High-Speed Backplane Systems

ExaMAX® high-speed backplane system enables 28 Gbps performance with a migration path to 56 Gbps and allows designers to optimize density or minimize board layer count. This system features two reliable points of contact, one-piece embossed ground structure on each signal wafer to reduce crosstalk and the lowest mating force on the market.


XCede® HDXCede® HD High-Performance, High-Density Backplane Connector System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

Features
  • Small form factor provides significant space savings
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
Series
V
  • HDTF
  • HDTM
XCede® HD

ExaMAX®ExaMAX® High-Speed Backplane Connector System

ExaMAX® high-speed backplane interconnects deliver 28 Gbps electrical performance while offering a migration path to 56 Gbps.

Features
  • Enables 28 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
Series
V
  • EBDM-RA
  • EBTF-RA
  • EBTM
  • EGBF
  • EGBM
  • EPTS
  • EPTT
ExaMAX®

SEARAY™ is a family of high speed, high density connectors. SEARAY gives designers tons of design flexibility, much more than any other array product in the connector industry. DESIGN FLEXIBILITY SEARAY is on a 1.27 mm X 1.27 mm grid. This is an open pin field grid array, which m...
Samtec’s FFSD, FFMD Series are micro-pitch, high reliability, high cycle IDC cable assemblies. TIGER EYE™ CONTACT The connector systems incorporate the Tiger Eye™ contact. Tiger Eye is a rugged contact for micro pitch interconnects; it is ideal for high reliability and high matin...
In this short video, Steve Groothuis, Chief Technology Officer for Samtec Microelectronics, explains Glass Core Technology (GCT), why it matters in advanced substrate packaging, and the solutions it provides. GCT is a proprietary process that leverages the performance benefits of...
Since we released Samtec Solutionator 2.0, our updated parametric search tool, the most requested feature from users has been the ability to export the results of the data grid. We’re happy to announce that with our most recent update, you can now export up to 1,000 rows of data ...
Interconnects for the military/aerospace industry are used in a variety of applications, including communication and navigation equipment, radar, airborne, marine and space guidance control, and electronic warfare, to name a few. While Samtec products are used in commercial appli...
View Full Site