ExaMAX® high-speed backplane system enables 28 Gbps performance with a migration path to 56 Gbps and allows designers to optimize density or minimize board layer count. This system features two reliable points of contact, one-piece embossed ground structure on each signal wafer to reduce crosstalk and the lowest mating force on the market.
ExaMAX®ExaMAX® High-Speed Backplane Connector System
ExaMAX® high-speed backplane interconnects deliver 28 Gbps electrical performance while offering a migration path to 56 Gbps.
Enables 28 Gbps electrical performance on 2.00 mm column pitch
Allows designers to optimize density or minimize board layer count
Two reliable points of contact, even when subjected to angled mating
Meets Telcordia GR-1217 CORE specification
Individual signal wafers with staggered differential pair design; 72 or 40 pairs
One-piece embossed ground structure on each signal wafer to reduce crosstalk
Lowest mating force on the market: 0.36 N max per contact
Stub free mating
Press fit termination
Power and Guide Modules available
ExaMAX® 2.00 mm Direct Mate Orthogonal Header
ExaMAX® 2.00 mm Right-Angle Receptacle
ExaMAX® 2.00 mm Vertical Header Assembly
ExaMAX® Socket Guide Module
ExaMAX® Terminal Guide Module
ExaMAX® Socket Power Module
ExaMAX® Terminal Power Module
Micro Backplane Systems
Micro Backplane Systems
Micro backplane systems include high-speed edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects in a variety of pitch, orientation and termination.
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