High-Speed Backplane Systems

High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.


XCede® HDXCede® HD High-Performance, High-Density Backplane Connector System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

Features
  • Small form factor provides significant space savings
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
Series
V
  • HDTF
  • HDTM
  • HPTS
XCede® HD

ExaMAX®ExaMAX® High-Speed Backplane Connector System

ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.

Features
  • Enables 56 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
Series
V
  • EBDM-RA
  • EBTF-RA
  • EBTM
  • EGBF
  • EGBM
  • EPTS
  • EPTT
ExaMAX®

Samtec is expanding its line of ExaMAX® high speed backplane connectors. The new system is a direct mate orthogonal (DMO) configuration. These products were recently on display at SC17 in Denver. In the video above, Jonathan Sprigler, Samtec’s Backplane Product Manager, tells us ...
This time of year is typically set aside for preparation, and this year is no different. We spent November working on a couple of major upgrades to prepare for releases in 2018, one with the way we handle quotes in My Samtec, and the other with how we handle the checkout experien...
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As with any product development, ASIC designers aim to quicken time to market and reduce unnecessary design cycles. Designing full-custom ASICs comes with many benefits but leveraging the flexibility, configurability and high-performance of FPGAs has become a preferred method for...
The 28 Gbps Product Demonstrator is an active system that showcases a variety of Samtec interconnect products at 28 Gbps and beyond. The Demonstrator was up and running at SC17, and Anthony Fellbaum was there also, where he walked us through the demo. Real World 28 Gbps This demo...
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