低背型デュアルワイプ ソケット、1.00mmピッチ


CLMシリーズは堅牢で信頼性に優れたプリント基板実装ソケットです。トップエントリーとボトムエントリーのアプリケーションに適したCLMは、SamtecのTiger Claw™デュアルワイプ コンタクトシステムを使用し、「パススルー」式コンタクト配置を実現します。


  • 最大100極
  • コストを削減できる金めっき加工あり
  • 低背型デュアルワイプTiger Claw™コンタクト
  • テープおよびリールパッケージのオプションあり


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