Micro Backplane Systems

Micro backplane systems include high-speed edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects in a variety of pitch, orientation and termination.


Edge Rate®Edge Rate® Rugged, High-Speed Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
Edge Rate®

High-Speed Edge CardHigh-Speed Edge Card

High-speed edge card sockets with rugged Edge Rate® contacts.

Features
  • Performance: Up to 18.5 GHz / 37 Gbps
  • Rugged Edge Rate® contacts
  • Card slot: 1.60 mm (.062")
  • Single-ended and differential pairs
  • Vertical, right-angle, edge mount
  • Optional board locks and cable latching features
  • Optional weld tab for mechanical strength
  • RU8 system for elevated board stacking
Series
V
  • HSC8
  • HSEC8-DV
  • HSEC8-EM
  • HSEC8-PV
  • HSEC8-RA
  • RU8
High-Speed Edge Card

1.00 mm Pitch High-Speed Edge Card1.00 mm Pitch High-Speed Edge Card

1.00 mm pitch high-speed edge card sockets with rugged Edge Rate® contacts and misalignment mitigation.

Features
  • Performance up to 14 GHz / 28 Gbps
  • Rugged Edge Rate® contacts decrease crosstalk and increase cycle life
  • 20 – 140 total pins
  • Accepts .062" (1.60 mm) thick cards
  • Optional weld tab and alignment pin
Series
V
  • HSEC1-DV
1.00 mm Pitch High-Speed Edge Card

Micro Edge Card SystemsMicro Edge Card Systems

Micro pitch edge card sockets in a variety of centerlines and orientations.

Features
  • Performance: Up to 14.5 GHz / 29 Gbps
  • Solutions for .062" (1.60 mm), and .093" (2.36 mm) thick cards
  • Choice of pitch: 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, 2.00 mm
  • Available in surface mount and through-hole
  • Vertical, right-angle, edge mount
Series
V
  • BEC5C
  • MEC1
  • MEC1-EM
  • MEC1-RA
  • MEC2-DV
  • MEC5-DV
  • MEC5-RA
  • MEC6-DV
  • MEC6-RA
  • MEC8-DV
  • MEC8-EM
  • MEC8-RA
  • MEC8-VP
  • MECF-DV
Micro Edge Card Systems

Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects

Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features
  • Performance: Up to 15 GHz / 30 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Series
V
  • QRF8
  • QRF8-DP
  • QRF8-RA
  • QRM8
  • QRM8-DP
  • QRM8-RA
Q Rate®

Q Strip®Q Strip® High-Speed Interconnects

Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential

Features
  • Performance: Up to 14.0 GHz /28 Gbps
  • Integral ground/power plane
  • Connector to connector retention options
  • Vertical, perpendicular, and coplanar applications
  • Contacts: Up to 180 I/Os
  • Stack height: 5.00 mm - 25.00 mm
Series
V
  • QSE
  • QSH
  • QSS
  • QSS-RA
  • QTE
  • QTH
  • QTS
  • QTS-RA
Q Strip®

Q2™Q2™ Rugged/High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features
  • Performance: Up to 8.5 GHz / 17 Gbps
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power and RF ends options
  • Contacts: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Series
V
  • QFS
  • QFS-DP
  • QFS-EM
  • QFS-PC
  • QFS-RA
  • QFSS
  • QFSS-DP
  • QFSS-DP-PC
  • QFSS-PC
  • QMS
  • QMS-DP
  • QMS-EM
  • QMS-PC
  • QMS-RA
  • QMSS
  • QMSS-DP
  • QMSS-DP-PC
  • QMSS-PC
Help Me Choose?
Q2™

SEARAY™SEARAY™ High-Density Open Pin Field Arrays

These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • Up to 500 I/Os in open pin field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 17 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Series
V
  • JSO
  • SEAF
  • SEAFP
  • SEAFP-RA
  • SEAF-RA
  • SEAM
  • SEAMI
  • SEAMP
  • SEAM-RA
  • SEAR
  • UBPS
  • UBPT
Help Me Choose?
SEARAY™

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Chris Shelly, Samtec’s RF/SI Modeling Engineer, walks us through one of two 12G SDI live demonstrations at NAB 2017. This product demonstration showcases live Return Loss testing of different connectors series per the SMPTE ST-2082-1 12G SDI single channel 4K /UHD requirements.  ...
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