Si-Fly 112 Gbps PAM4, Low-Profile High-Density Cable System

Si-Fly 112 Gbps PAM4, Low-Profile High-Density Cable System

Si-Fly uses direct connect technology to elude the BGA and route signals directly from the silicon package through a long-reach cable.


FAMILY OVERVIEW

Samtec - Direct Connect to IC Package

The ultra-high density design and on-package direct connect technology of Samtec’s Si-Fly cable system enables speeds of 25.6 TB aggregate, with a path to 51.2 TB. The signal channel eludes the BGA, routing directly from the IC package through a long-reach cable offering 5x the reach of traditional PCB topologies.

FEATURES

Direct Connect to IC Package

Ultra-high density with direct connect to IC Package technology
Direct Connect

Extreme Channel Performance

Enabling 51.2 TB aggregate data rate by 2023
Extreme Channel Performance

~5x the reach, compared to traditional PCB

Copper Si-Fly 22-inch reach versus PCB 4.5-inch reach.

Si-Fly offers longer reach and better performance, compared to traditional PCB topology.

Signal Integrity

Long-reach comparison: Si-Fly versus Megtron 7 PCB

Measured at 112 Gbps PAM4 with IEEE 802.3cK allowable loss.

Test setup: click here

firefly easy mating

Samtec offers two Direct Connect on-package solutions:

  • FireFly (available now)
  • Si-Fly (in development)
solutions

DOWNLOADS

Literature

Si-Fly™ eBrochure

Si-Fly™ eBrochure

Get

Products

CPC

Copper Si-Fly™ Low-Profile, High-Density Cable System

Features
  • Si-Fly™ copper Flyover® cable assembly; optics on the roadmap
  • Direct attach to IC Package
  • Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
  • 112 Gbps PAM4 per lane
  • 5x the reach of traditional PCB solutions
  • Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
Copper Si-Fly™ Low-Profile, High-Density Cable System

CPI

Si-Fly™ Low-Profile, High-Density Interconnect

Features
  • Si-Fly™ copper Flyover® cable assembly; optics on the roadmap
  • Direct attach to IC Package
  • Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
  • 112 Gbps PAM4 per lane
  • 5x the reach of traditional PCB solutions
  • Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
Si-Fly™ Low-Profile, High-Density Interconnect

CONTACT SALES

First Name
Last Name
Email
Company
Industry
Estimate Annual Usage
Family
Message

Don't want to fill out a form?
Chat with a product expert directly.

.
We live in an age of digital technology, but it is easy to forget the importance of radio frequency (RF) transmission. Any device that transmits or receives its signals uses RF radiation to carry data. The physical infrastructure needed to transmit radio frequency signals uses co...
A new high speed cable system, which enables 112 Gbps PAM4 signaling, can be used in mid-board, mid-board-to-front-panel, and panel-to-panel applications. This video from DesignCon 2021 shows a live product demonstration with a Samtec NovaRay®, Flyover® Cable system operating at ...
Over the last few months, we have discussed some of the latest trends in the defence and aerospace industries to coincide with the publication earlier this year of Samtec Industrial Application page.  In these posts, we have looked at how Samtec technology is helping designers so...
The 21st century is a digital world. Sensors – from microphones to thermometers – convert real world analog signals in to the digital domain. The sensors and electronics community focuses on sensing, processing, connecting and analyzing necessary data to enable the digital experi...
The needs of the medical profession go beyond the safe conditions of the operating room and the hospital. Many patients are cared for in other environments – doctors’ offices, health centers and increasingly, in the home. This is especially true for patients who require long-term...