Backplane Connectors / Micro Backplane
These Backplane Connectors and systems such as the ExaMAX® high-speed backplane system offer 56 Gbps PAM4 performance. XCede® HD high-density backplane solutions offer design flexibility and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.
High-Speed Backplane Systems
High-Speed Backplane Systems
Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.
XCede® HDXCede® HD High-Density Backplane System
Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.
Features
- Small form factor provides significant space savings
- Modular design provides flexibility in applications
- High-performance system
- High-density backplane system – up to 84 differential pairs per linear inch
- 1.80 mm column pitch
- 3-, 4- and 6-pair designs
- 4, 6 or 8 columns
- 12 - 48 pairs
- Multiple signal/ground pin staging options
- Integrated power, guidance, keying and side walls available
- 85 Ω and 100 Ω options
- Three levels of sequencing enable hot plugging
- Cost-effective designs available for low-speed applications
ExaMAX®ExaMAX® High-Speed Backplane System
ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.
Features
- Enables 56 Gbps PAM4 electrical performance on 2.00 mm column pitch
- Allows designers to optimize density or minimize board layer count
- Two reliable points of contact, even when subjected to angled mating
- Meets Telcordia GR-1217 CORE specification
- Individual signal wafers with staggered differential pair design; 24 - 72 pairs (board connectors) and 16 - 96 pairs (cable assemblies)
- One-piece embossed ground structure on each signal wafer to reduce crosstalk
- Lowest mating force on the market: 0.36 N max per contact
- Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
- Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
- Stub free mating
- Press-fit termination
- Power and Guide Modules available
Micro Backplane Systems
Micro Backplane Systems
Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. Micro backplane systems include high-speed edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects in a variety of pitch, orientation and termination.
Edge Rate®Edge Rate® Rugged, High-Speed High Cycle Connector Strips
Rugged Edge Rate® high speed, high cycle connector strips with contact systems optimized for signal integrity performance.
Features
- Edge Rate® contacts optimized for signal integrity performance
- 1.5 mm contact wipe
- Robust when "zippered" during unmating
- Up to 56 Gbps PAM4 performance
- 0.50 mm, 0.635 mm or 0.80 mm pitch systems
- Stack heights from 5 mm to 18 mm
- Extremely slim 2.5 mm body width on 0.635 mm pitch system
- 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
High-Speed 0.80 mm Pitch Edge Card ConnectorsGenerate™ High-Speed 0.80 mm Pitch Edge Card Connectors
Generate™ high-speed edge card connectors / sockets with rugged Edge Rate® contacts on a micro 0.80 mm pitch.
Features
- 56 Gbps PAM4 performance
- Rugged Edge Rate® contacts
- Card slot: 1.60 mm (.062")
- Single-ended and differential pairs
- Vertical, right-angle, edge mount
- Optional board locks and cable latching features
- Optional weld tab for mechanical strength
- RU8 system for elevated board stacking
1.00 mm Pitch High-Speed Edge Card1.00 mm Pitch High-Speed Edge Card
1.00 mm pitch high-speed edge card sockets with rugged Edge Rate® contacts and misalignment mitigation.
Features
- Performance to 14 GHz / 28 Gbps
- Rugged Edge Rate® contacts decrease crosstalk and increase cycle life
- 20 – 140 total pins
- Accepts .062" (1.60 mm) thick cards
- Optional weld tab and alignment pin
Micro Edge Card SystemsMicro Edge Card Systems
Micro pitch edge card sockets in a variety of centerlines and orientations.
Features
- Performance to 56 Gbps NRZ
- Solutions for .062" (1.60 mm), and .093" (2.36 mm) thick cards
- Choice of pitch: 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, 2.00 mm
- Available in surface mount and through-hole
- Vertical, right-angle, edge mount
Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.
Features
- Performance to 28 Gbps
- Rugged Edge Rate® contacts
- Integral ground/power plane
- Up to 156 positions
- Slim footprint (less than 5.00 mm wide)
Q Strip®Q Strip® High-Speed Interconnects
Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential
Features
- Performance: Up to 14.0 GHz /28 Gbps
- Integral ground/power plane
- Connector to connector retention options
- Vertical, perpendicular, and coplanar applications
- Contacts: Up to 180 I/Os
- Stack height: 5 mm - 25 mm
Q2™Q2™ Rugged/High-Speed Interconnects
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.
Features
- Performance to 25 Gbps NRZ
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
- Power combo option
- Contacts: Up to 208 I/Os
- Stack height: 10.00 mm - 16.00 mm
SEARAY™SEARAY™ High-Density Open-Pin-Field Arrays
These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.
Features
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- 56 Gbps PAM4 performance
- Up to 560 I/Os in open pin field design
- 1.27 mm (.050") pitch
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- 7 - 18.5 mm stack heights
- Vertical, right-angle, press-fit
- Elevated systems to 40 mm
- 85 ohm systems
- Standards: VITA 47, VITA 57.1 FMC, VITA 57.4 FMC+, VITA 74 VNX, PISMO™ 2
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
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