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Board-to-Board Connectors
High-Speed Board-to-Board Connectors
High Density Connectors and Arrays
LP Array™
LPAM
Board-to-Board Connectors
High-Speed Board-to-Board Connectors
High Density Connectors and Arrays
LP Array™
LPAM

LPAM

Product Specs
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LPAM

Product Specs

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

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Features

  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 400 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • 56 Gbps PAM4 performance
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