The ultra-high density design and on-package direct connect technology of Samtec’s Si-Fly™ cable system enables speeds of 25.6 TB aggregate, with a path to 51.2 TB. The signal channel eludes the BGA, routing directly from the IC package through a long-reach cable offering 5x the reach of traditional PCB topologies.
Copper Si-Fly™ 22-inch reach versus PCB 4.5-inch reach.
Si-Fly™ offers longer reach and better performance, compared to traditional PCB topology.
Measured at 112 Gbps PAM4 with IEEE 802.3cK allowable loss.
Test setup: click here
Copper Si-Fly™ Low-Profile, High-Density Cable System
Si-Fly™ Low-Profile, High-Density Interconnect