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>Si-Fly 112 Gbps PAM4, Low-Profile High-Density Cable System

Si-Fly 112 Gbps PAM4, Low-Profile High-Density Cable System

Si-Fly uses direct connect technology to elude the BGA and route signals directly from the silicon package through a long-reach cable.


FAMILY OVERVIEW

Samtec - Direct Connect to IC Package

The ultra-high density design and on-package direct connect technology of Samtec’s Si-Fly cable system enables speeds of 25.6 TB aggregate, with a path to 51.2 TB. The signal channel eludes the BGA, routing directly from the IC package through a long-reach cable offering 5x the reach of traditional PCB topologies.

FEATURES

Direct Connect to IC Package

Ultra-high density with direct connect to IC Package technology
Direct Connect

Extreme Channel Performance

Enabling 51.2 TB aggregate data rate by 2023
Extreme Channel Performance

~5x the reach, compared to traditional PCB

Copper Si-Fly 22-inch reach versus PCB 4.5-inch reach.

Si-Fly offers longer reach and better performance, compared to traditional PCB topology.

Signal Integrity

Long-reach comparison: Si-Fly versus Megtron 7 PCB

Measured at 112 Gbps PAM4 with IEEE 802.3cK allowable loss.

Test setup: click here

firefly easy mating

Samtec offers two Direct Connect on-package solutions:

  • FireFly (available now)
  • Si-Fly (in development)
solutions

DOWNLOADS

Literature

Si-Fly™ eBrochure

Si-Fly™ eBrochure

Get

SERIES

CPC

Copper Si-Fly™ Low-Profile, High-Density Cable System

Features
  • Si-Fly™ copper Flyover® cable assembly; optics on the roadmap
  • Direct attach to IC Package
  • Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
  • 112 Gbps PAM4 per lane
  • 5x the reach of traditional PCB solutions
  • Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
Copper Si-Fly™ Low-Profile, High-Density Cable System

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