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ExaMAX® high-speed backplane system enables 28 Gbps performance with a migration path to 56 Gbps and allows designers to optimize density or minimize board layer count. This system features two reliable points of contact, one-piece embossed ground structure on each signal wafer to reduce crosstalk and the lowest mating force on the market.
XCede® HDXCede® HD High-Performance, High-Density Backplane Connector System
Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.
Features
Small form factor provides significant space savings
Modular design provides flexibility in applications
High-performance system
High-density backplane system – up to 84 differential pairs per linear inch
1.80 mm column pitch
3-, 4- and 6-pair designs
4, 6 or 8 columns
12 - 48 pairs
Multiple signal/ground pin staging options
Integrated power, guidance, keying and side walls available
85 Ω and 100 Ω options
Three levels of sequencing enable hot plugging
Cost-effective designs available for low-speed applications
Series
HDTF
HDTM
HDTF
XCede® HD 1.80 mm Right-Angle Backplane Receptacle
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HDTM
XCede® HD 1.80 mm Vertical Backplane Header
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ExaMAX®ExaMAX® High-Speed Backplane Connector System
ExaMAX® high-speed backplane interconnects deliver 28 Gbps electrical performance while offering a migration path to 56 Gbps.
Features
Enables 28 Gbps electrical performance on 2.00 mm column pitch
Allows designers to optimize density or minimize board layer count
Two reliable points of contact, even when subjected to angled mating
Meets Telcordia GR-1217 CORE specification
Individual signal wafers with staggered differential pair design; 72 or 40 pairs
One-piece embossed ground structure on each signal wafer to reduce crosstalk
Lowest mating force on the market: 0.36 N max per contact
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