可实现下一代系统需求的解决方案和支持


随着数据速率要求接近并超过56 Gbps,开发人员面临着平衡增加吞吐量、可扩展性和密度需求以及功耗、信号完整性、成本和上市时间等问题的挑战。凭借行业领先的互连专业知识,以及全面的系统优化服务和支持,包括可用于众多高性能互连系统的庞大的开发平台和特征描述套件库,Samtec帮助应对下一代数据速率要求所带来的挑战。

系统优化Gbps
系统优化金属圈
系统优化金属圈

高速
互连
专业知识

系统优化金属圈
系统优化金属圈

高性能
SI评估
测试与验证

系统优化金属圈
系统优化金属圈

在线
设计工具
和资源

Samtec 技术中心

由Silicon-to-Silicon™的高性能系统设计和支持


系统优化SIG

信号完整性小组和SAMTEC TERASPEED咨询

全通道信号和电源完整性分析、测试和验证服务
sig@samtec.com

系统优化SOG

SAMTEC OPTICAL GROUP

微型光学引擎和组件的研发、设计、开发和支持
optics@samtec.com

系统优化AID

先进的
互连设计

高精度冲压、电镀、成型和自动装配
asg@samtec.com

系统优化SME

Samtec微电子小组

玻璃芯技术 (GCT),下一代2.5D / 3D解决方案,先进的IC封装和组装
sme@samtec.com

系统优化HSC1

高速电缆小组

内部研发和制造精密挤压电缆和组件
hdr@samtec.com

系统优化射频

精确射频小组

射频互连设计和开发专业知识,测试频率为 65 GHz
rftechnicalgroup@samtec.com

评估和开发

Samtec开发板和SI评估套件有助于简化设计流程并缩短产品上市时间,适用于我们的许多高性能连接器套件和标准高速电缆组件配置。还可定制用于特定应用的评估套件。


Samtec SI评估套件目前可用于以下产品;其他套件也正在开发中。请联系kitsandboards@samtec.com以获取最新列表或讨论您的评估要求。

  • ExaMAX®高速背板连接器
  • Flyover® QSFP28双倍密度
  • Flyover® QSFP28
  • AcceleRate®电缆
  • NovaRay™极致密度阵列
  • 高速微型插卡式连接器
  • LP Array™低剖面阵列
  • Z-Ray®低剖面插入器

请访问samtec.com/kits以了解更多详情。

DCH系统优化
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