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Board-to-Board Connectors
High-Speed Board-to-Board Connectors
High Density Connectors and Arrays
LP Array™
LPAM
lpam-50-01.0-l-08-2-k-tr
Board-to-Board Connectors
High-Speed Board-to-Board Connectors
High Density Connectors and Arrays
LP Array™
LPAM
lpam-50-01.0-l-08-2-k-tr

LPAM-50-01.0-L-08-2-K-TR

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal rohs logo Product Specs

LPAM-50-01.0-L-08-2-K-TR

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal rohs logo

Product Specs
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View Mating Products: LPAF-50-03.0-S-08-2-K-TR .050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

Stock
  Distributor Stock: 660 pieces 
Pricing
Breaks 1 10 25 50 100 250 500 600 1800 3900
Price $35.610 $33.710 $32.450 $31.660 $25.830 $23.890 $20.010 $16.120 $14.910 $13.790

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Please confirm configuration with the Series Print before final design in.

For assistance with 3D Models, please contact e3DModels@Samtec.com.

For 3D Models suitable for EM Field Solvers, please contact Samtec’s Signal Integrity Group.

Features

  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 400 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • 56 Gbps PAM4 performance
Specs Kit

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