BSP-226769-01 XCede® HD High-Density Backplane Custom Right-Angle Module
Features
Modular design provides flexibility in applications
85 Ω and 100 Ω options
Standard or high-speed wafers available
3-, 4- and 6-pair designs
4, 6 or 8 columns
Current rating: 1.5 A max
Voltage rating: 48 VAC/68 VDC max
- 2D view may not be representative of the configured product. Please see 3D preview or CAD download for actual representation.
- Read our 3D Models Disclaimer.
- Please confirm configuration with the Series Print before final design in.
- For assistance with 3D Models, please contact [email protected].
- For 3D Models suitable for EM Field Solvers, please contact Samtec’s Signal Integrity Group.
| Packaging Notes |
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| Packaging Type: Tray (V) |
