Extreme Channel Performance
Enabling 51.2 TB aggregate data rate by 2023
Si-Fly™ 112 Gbps PAM4, Low-Profile High-Density Cable System
Si-Fly™ 112 Gbps PAM4, Low-Profile High-Density Cable System
FAMILY OVERVIEW
The extremely low 3.8 mm profile allows Si-Fly™ to be placed adjacent to the IC package and under heat sinks or other cooling hardware for design flexibility. The high-density 8 or 16 pair configurations offer optimal solutions for routing 4 or 8 channels at 112 Gbps PAM4 data rates.
FEATURES
Ultra Low Profile
- Up to 16 pairs in an incredibly low 3.4 mm profile
- Minimum 8.4 mm height required for mating
~5x the reach, compared to traditional PCB
Copper Si-Fly™ 22-inch reach versus PCB 4.5-inch reach.
Si-Fly™ offers longer reach and better performance, compared to traditional PCB topology.
Long-reach comparison: Si-Fly™ versus Megtron 7 PCB
Measured at 112 Gbps PAM4 with IEEE 802.3cK allowable loss.
Test setup: click here
Co-packaged Configuration
Co-packaged interconnect configuration for advanced 112G+ data rate requirements. This option eludes the BGA and routes signals from the silicon package through a long-reach cable, supporting 5x the signal reach of traditional PCB solutions.
CPC
IN DEVELOPMENT: Copper Si-Fly™ Low-Profile, High-Density Cable System
Features
- Si-Fly™ copper Flyover® cable assembly; optics on the roadmap
- Direct attach to IC Package
- Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
- 112 Gbps PAM4 per lane
- 5x the reach of traditional PCB solutions
- Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
CPI
IN DEVELOPMENT: Si-Fly™ Low-Profile, High-Density Interconnect
Features
- Si-Fly™ copper Flyover® cable assembly; optics on the roadmap
- Direct attach to IC Package
- Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
- 112 Gbps PAM4 per lane
- 5x the reach of traditional PCB solutions
- Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
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