LPAM

製品仕様
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.050" LP Array™ハイスピード 高密度 低背型オープンピンフィールド アレー、ターミナル

rohsロゴ

構成部品番号
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特徴

  • 低背型の4 mm、4.5 mm、5 mmスタック高さ
  • 最大400 I/O
  • 4列、6列、8列設計
  • .050"(1.27 mm)ピッチ
  • デュアルビーム コンタクト システム
  • 作業を軽減するはんだ圧着終端実装
  • 56 Gbps PAM4のパフォーマンス
  • Analog Over Array™対応
仕様キット

安全なフォーム。スパムなし。

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