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High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.
XCede® HDXCede® HD High-Performance, High-Density Backplane Connector System
Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.
Features
Small form factor provides significant space savings
Modular design provides flexibility in applications
High-performance system
High-density backplane system – up to 84 differential pairs per linear inch
1.80 mm column pitch
3-, 4- and 6-pair designs
4, 6 or 8 columns
12 - 48 pairs
Multiple signal/ground pin staging options
Integrated power, guidance, keying and side walls available
85 Ω and 100 Ω options
Three levels of sequencing enable hot plugging
Cost-effective designs available for low-speed applications
Series
HDTF
HDTM
HDTF
XCede® HD 1.80 mm Right-Angle Backplane Receptacle
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HDTM
XCede® HD 1.80 mm Vertical Backplane Header
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ExaMAX®ExaMAX® High-Speed Backplane Connector System
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