High-speed optical and low skew pair copper I/O assemblies with rugged latching systems and shielded EMI protection for rugged, panel-to-panel applications. Assemblies include HyperTransport™ HT 3.1 performance on the industry’s densest I/O system, micro pitch design for board space savings, and SFP+ jumpers up to 20 Gbps data transmission.
These direct attach flyover QSFP cable assemblies improve signal integrity and increase signal path length at higher data rates.
NovaRay® I/O uses Flyover® cable technology to route up to 3584 Gbps PAM4 aggregate data from the IC package to the panel and beyond.
URSA™ I/O features a hyperboloid-type contact for extreme reliability and high mating cycles in ultra rugged applications with EMI protection.
Future-proof system with interchangeability of FireFly™ copper and optical using the same micro connector system for up to 28 Gbps per lane.
Rugged high-speed cable systems feature a positive latching system and support multiple protocols.
Ultra high-density, high-speed cable system with HyperTransport™ HT3.1 performance, designed for rugged applications and EMI protection.
Samtec's SFP+ system includes a panel mounted connector and jumper cable for high-speed applications.
Samtec’s USB systems include standard, rugged, and sealed USB Type A, USB Type B, Type AM, or Mini USB 2.0 interfaces with choice of interface type.