Compression / One-Piece

One-piece connectors for rugged, high-shock and vibration applications featuring robust designs, mechanical hold downs, screw downs, and low profile designs on 1.00 mm, 1.27 mm, 2.54 mm and .100" pitch.


Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra-Low Profile Arrays

Low Profile One-Piece ArraysLow Profile One-Piece Compression Arrays

High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

Features
  • 1.27 mm and 2 mm standard body heights
  • 1.00 mm pitch
  • Dual compression or single compression with solder balls
  • 100 – 400 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
Series
V
  • GMI
Low Profile One-Piece Arrays

Micro Pitch One-PieceMicro Pitch One-Piece

1.00 mm and .050" pitch one-piece interfaces for rugged and power applications.

Features
  • For high-shock, vibration, rugged applications
  • Elevated and low profiles from 3 mm to 10 mm
  • Optional screw mounts and alignment pins
  • Single and double row designs
Series
V
  • FSI
  • SEI
  • SIBF
Micro Pitch One-Piece

.100" (2.54 mm) Pitch One-Piece.100" (2.54 mm) Pitch One Piece

One-piece interconnects in vertical and right-angle designs with large contact deflection.

Features
  • Current Rating: 2.4 A per pin
  • Contacts: Up to 30 I/Os
  • Screw insert option for rugged environments
  • Alignment pins on either side of connector
  • Large contact deflection
  • Optional alignment pins
Series
V
  • OPP
  • PGP
  • SIB
  • SIR1
.100" (2.54 mm) Pitch One-Piece

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Kevin Burt, of the Samtec Optical Group, explains another one of the several demos that Samtec presented at OFC 2017.  In this demo, four GT 28 Gbps transceiver signals are generated by an FPGA and launched mid-board from a FireFly™ 28 G x4 optical connector system. These 28 Gbps...
Our friend Eric Bogatin wrote a paper for DesignCon 2017 entitled “New Characterization Technique for Glass-Weave Skew.”  He wrote a summary article of the paper in Signal Integrity Journal. Since many of our readers strive to optimize their signal transmission path, I thought it...
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