High-Speed Backplane Systems

ExaMAX® high-speed backplane system enables 28 Gbps performance with a migration path to 56 Gbps and allows designers to optimize density or minimize board layer count. This system features two reliable points of contact, one-piece embossed ground structure on each signal wafer to reduce crosstalk and the lowest mating force on the market.


XCede® HDXCede® HD High-Performance, High-Density Backplane Connector System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

Features
  • Small form factor provides significant space savings
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Multiple signal/ground pin staging options
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
Series
V
  • HDTF
  • HDTM
XCede® HD

ExaMAX®ExaMAX® High-Speed Backplane Connector System

ExaMAX® high-speed backplane interconnects deliver 28 Gbps electrical performance while offering a migration path to 56 Gbps.

Features
  • Enables 28 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
Series
V
  • EBDM-RA
  • EBTF-RA
  • EBTM
  • EGBF
  • EGBM
  • EPTS
  • EPTT
ExaMAX®

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Kevin Burt, of the Samtec Optical Group, explains another one of the several demos that Samtec presented at OFC 2017.  In this demo, four GT 28 Gbps transceiver signals are generated by an FPGA and launched mid-board from a FireFly™ 28 G x4 optical connector system. These 28 Gbps...
Our friend Eric Bogatin wrote a paper for DesignCon 2017 entitled “New Characterization Technique for Glass-Weave Skew.”  He wrote a summary article of the paper in Signal Integrity Journal. Since many of our readers strive to optimize their signal transmission path, I thought it...
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