Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. Micro backplane systems include high-speed edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects in a variety of pitch, orientation and termination.
Rugged Edge Rate® contact systems optimized for signal integrity performance.
Generate™ high-speed edge card sockets with rugged Edge Rate® contacts on a micro 0.80 mm pitch.
1.00 mm pitch high-speed edge card sockets with rugged Edge Rate® contacts and misalignment mitigation.
Micro pitch edge card sockets in a variety of centerlines and orientations.
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.
Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.
These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.