High-Speed Backplane Systems

ExaMAX® high-speed backplane system enables 28 Gbps performance with a migration path to 56 Gbps and allows designers to optimize density or minimize board layer count. This system features two reliable points of contact, one-piece embossed ground structure on each signal wafer to reduce crosstalk and the lowest mating force on the market.


ExaMAX®ExaMAX® High-Speed Backplane Connector System

ExaMAX® high-speed backplane interconnects deliver 28 Gbps electrical performance while offering a migration path to 56 Gbps.

Features
  • Enables 28 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
Series
V
  • EBDM-RA
  • EBTF-RA
  • EBTM
  • EGBF
  • EGBM
  • EPTS
  • EPTT
ExaMAX®

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