Samtec offers a comprehensive portfolio of high-performance interconnect solutions for semiconductor and computing applications, including artificial intelligence/machine learning; prototype, development, and evaluation; semiconductor manufacturing; quantum computing; and high-performance computing/supercomputing.
Samtec's world-renowned team of technical experts, its suite of online design tools, and world-class Sudden Service® are available to support any computer and semiconductor application, from design to production.
The ExaMAX® backplane system offers high-density and design flexibility to fit a variety of applications, including Flyover® cable supporting 112 Gbps PAM4 and board-to-board supporting 64 Gbps PAM4 (32 Gbps NRZ).
Features
Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Samtec's XCede® HD high-density backplane system features a small form factor ideal for density-critical applications, and a modular design for flexibility and customizable solutions.
Features
Small form factor provides significant space savings
Modular design provides flexibility in applications
High-density backplane system – up to 84 differential pairs per linear inch
1.80 mm column pitch
3-, 4- and 6-pair designs
4, 6 or 8 columns
12–48 pairs
Up to a 3.00 mm contact wipe on signal pins
Multiple signal/ground pin staging options
Integrated power, guidance, keying and side walls available
85 Ω and 100 Ω options
Three levels of sequencing enable hot plugging
Cost-effective designs available for low-speed applications
Samtec's FireFly™ Micro Flyover System™ embedded and rugged optical transceivers take data connection "off board" for up to 28 Gbps per lane with a path to 112 Gbps PAM4 via optical cable at greater distances, or copper for cost optimization.
Features
High-speed performance to 28 Gbps per lane
x4 and x12 designs
Interchangeability of copper and optical
Variety of integral heat sink and End 2 options
Micro rugged two-piece connector
Extended temperature and PCIe®-Over-Fiber solutions
E.L.P.™ products are tested to rigorous standards, which evaluate contact resistance in simulated storage and field conditions.
10 year Mixed Flowing Gas (MFG)
High Mating Cycles (250 to 2,500)
Certain plating and/or contact options will apply
For complete details on Samtec's E.L.P.™ program, a list of qualifying products and test results, visit samtec.com/ELP or email the Customer Engineering Support Group at [email protected]
Severe Environment Testing is a Samtec initiative to test our products beyond typical industry standards and specifications, many set forth by common requirements for rugged industries. Several of our products undergo additional testing to ensure they are more than suitable for industrial, military, automotive, space, and other extreme applications.
TESTING INCLUDES:
VITA 47.1 Module Insertions
VITA 47.3 Humidity
VITA 47.1 Operating Shock Class OS2
VITA 47.1 Vibration Class VS3
Exceeds VITA 47.1 Temperature Cycling Class C4
Exceeds VITA 47.1 Non-Operating Temperature Class C4
VITA 47.1 Electrostatic Discharge Resistance
Exceeds VITA 47.1 Altitude for DWV
Samtec's SET products are approved for NASA Class D missions that require high-reliability, quick-turn and cost-effective solutions for LEO satellites, SmallSats, CubeSats and other space exploration applications.
Samtec also utilizes NASA outgassing data to determine if certain products meet NASA's ASTM E595-77/84/90 test requirements. Visit outgassing.nasa.gov for data.
