraysLow Profile One-Piece Compression Arrays

High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

Features
  • 1.27 mm and 2 mm standard body heights
  • 1.00 mm pitch
  • Dual compression or single compression with solder balls
  • 100 – 400 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
Series
V
  • GMI
Low Profile One-Piece Arrays

Micro Pitch One-PieceMicro Pitch One-Piece

1.00 mm and .050" pitch one-piece interfaces for rugged and power applications.

Features
  • For high-shock, vibration, rugged applications
  • Elevated and low profiles from 3 mm to 10 mm
  • Optional screw mounts and alignment pins
  • Single and double row designs
Series
V
  • FSI
  • SEI
  • SIBF
Micro Pitch One-Piece

.100" (2.54 mm) Pitch One-Piece.100" (2.54 mm) Pitch One Piece

One-piece interconnects in vertical and right-angle designs with large contact deflection.

Features
  • Current Rating: 2.4 A per pin
  • Contacts: Up to 30 I/Os
  • Screw insert option for rugged environments
  • Alignment pins on either side of connector
  • Large contact deflection
  • Optional alignment pins
Series
V
  • OPP
  • PGP
  • SIB
  • SIR1
.100" (2.54 mm) Pitch One-Piece

New Power Connector Options Increase Design and Performance Options Samtec’s EXTreme Ten60Power™ header and socket system (ET60T/ET60S Series) is available in both power/signal combinations and power only for increased design flexibility. A new 5-row signal option allows for up t...
Samtec receives daily requests from designers looking for customized solutions for application-specific interconnect needs. Samtec has turned the quick-turn prototype model from our Sudden Service® Advantage into a standard design methodology. Numerous customers were interested i...
We often take for granted the dual 12-megapixel camera collecting dust on the back of our smartphones or the fact that almost any building we enter has a sign reading “Smile, you’re on camera!”.  Cameras have gone from a mysterious “stealer of souls” to a technology we can’t seem...
Samtec will be introducing several new products at DesignCon 2018. All of these products are designed to increase data rates, increase system density, and shrink product footprints, so designers can meet their system signal integrity needs. NovaRay™ High Bandwidth, High Density A...
Wow. What a fun year for Samtec.com and the entire team behind it! In 2017, we streamlined your online sampling experience, brought you a way to view detailed information about any of our trillions of part numbers, built an entirely new on-site search, upgraded to Azure CDN and A...
View Full Site