Samtec COM-HPC®互连器

COM-HPC®的开发超出了嵌入式计算机对高速性能的需求,并为下一代嵌入式系统设计提供了可扩展性。此标准中包含的Samtec互连器可提供5 mm和10 mm堆叠高度、0.635 mm间距的400端子开放式端子、BGA连接和高达112 Gbps PAM4的性能。请观看视频以了解更多信息。https://www.samtec.com/standards/picmg/comhpc

Samtec Harrisburg attended the 17th annual Penn State Harrisburg Signal/Power Integrity Symposium and MASH Forum on Friday, April 19th 2024, hosted by the Center for Signal Integrity. The main goal of the […] The post Samtec Design Center Attends Annual Penn State Harrisburg SI/P...
As the world gears up to celebrate the 150th running of the Kentucky Derby,the excitement is intense. This iconic event isn’t just about horse racing;it’s a celebration of tradition, athleticism, […] The post Celebrating Community and Innovation: Samtec’s Connection to the 150th ...
Wait . . . An AI hardware platform without a GPU? Is that even possible? Obviuolsy, I jest. GPUs are the workhorse solutions for ever larger LLMs and cutting-edge generative […] The post New AMD Versal AI Edge SoM and Carrier Card From Avnet Feature Samtec Interconnects appeared ...
Artificial Intelligence. Or, the intelligence of computers. It’s all around us, but I think it’s important to remember that this intelligence is driven by human intelligence. It’s the human innovation behind […] The post Artificial Intelligence: How to Manage High Amounts of Dat...
Our modern industrial world depends on raw materials. Whether oil, steel or cotton, raw materials have been of huge importance to the development of the industriaized world. While these physical […] The post Connectors for HPC and Supercomputing appeared first on The Samtec Blog....