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Micro Pitch Systems

Board stacking interconnects on 0.40 mm, 0.50 mm, 0.635 mm, 0.80 mm, and 1.00 mm pitch with stack heights from 2.3 mm to 8 mm, vertical and right-angle orientations.


Micro Blade & BeamMicro Blade & Beam Ultra Fine Pitch Connectors

0.40 mm and 0.50 mm pitch Micro Blade & Beam ultra slim, ultra low profile connectors.

Features
  • Ultra fine pitch – 0.40 mm and 0.50 mm
  • Ultra low stack down to 2.00 mm
  • Slim body design for increased board space savings
  • Compatible with mPOWER™ for power/signal flexibility.
Series
V
  • ST4
  • SS4
  • SS5
  • ST5
  • SLH
  • TLH
Micro Blade & Beam

0.50 mm (.0197") Pitch Systems0.50 mm (.0197") Pitch Systems

Micro Blade & Beam systems in a variety of stack heights and orientations for flexible stacking.

Features
  • Basic blade & beam system
  • Low profile systems available
  • Available up to 300 I/Os
  • Several meet E.L.P.™ (Extended Life Product™) standards
  • Hermaphroditic connectors available
  • Various standard positions available up to 300
  • Vertical and right-angle styles available
Series
V
  • BTH
  • BTH-RA
  • BSH
  • BSH-RA
  • LTH
  • LSHM
  • BSH-EM
  • BTH-EM
  • LSH
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0.50 mm (.0197") Pitch Systems

0.635 mm (.025") Pitch Systems0.635 mm (.025") Pitch Systems

Basic Blade & Beam systems for flexible stacking.

Features
  • Basic blade & beam system
  • Low profile systems available
  • Available up to 300 I/Os
  • Several meet E.L.P.™ (Extended Life Product™) standards
  • Edge mount style available
Series
V
  • BTS
  • BSS
  • LSS
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0.635 mm (.025") Pitch Systems

0.80 mm (.0315") Pitch Systems0.80 mm (.0315") Pitch Systems

Flexible stacking interconnects available in a variety of contact systems, position counts, and low profile styles.

Features
  • Several contacts styles available
  • Low profile systems available
  • Available up to 300 I/Os
  • Hermaphroditic connectors available
  • Edge mount styles available
  • Several meet E.L.P.™ (Extended Life Product™) standards
Series
V
  • BTE
  • BSE
  • LSEM
  • ERM8
  • ERF8
  • CLE
  • TEM
  • SEM
  • FTE
  • AW
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0.80 mm (.0315") Pitch Systems

1.00 mm (.0394") Pitch Systems1.00 mm Pitch (.0394") Systems

Flexible stacking interconnects available in a variety of contact systems, position counts, and low profile styles.

Features
  • Various board stacking styles and options
  • Rugged options available
  • Up to 100 I/Os
  • Flexible stack height features
  • E.L.P.™ (Extended Life Product™) available
Series
V
  • BKS
  • BKT
  • FTMH
  • FTMH
  • CLM
  • MLE
  • MW
  • FTM
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1.00 mm (.0394") Pitch Systems

Floating Contact SystemFloating Contact System

High-speed floating contact system minimizes mating alignment errors.

Features
  • Provides 0.50 mm (.0197") float in X and Y directions
  • Ideal for multiple connector, board-to-board applications
  • Up to 60 floating contacts
  • Choice of body height and right-angle design
Series
V
  • FT5
  • FS5
Floating Contact System

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