Ultra Micro Interconnects

Ultra Micro Interconnects
Space Saving Designs • Hermaphroditic • High-Density

Samtec's ultra micro interconnects feature fine pitches, slim body designs and extremely low profiles for incredible design flexibility with high-speed performance up to 56 Gbps PAM4. Self-mating Razor Beam™ interconnects reduce inventory costs, and can be interchanged for a variety of stack heights from 5 to 12 mm with optional EMI shielding. Razor Beam™ contacts feature undercut retention notches with an audible click when mated; this increases mating/unmating forces by 4 to 6 times compared to typical micro pitch connectors.

Micro Blade & Beam systems feature incredibly fine pitches and ultra low stack heights down to 2 mm. For a power/signal application, these interconnects are compatible with mPOWER® ultra micro power system. Jack screw standoffs are available for unmating assistance and protection from component damage.

Ultra Micro Interconnects Brochure

Ultra Micro Interconnects Brochure

Download PDF

nuevo LUISPA

x

Razor Beam™Razor Beam™ Fine Pitch Self Mating Connectors

High-speed, high-density Razor Beam™ fine pitch self mating connectors reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • Razor Beam™ contacts for high-speed and fine-pitch systems
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Shielded option for EMI protection
  • Self-mating connectors reduce inventory costs and can be interchanged for varying stack heights
  • 10 stack height options from 5 mm to 12 mm
  • Up to 100 contacts
  • Parallel, perpendicular and coplanar systems
  • Audible click when mated
  • Lubricated option available
  • features
Products

Micro Blade & BeamMicro Blade & Beam Ultra Fine Pitch Connectors

0.40 mm and 0.50 mm pitch Micro Blade & Beam ultra slim, ultra low profile connectors.

Features
  • Ultra fine pitch – 0.40 mm and 0.50 mm
  • Ultra low stack down to 2.00 mm
  • Slim body design for increased board space savings
  • features
Products

A friend of mine told me his birthday was coming up. He told me it was his 15th. “What?”, I thought. He’s older than me. He then told me his […] The post 15 or 60? – Leap Years Explained appeared first on The Samtec Blog....
High-Speed Twinax Cable Solutions To 224 and 112 Gbps PAM4 At DesignCon 2024, Samtec had several live product demonstrations showing a wide variety of Samtec Flyover® cable solutions, all with […] The post New Rugged, High-Speed Twinax Cable Solutions appeared first on The Samtec...
We are faced with choices all day long – some easy and some hard. It can be overwhelming when the options are numerous and any research on the internet is […] The post New High-Speed Board-to-Board & Backplane Guide: A Pile of Choices appeared first on The Samtec Blog....
Semiconductor design is constantly evolving, resulting in more complex, specialized, and integrated systems that push the boundaries of performance. As new technologies and methodologies emerge, semiconductor designers need access to […] The post Samtec Supports Semiconductor Dev...
DesignCon 2024 has just announced its Best Paper Awards winners, and six Samtec authors are honored alongside their colleagues from other organizations. Somewhat unique in the world of “conference paper […] The post Six Samtec Authors Win DesignCon Best Paper Awards appeared firs...