BSP-200300-01 XCede® HD High-Density Backplane Custom Right-Angle Module
Features
Contact [email protected] for assistance building a BSP product
Fully custom module to meet specific application requirements
Combine any number, in any configuration of HDTF (signal), HPTT (power) and keying/guidance to create one BSP product
Power and keying/guidance available for custom configurations only
For a signal only solution, see HDTF Series
- 2D view may not be representative of the configured product. Please see 3D preview or CAD download for actual representation.
- Read our 3D Models Disclaimer.
- Please confirm configuration with the Series Print before final design in.
- For assistance with 3D Models, please contact [email protected].
- For 3D Models suitable for EM Field Solvers, please contact Samtec’s Signal Integrity Group.
| Packaging Notes |
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| Packaging Type: Tray |