Micro Pitch Board-To-Board

Interconnect systems with pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

.050" Systems

.050" Systems

.050" (1.27 mm) pitch board stacking socket and terminal strips in low profile and elevated stack heights, pass-through, rugged, high-density, and low cost designs.


.050" x .050" Micro Pitch Systems.050" x .050" Micro Pitch Terminal and Socket Strips

.050" (1.27mm) x .050" (1.27mm) pitch board-to-board systems in a variety of board stacking heights, orientations and contact styles.

Features
  • Series up to 10,000 cycles
  • Wide array of board stacking heights
  • Various mating orientations
  • Rugged options
  • Numerous contact styles
  • Stack heights .235" (5.91 mm) - .754" (19.15 mm)
  • Available up to 100 pins
Series
V
  • TFM
  • TFML
  • TFC
  • FW-SM
  • FW-TH
  • FTSH
  • FTS
  • FSH
  • HPT
  • SFM
  • SFML
  • SFC
  • SFMC
  • SFMH
  • CLP
  • FLE
.050" x .050" Micro Pitch Systems

Micro Rugged Board-to-Board

Micro Rugged Board-to-Board

Micro pitch interconnects with high-reliability Tiger Eye™ and rugged Edge Rate® contact systems for high mating cycles, high-shock and vibration applications; integral ground/power plane interconnects with increased contact wipe and insertion depth for rugged applications; self-mating interconnects with mating/unmating forces 4-6x greater than typical micro pitch connectors.


Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • 1.5 mm contact wipe
  • Robust when "zippered" during unmating
  • Up to 56 Gbps PAM4 performance
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • Stack heights from 5 mm to 18 mm
  • Extremely slim 2.5 mm body width on 0.635 mm pitch system
  • 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Series
V
  • ERM8
  • ERF8
  • ERM8-RA
  • ERF8-RA
  • ERM8-EM
  • ERF8-EM
  • ERM5
  • ERF5
  • ERF5-RA
  • ERM6
  • ERF6
Edge Rate®

Rugged Tiger Eye™ SystemsRugged Tiger Eye™ Systems

These rugged, high-reliability, high-cycle interconnects feature Samtec's Tiger Eye™ contact system.

Features
  • High-reliability Tiger Eye™ three-finger BeCu contact system
  • Optional locking and latching systems for higher withdrawal force
  • Extended Life Product™ testing available
  • Standard and cost-saving designs
Series
V
  • SEM
  • TEM
  • SEML
  • SEMS
  • TEMS
  • SFM
  • TFM
  • TFML
  • SFC
  • TFC
  • SFMH
  • FSH
  • SFMC
  • FOLC
  • MOLC
  • S2M
  • T2M
  • SMM
  • TMM
  • SFML
Rugged Tiger Eye™ Systems

Ultra Micro PowerUltra Micro Power Connector Systems

Micro 2.00 mm pitch power blade interconnects designed for staging a combination power and signal/ground solution.

Features
  • Design flexibility as a power-only system or a two-piece system for power/signal applications
  • Use with Samtec’s high-speed connector systems for a power/signal solution
  • 5 mm to 20 mm stack heights
  • Up to 15 A per blade
  • 2 – 5 power blades on a 2.00 mm pitch
Series
V
  • UMPT
  • UMPS
Ultra Micro Power

Q2™Q2™ Rugged/High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features
  • Performance: Up to 8.5 GHz / 17 Gbps
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power and RF ends options
  • Contacts: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Series
V
  • QFS
  • QMS
  • QFS-DP
  • QMS-DP
  • QFS-RA
  • QMS-RA
  • QFS-EM
  • QMS-EM
  • QFS-PC
  • QMS-PC
  • QFSS
  • QMSS
  • QFSS-DP
  • QMSS-DP
  • QFSS-PC
  • QMSS-PC
  • QFSS-DP-PC
  • QMSS-DP-PC
Q2™

Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects

Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features
  • Performance: Up to 15 GHz / 30 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Series
V
  • QRF8
  • QRM8
  • QRF8-DP
  • QRF8-RA
  • QRM8-DP
  • QRM8-RA
Q Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • LSHM
  • LSS
  • LSEM
  • JSO
Razor Beam™

Floating Contact SystemsFloating Contact System

High-speed floating contact system minimizes mating alignment errors.

Features
  • Provides 0.50 mm (.0197") float in X and Y directions
  • Ideal for multiple connectors on a board
  • Up to 60 floating contacts
  • Choice of body height and right-angle design
Series
V
  • FT5
  • FS5
Floating Contact Systems

Micro Pitch Systems

Micro Pitch Systems

Board stacking interconnects on 0.40 mm, 0.50 mm, 0.635 mm, 0.80 mm, and 1.00 mm pitch with stack heights from 2.3 mm to 8 mm, vertical and right-angle orientations.


Razor Beam™ LPRazor Beam™ LP

Ultra slim, ultra low profile and ultra fine pitch interconnects.

Features
  • Ultra fine pitch – 0.40 mm and 0.50 mm
  • Ultra low stack down to 2.00 mm
  • Slim body design for increased board space savings
Series
V
  • SS4
  • ST4
  • SS5
  • ST5
  • SLH
  • TLH
Razor Beam™ LP

0.50 mm (.0197") Pitch Systems0.50 mm (.0197") Pitch Systems

Micro Blade & Beam systems in a variety of stack heights and orientations for flexible stacking.

Features
  • Basic blade & beam system
  • Low profile systems available
  • Available up to 300 I/Os
  • Several meet E.L.P.™ (Extended Life Product™) standards
  • Hermaphroditic connectors available
  • Various standard positions available up to 300
  • Vertical and right-angle styles available
Series
V
  • BTH
  • BTH-RA
  • BSH
  • BSH-RA
  • LTH
  • LSHM
  • BSH-EM
  • BTH-EM
  • LSH
0.50 mm (.0197") Pitch Systems

0.635 mm (.025") Pitch Systems0.635 mm (.025") Pitch Systems

Basic Blade & Beam systems for flexible stacking.

Features
  • Basic blade & beam system
  • Low profile systems available
  • Available up to 300 I/Os
  • Several meet E.L.P.™ (Extended Life Product™) standards
  • Edge mount style available
Series
V
  • BTS
  • BSS
  • LSS
0.635 mm (.025") Pitch Systems

0.80 mm (.0315") Pitch Systems0.80 mm (.0315") Pitch Systems

Flexible stacking interconnects available in a variety of contact systems, position counts, and low profile styles.

Features
  • Several contacts styles available
  • Low profile systems available
  • Available up to 300 I/Os
  • Hermaphroditic connectors available
  • Edge mount styles available
  • Several meet E.L.P.™ (Extended Life Product™) standards
Series
V
  • BTE
  • BSE
  • LSEM
  • ERM8
  • ERF8
  • CLE
  • TEM
  • SEM
  • FTE
  • AW
0.80 mm (.0315") Pitch Systems

1.00 mm (.0394") Pitch Systems1.00 mm Pitch (.0394") Systems

Flexible stacking interconnects available in a variety of contact systems, position counts, and low profile styles.

Features
  • Various board stacking styles and options
  • Rugged options available
  • Up to 100 I/Os
  • Flexible stack height features
  • E.L.P.™ (Extended Life Product™) available
Series
V
  • BKS
  • BKT
  • FTMH
  • FTMH
  • CLM
  • MLE
  • MW
  • FTM
1.00 mm (.0394") Pitch Systems

Floating Contact SystemFloating Contact System

High-speed floating contact system minimizes mating alignment errors.

Features
  • Provides 0.50 mm (.0197") float in X and Y directions
  • Ideal for multiple connector, board-to-board applications
  • Up to 60 floating contacts
  • Choice of body height and right-angle design
Series
V
  • FT5
  • FS5
Floating Contact System

Compression / One-Piece

Compression / One-Piece

One-piece connectors for rugged, high-shock and vibration applications featuring robust designs, mechanical hold downs, screw downs, and low profile designs on 1.00 mm, 1.27 mm, 2.54 mm and .100" pitch.


Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® High-Density, Ultra-Low Profile, Highly Customizable Arrays

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA8
  • ZA1
  • ZA8H
  • ZD
  • ZSO
  • ZHSI
Z-Ray® Ultra-Low Profile Arrays

Low Profile One-Piece ArraysLow Profile One-Piece Compression Arrays

High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

Features
  • 1.27 mm and 2 mm standard body heights
  • 1.00 mm pitch
  • Dual compression or single compression with solder balls
  • 100 – 400 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
Series
V
  • GMI
Low Profile One-Piece Arrays

Micro Pitch One-PieceMicro Pitch One-Piece

1.00 mm and .050" pitch one-piece interfaces for rugged and power applications.

Features
  • For high-shock, vibration, rugged applications
  • Elevated and low profiles from 3 mm to 10 mm
  • Optional screw mounts and alignment pins
  • Single and double row designs
Series
V
  • SEI
  • FSI
  • SIBF
Micro Pitch One-Piece

.100" (2.54 mm) Pitch One-Piece.100" (2.54 mm) Pitch One Piece

One-piece interconnects in vertical and right-angle designs with large contact deflection.

Features
  • Current Rating: 2.4 A per pin
  • Contacts: Up to 30 I/Os
  • Screw insert option for rugged environments
  • Alignment pins on either side of connector
  • Large contact deflection
  • Optional alignment pins
Series
V
  • OPP
  • SIB
  • SIR1
  • PGP
.100" (2.54 mm) Pitch One-Piece

.050" x .100"

.050" x .100"

.050" (1.27 mm) X .100" (2.54 mm) pitch board stacking interconnects available in socket and terminal strips, board stackers, low profile and skyscraper stack heights, pass-through, rugged, and high-density designs.


.050" x .100" Pitch Systems.050" x .100" Pitch Systems

Micro pitch, high-density pin and socket systems with choice of stack heights.

Features
  • Standard and high-temp designs
  • Low profile and skyscraper board stacking
  • Optional polarization, alignment pins and locking clips
  • Flex shroud available
Series
V
  • TMS
  • HTMS
  • MTMS
  • HMTMS
  • DWM
  • HDWM
  • TML
  • ZML
  • FTR
  • RSM
  • SLM
  • SMS
.050" x .100" Pitch Systems

Four Row High-Density

Four Row High-Density

.050" (1.27 mm) X .050" (1.27) pitch board stacking interconnects with high-reliability Tiger Eye™ and high-retention Tiger Buy™ contact systems.


High-Reliability Quad Row SystemHigh-Reliability .050" x .050" Pitch Quad Row System

Four row terminal and socket strips with up to 200 Tiger Eye™ contacts for high-reliability.

Features
  • High-density connector strips up to 200 pins
  • High-reliability Tiger Eye™ contact system
  • Four row staggered layout
  • Optional locking clips and alignment pins
Series
V
  • MOLC
  • FOLC
High-Reliability Quad Row System

Cost Effective Quad Row SystemCost Effective .050" (1.27 mm) Pitch Quad Row System

Four row terminal and socket strips with up to 200 Tiger Buy™ pins on a staggered layout.

Features
  • High-density connector strips up to 200 pins
  • High-retention Tiger Buy™ contacts
  • Four row design
  • Optional locking clips
Series
V
  • TOLC
  • SOLC
Cost Effective Quad Row System

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