Micro Rugged Board-to-Board

Micro pitch interconnects with high-reliability Tiger Eye™ and rugged Edge Rate® contact systems for high mating cycles, high-shock and vibration applications; integral ground/power plane interconnects with increased contact wipe and insertion depth for rugged applications; self-mating interconnects with mating/unmating forces 4-6x greater than typical micro pitch connectors.


Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
Edge Rate®

Rugged Tiger Eye™ SystemsRugged Tiger Eye™ Systems

These rugged, high-reliability, high-cycle interconnects feature Samtec's Tiger Eye™ contact system.

Features
  • High-reliability Tiger Eye™ three-finger BeCu contact system
  • Optional locking and latching systems for higher withdrawal force
  • Extended Life Product™ testing available
  • Standard and cost-saving designs
Series
V
  • FOLC
  • FSH
  • MOLC
  • S2M
  • SEM
  • SEML
  • SEMS
  • SFC
  • SFM
  • SFMC
  • SFMH
  • SFML
  • SMM
  • T2M
  • TEM
  • TEMS
  • TFC
  • TFM
  • TFML
  • TMM
Rugged Tiger Eye™ Systems

Q2™Q2™ Rugged/High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features
  • Performance: Up to 8.5 GHz / 17 Gbps
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power and RF ends options
  • Contacts: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Series
V
  • QFS
  • QFS-DP
  • QFS-EM
  • QFS-PC
  • QFS-RA
  • QFSS
  • QFSS-DP
  • QFSS-DP-PC
  • QFSS-PC
  • QMS
  • QMS-DP
  • QMS-EM
  • QMS-PC
  • QMS-RA
  • QMSS
  • QMSS-DP
  • QMSS-DP-PC
  • QMSS-PC
Q2™

Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects

Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features
  • Performance: Up to 15 GHz / 30 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Series
V
  • QRF8
  • QRF8-DP
  • QRF8-RA
  • QRM8
  • QRM8-DP
  • QRM8-RA
Q Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • JSO
  • LSEM
  • LSHM
  • LSS
Razor Beam™

Floating Contact SystemsFloating Contact System

High-speed floating contact system minimizes mating alignment errors.

Features
  • Provides 0.50 mm (.0197") float in X and Y directions
  • Ideal for multiple connectors on a board
  • Up to 60 floating contacts
  • Choice of body height and right-angle design
Series
V
  • FS5
  • FT5
Floating Contact Systems

One of several demonstrations at DesignCon 2017 shows the variety of Samtec interconnects supporting the Xilinx® Virtex® UltraScale+ FPGA VCU118 Development Kit.  Included in the kit is an FMC+ Active Loopback Card, which carries Samtec’s direct attach Flyover™ QSFP28. In the Fly...
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