High-Speed
Dual Row Strips
High-Speed Dual Row Strips
Reliable SI Performance • Optimized for Speed • Space Saving Designs
Samtec offers the largest variety of high-speed board-to-board interconnects in the industry with full engineering support, online tools and an unmatched service attitude.
High-speed mezzanine solutions include Q Strip® ground plane connectors for reliable performance in space-saving designs, as well as Edge Rate® connector strips optimized for signal integrity performance to 56 Gbps PAM4 in a wide variety of stack heights.
Q Strip®Q Strip® High Speed Ground Plane Connectors, Mezzanine
Featuring an integral ground plane, Samtec Q Strip® high speed ground plane connectors are designed for high-speed board-to-board applications where signal integrity is essential.
Features
- Performance: Up to 14.0 GHz /28 Gbps
- Integral ground/power plane
- Connector to connector retention options
- Vertical, perpendicular, and coplanar applications
- Contacts: Up to 180 I/Os
- Stack height: 5 mm - 25 mm
Q Rate®Q Rate® Slim, Rugged High-Speed Mezzanine Connectors
Samtec Q Rate® rugged high speed connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.
Features
- Performance to 28 Gbps
- Rugged Edge Rate® contacts
- Integral ground/power plane
- Up to 156 positions
- Slim footprint (less than 5.00 mm wide)
Q2™Q2™ Rugged, Shielded, High-Speed Mezzanine Connectors
These rugged, shielded, high-speed mezzanine connectors feature a ground plane and high-wipe contacts.
Features
- Performance to 25 Gbps NRZ
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
- Power combo option
- Contacts: Up to 208 I/Os
- Stack height: 10.00 mm - 16.00 mm
Edge Rate®Edge Rate® High-Speed Rugged High-Cycle Connectors
Edge Rate® rugged high cycle connectors feature contact systems optimized for signal integrity performance.
Features
- Edge Rate® contacts optimized for signal integrity performance
- 1.5 mm contact wipe
- Robust when "zippered" during unmating
- Up to 56 Gbps PAM4 performance
- 0.50 mm, 0.635 mm or 0.80 mm pitch systems
- Stack heights from 5 mm to 18 mm
- Extremely slim 2.5 mm body width on 0.635 mm pitch system
- 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
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