LPAF

.050" LP Array™高速高密度轻薄型端子开放式端子阵列,插座

配置零件

特色
  • 轻薄型4 mm、4.5 mm、5 mm堆叠高度
  • 多达320个I/O口
  • 4、6和8排设计
  • .050"(1.27 mm)间距
  • 双梁端子系统
  • 焊接压接针脚,易于加工
  • 性能高达18.5 GHz / 37 Gbps
  • 正在申请专利的Final Inch®技术
  • 56 Gbps PAM4性能
特色
  • 轻薄型4 mm、4.5 mm、5 mm堆叠高度
  • 多达320个I/O口
  • 4、6和8排设计
  • .050"(1.27 mm)间距
  • 双梁端子系统
  • 焊接压接针脚,易于加工
  • 性能高达18.5 GHz / 37 Gbps
  • 正在申请专利的Final Inch®技术
  • 56 Gbps PAM4性能
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