The extremely low 3.8 mm profile allows Si-Fly™ to be placed adjacent to the IC package and under heat sinks or other cooling hardware for design flexibility. The high-density 8 or 16 pair configurations offer optimal solutions for routing 4 or 8 channels at 112 Gbps PAM4 data rates.
Copper Si-Fly™ 22-inch reach versus PCB 4.5-inch reach.
Si-Fly™ offers longer reach and better performance, compared to traditional PCB topology.
Measured at 112 Gbps PAM4 with IEEE 802.3cK allowable loss.
Test setup: click here
IN DEVELOPMENT: Copper Si-Fly™ Low-Profile, High-Density Cable System
IN DEVELOPMENT: Si-Fly™ Low-Profile, High-Density Interconnect
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