ExaMAX® high-speed backplane system for 56 Gbps PAM4 performance, XCede® HD high-density backplane solutions for design flexibility and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.
High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.
Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.
ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.
Micro backplane systems include high-speed edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects in a variety of pitch, orientation and termination.
Rugged Edge Rate® contact systems optimized for signal integrity performance.
High-speed edge card sockets with rugged Edge Rate® contacts.
1.00 mm pitch high-speed edge card sockets with rugged Edge Rate® contacts and misalignment mitigation.
Micro pitch edge card sockets in a variety of centerlines and orientations.
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.
Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.
These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.