Si-Fly 112 Gbps PAM4, Low-Profile High-Density Cable System

Si-Fly 112 Gbps PAM4, Low-Profile High-Density Cable System

Si-Fly™ is Samtec’s lowest profile Flyover® cable solution capable of residing next to the chip or direct on the substrate.


FAMILY OVERVIEW

Si-Fly Family

The extremely low 3.8 mm profile allows Si-Fly™ to be placed adjacent to the IC package and under heat sinks or other cooling hardware for design flexibility. The high-density 8 or 16 pair configurations offer optimal solutions for routing 4 or 8 channels at 112 Gbps PAM4 data rates and are PCIe® 6.0 capable.

FEATURES

Ultra Low Profile

  • Up to 16 pairs in an incredibly low 3.8 mm profile
  • Minimum 8.4 mm height required for mating
Si-Fly Mating

Extreme Channel Performance

Enabling 51.2 TB aggregate data rate by 2023
Extreme Channel Performance

~5x the reach, compared to traditional PCB

Copper Si-Fly 22-inch reach versus PCB 4.5-inch reach.

Si-Fly offers longer reach and better performance, compared to traditional PCB topology.

Signal Integrity

Long-reach comparison: Si-Fly versus Megtron 7 PCB

Measured at 112 Gbps PAM4 with IEEE 802.3cK allowable loss.

Test setup: click here

firefly easy mating

Co-packaged Configuration

Co-packaged interconnect configuration for advanced 112G+ data rate requirements. This option eludes the BGA and routes signals from the silicon package through a long-reach cable, supporting 5x the signal reach of traditional PCB solutions.
Direct Connect

DOWNLOADS & RESOURCES

Literature

Si-Fly™ eBrochure

Si-Fly™ eBrochure

Get

Products

CPC

IN DEVELOPMENT: Copper Si-Fly™ Low-Profile, High-Density Cable System

Features
  • Ultra-low profile interconnect adjacent to the IC package
  • Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
  • 112 Gbps PAM4 per lane
  • PCIe® 6.0/CXL® 3.1 capable
  • 5x the reach of traditional PCB solutions
  • Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
IN DEVELOPMENT: Copper Si-Fly™ Low-Profile, High-Density Cable System

CPI

IN DEVELOPMENT: Si-Fly™ Low-Profile, High-Density Interconnect

Features
  • Ultra-low profile interconnect adjacent to the IC package
  • Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
  • 112 Gbps PAM4 per lane
  • PCIe® 6.0/CXL® 3.1 capable
  • 5x the reach of traditional PCB solutions
  • Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
IN DEVELOPMENT: Si-Fly™ Low-Profile, High-Density Interconnect

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