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Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 56 Gbps PAM4 performance, XCede® HD high-density backplane solutions for design flexibility and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

High-Speed Backplane Systems

High-Speed Backplane Systems

High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.


XCede® HDXCede® HD High-Density Backplane System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

Features
  • Small form factor provides significant space savings
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
Series
V
  • HDTF
  • HDTM
  • BSP
  • HPTS
XCede® HD

ExaMAX®ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.

Features
  • Enables 56 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
  • Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
Series
V
  • EBTM
  • EBTM-RA
  • EBTF-RA
  • EBDM-RA
  • EBCM
  • EBCF
  • EGBM
  • EGBF
  • EPTT
  • EPTS
  • EBCL
  • EBCB
ExaMAX®

Micro Backplane Systems

Micro Backplane Systems

Micro backplane systems include high-speed edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects in a variety of pitch, orientation and termination.


Edge Rate®Edge Rate® Rugged, High-Speed Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • 1.5 mm contact wipe
  • Robust when "zippered" during unmating
  • Up to 56 Gbps PAM4 performance
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • Stack heights from 5 mm to 18 mm
  • Extremely slim 2.5 mm body width on 0.635 mm pitch system
  • 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Series
V
  • ERM8
  • ERF8
  • ERM8-RA
  • ERF8-RA
  • ERM8-EM
  • ERF8-EM
  • ERM5
  • ERF5
  • ERF5-RA
  • ERF6
  • ERM6
Edge Rate®

High-Speed Edge CardHigh-Speed Edge Card

High-speed edge card sockets with rugged Edge Rate® contacts.

Features
  • Performance: Up to 18.5 GHz / 37 Gbps
  • Rugged Edge Rate® contacts
  • Card slot: 1.60 mm (.062")
  • Single-ended and differential pairs
  • Vertical, right-angle, edge mount
  • Optional board locks and cable latching features
  • Optional weld tab for mechanical strength
  • RU8 system for elevated board stacking
Series
V
  • HSEC8-DV
  • HSEC8-RA
  • HSEC8-EM
  • HSEC8-PV
  • RU8
  • HSC8
High-Speed Edge Card

1.00 mm Pitch High-Speed Edge Card1.00 mm Pitch High-Speed Edge Card

1.00 mm pitch high-speed edge card sockets with rugged Edge Rate® contacts and misalignment mitigation.

Features
  • Performance up to 14 GHz / 28 Gbps
  • Rugged Edge Rate® contacts decrease crosstalk and increase cycle life
  • 20 – 140 total pins
  • Accepts .062" (1.60 mm) thick cards
  • Optional weld tab and alignment pin
Series
V
  • HSEC1-DV
1.00 mm Pitch High-Speed Edge Card

Micro Edge Card SystemsMicro Edge Card Systems

Micro pitch edge card sockets in a variety of centerlines and orientations.

Features
  • Performance: Up to 14.5 GHz / 29 Gbps
  • Solutions for .062" (1.60 mm), and .093" (2.36 mm) thick cards
  • Choice of pitch: 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, 2.00 mm
  • Available in surface mount and through-hole
  • Vertical, right-angle, edge mount
Series
V
  • MEC8-DV
  • MEC8-VP
  • MEC8-RA
  • MEC8-EM
  • MEC6-DV
  • MEC6-RA
  • MEC1
  • MEC1-RA
  • MEC1-EM
  • MECF-DV
  • MEC2-DV
  • MEC5-RA
  • MEC5-DV
Micro Edge Card Systems

Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects

Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features
  • Performance: Up to 15 GHz / 30 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Series
V
  • QRF8
  • QRM8
  • QRF8-DP
  • QRF8-RA
  • QRM8-DP
  • QRM8-RA
Q Rate®

Q Strip®Q Strip® High-Speed Interconnects

Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential

Features
  • Performance: Up to 14.0 GHz /28 Gbps
  • Integral ground/power plane
  • Connector to connector retention options
  • Vertical, perpendicular, and coplanar applications
  • Contacts: Up to 180 I/Os
  • Stack height: 5.00 mm - 25.00 mm
Series
V
  • QSH
  • QTH
  • QSS
  • QTS
  • QSE
  • QTE
  • QTS-RA
  • QSS-RA
Q Strip®

Q2™Q2™ Rugged/High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features
  • Performance: Up to 8.5 GHz / 17 Gbps
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power and RF ends options
  • Contacts: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Series
V
  • QFS
  • QMS
  • QFS-DP
  • QMS-DP
  • QFS-RA
  • QMS-RA
  • QFS-EM
  • QMS-EM
  • QFS-PC
  • QMS-PC
  • QFSS
  • QMSS
  • QFSS-DP
  • QMSS-DP
  • QFSS-PC
  • QMSS-PC
  • QFSS-DP-PC
  • QMSS-DP-PC
Q2™

SEARAY™SEARAY™ High-Density Open-Pin-Field Arrays

These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.

Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • Up to 500 I/Os in open pin field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 17 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Series
V
  • SEAF
  • SEAM
  • SEAF-RA
  • SEAM-RA
  • SEAMP
  • SEAFP
  • SEAFP-RA
  • SEAR
  • SEAMI
  • JSO
SEARAY™

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