12G-SDI Broadcast Video

Video has transformed from being an analog 6 MHz bandwidth signal to a 12 Gbps digital data stream. As signaling transitioned to 12 Gbps 4K UHD-SDI standards, the demand for meeting stringent return loss requirements up to 12 GHz emerged.

Samtec has the largest variety of 12G-SDI products available, including right-angle and low-profile options.

Click here for a video of Samtec's 12G-SDI optimized RF systems.


12G-SDI, 75 Ω Solutions

75 Ω Products Orientations Part Numbers
BNC Straight, through-hole BNC7T-J-P-XX-ST-TH1
BNC Bulkhead jack, right-angle BNC7T-J-P-XX-RA-BH1
BNC Low profile, bulkhead jack, right-angle (.062" PCB) BNC7T-J-P-XX-RA-BH3 *
BNC Low profile, bulkhead jack, right-angle (.125" PCB) BNC7T-J-P-XX-RA-BH4 *
BNC Bulkhead jack, edge mount (.062" PCB) BNC7T-J-P-XX-ST-EM1
BNC Bulkhead jack, edge mount (.093" PCB) BNC7T-J-P-XX-ST-EM2
BNC Straight, tall through-hole BNC7T-J-P-XX-ST-TH2D Die Cast
BNC Low profile, bulkhead jack, right-angle BNC7T-J-P-XX-RA-BH2D Die Cast
BNC Bulkhead jack, edge mount (.062" PCB) BNC7T-J-P-XX-ST-EM1D Die Cast
BNC Bulkhead jack, edge mount (.093" PCB) BNC7T-J-P-XX-ST-EM2D Die Cast
HDBNC Straight, through-hole HDBNC-J-P-XX-ST-TH1
HDBNC Bulkhead jack, straight, through-hole HDBNC-J-P-XX-ST-BH1
HDBNC Bulkhead jack, right-angle HDBNC-J-P-XX-RA-BH2
HDBNC Bulkhead jack, edge mount HDBNC-J-P-XX-ST-EM1
DIN Straight, through-hole DIN7A-J-P-XX-ST-TH1
DIN Bulkhead jack, right-angle DIN7A-J-P-XX-RA-BH1
  • * BNC7T BH3 and BH4 options are PRELIMINARY.
  • Contact Samtec.

75 Ω Cabling Solutions

For full assembly support, Samtec offers 75 Ω cabling solutions to mate with our 12G-SDI board level products, with mix-and-match end option flexibility.

Product Gauge Part Number
RG 179 30 RF179
RG 6 18 RFA6T
1694A 18 RFB6T
1855A 23 RFB8T

For additional RF solutions visit samtec.com/RF

High-Performance System Solutions

Samtec offers a full line of high-performance solutions to meet the HD and UHD digital transmission demands throughout the broadcast video infrastructure.

Backplane

XCede® HD ExaMAX®
HDTM / HDTF (Contact Samtec) EBTM / EBTF-RA

Flyover

Optical FireFly™ Extended Temp. FireFly™ PCIe®-Over-FireFly™ Extended Temp. PCIe®-Over-FireFly™
ECUO ETUO PCUO PTUO
Flyover QSFP28 Double-Density Flyover QSFP Copper FireFly™ PCIe® Protocol Compatible FireFly™ Direct Attach Cable
FQSFP FQSFP-DD (Contact Samtec) ECUE PCUE DCH

RF Technical Group + Samtec Teraspeed Consulting

Our RF Technical Group, together with our Full System Signal Integrity Engineers, can provide personal support for meeting your specific RF challenges, including 12G-SDI launch optimization or application-specific engineered solutions.

RF Technical Group

To learn more contact RFTechnicalGroup@samtec.com

Full System Signal Integrity

Samtec Teraspeed Consulting and Signal Integrity Group engineers help optimize and validate high-performance systems. Services are available at any level: from the early stages of the design process through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz.

Package Design & Materials
Bumpout / Ballout Optimization
Layout & Routing
Ballout Transition Structures
Material Recommendations
Modeling
High Bandwidth Full-Wave
Custom & Commercial Software
 
 
Simulation
Design Rules for Package & PCB Designs
Validate Implementation and Signaling Requirements for Critical Channels
Simulations via High-Performance Computing
Analysis
Package, PCB and System-Level Power Integrity
Package, PCB and System-Level Signal Integrity
 
Testing
Post Design Simulation & Measurements
Measurement of Test Structures for Signal Integrity / Power Integrity Optimization
Material Characterization
Validation
Validation Platform Engineering
Connectors, Packages & Devices
Characterization at Frequencies to 67 GHz
  • * ExaMAX® is a trademark of AFCI.
  • * XCede® is a registered trademark of Amphenol Corporation.
  • * PCI-SIG®, PCI Express® and PCIe® design marks are registered trademarks and/or service marks of PCI-SIG.
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