NovaRay® 112 Gbps PAM4 Micro Rugged Backplane System

NovaRay® Micro Rugged Backplane system combines ultra-high density with an offset footprint for optimal signal integrity performance to 112 Gbps PAM4.

Family Overview

NovaRay® Micro Rugged Backplane system supports blind mate applications with optional guidance and keying, plus standard weld tabs for a secure connection to the board. The ultra-high density design allows for up to 128 differential pairs in a single connector with configurable signal banks for design flexibility. For performance up to 112 Gbps PAM4, the trusted NovaRay® wafer design eliminates intra-pair skew along with large continuous ground blades between and surrounding the differential pairs, which remove resonances.

NovaRay® Micro Rugged Backplane

Features

  • Ultra-high density with up to 128 differential pairs in a single connector

  • 56 Gbps NRZ/112 Gbps PAM4 performance per channel

  • Supports blind mate applications

  • Surface mount for better density and performance

  • Offset footprint for optimum signal integrity

  • Flyover® cable assembly in design

NovaRay® Backplane Features

Downloads & Resources

Literature

High-Speed Cable Interconnect Solutions Guide

High-Speed Cable Interconnect Solutions Guide

Download PDF

Products

NVBF

IN DEVELOPMENT: 0.80 mm NovaRay® Micro Rugged Backplane Vertical Socket
Features
  • Ultra-high density with up to 128 differential pairs in a single connector

  • 56 Gbps NRZ/112 Gbps PAM4 performance per channel

  • Supports blind mate applications

  • Surface mount for better density and performance

  • Offset footprint for optimum signal integrity

  • Flyover® cable assembly in design

  • Optional guidance and keying

  • Standard weld tabs for a secure connection to the board

Product Image for ARM6-

NVBM-RA

IN DEVELOPMENT: 0.80 mm NovaRay® Micro Rugged Backplane Right-Angle Header
Features
  • Ultra-high density with up to 128 differential pairs in a single connector

  • 56 Gbps NRZ/112 Gbps PAM4 performance per channel

  • Supports blind mate applications

  • Surface mount for better density and performance

  • Offset footprint for optimum signal integrity

  • Optional guidance and keying

  • Standard weld tabs for a secure connection to the board

Product Image for ARM6-

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