High-power interconnects up to 60 A, available in small form factors and elevated designs with power blades or individually shrouded power pins.
Board-to-board power socket and terminal strips with individually shrouded contacts.
Standard and high-temp connector strips with Power Eye contacts for applications up to 15 A per pin.
Micro 2.00 mm pitch power blade interconnects designed for staging a combination power and signal/ground solution.
High-power systems for performance up to 58.7 A per contact.
A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.
High-power, low profile system.
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