Twinax Cables, Samtec Flyover® Systems for Next Gen Speeds

Twinax Cables, Samtec Flyover® Systems for Next Gen Speeds

Samtec Flyover® systems can help extend signal reach and density to achieve next gen speeds by routing signals via ultra-low skew twinax cable versus through lossy PCB.

twinax cables, Flyover® video
Flyover® logo

OVERVIEW

Flyover® problem

(-5 dB Loss Target, Reach Estimate. For OIF VSR applications.)

THE PROBLEM: PCB REACH AT NEXT GEN SPEEDS

As bandwidth requirements rapidly increase, effectively managing heat and routing signals through lossy PCBs, vias and other components have become complex challenges.

THE SOLUTION: SAMTEC FLYOVER® SYSTEMS

Samtec Flyover® design breaks the constraints of traditional signaling substrate and hardware offerings, resulting in a cost–effective, high-performance and heat efficient answer to the challenges of 56 Gbps bandwidths and beyond.

Flyover® solution

FEATURES

Ultra Low Skew Cable Technology

Samtec's proprietary co-extruded Eye Speed® twinax cable technology eliminates the performance limitations and inconsistencies of individually extruded dielectric twinax cabling; improving signal integrity, bandwidth and reach for high-performance system architectures.


Ultra Low Skew Twinax
  • Ideal for 28-112+ Gbps applications
  • Tight coupling between signal conductors
  • Improved bandwidth and reach
  • Improved signal integrity and eye pattern opening
  • Low skew (< 3.5 ps/meter) over extended lengths
Dynamic Testing

Ultra low skew twinax cable underwent Dynamic Insertion and Return Loss testing, proving the cable to be rugged with stable electrical performance after 250 flex/bend cycles. Click here to learn more or contact [email protected] for higher cycle results.

Cable Management

Samtec works with system architects in the early stages of design to create solutions for cable management optimized for signal integrity and even distribution of thermal load. Contact [email protected] for more information.

ultra low skew cable
dynamic testing

Dynamic Testing

Cable Management

Cable Management Video

Flyover® performance specs

Performance, Cost & Thermal Advantages


  • Reduced thermal challenges
  • Simplified board layout
  • 28 – 56 Gbps NRZ and beyond
  • Eliminate expensive re-timers
  • Fewer PCB layers
  • Less expensive PCB materials
28 – 56 Gbps NRZ and beyond
Standard Network Switch vs Samtec Flyover Technology

Cable Management


Using ultra-low skew twinax cable to route signals over the board is a key performance enabler as signal reach and integrity needs continue to become ever more important in high-speed applications. Samtec works with system architects in the early stages of design to create solutions for cable management with even distribution of thermal load.

Cable Management

Flexibility


Samtec Flyover® design provides end option flexibility to create a high-speed application specific solution to meet next gen speeds.

Flyover® Cable Technology

Complete System Optimization from Silicon-to-Silicon™


High-Speed Cable Plant

Samtec's state-of-the-art High–Speed Cable Plant is focused on R&D and manufacturing of precision extruded micro coax and twinax cable. Being vertically integrated allows Samtec to offer full system solutions, which creates the ideal combination of design flexibility and customer service to develop truly differentiated products.

Flyover® cable mfg

Precision extruded micro coax and twinax cables

Flyover® cable mfg

Extreme flexibility for high-speed/high-density cable design

High-Speed Cable Group

As one of Samtec's six Technology Centers, the High–Speed Cable Group is aggressively pursuing next generation micro coax and twinax products that solve existing and future signal integrity challenges for 112 Gbps and beyond.

Other Technology Centers:

Cable Plant

FAMILIES

AcceleRate® HP Cable SystemAcceleRate® HP Extreme Density Cable System

AcceleRate® HP cable assembly is the industry's highest density 112 Gbps PAM4 rated solution for cable-to-board applications. View the full line of AcceleRate® products.

Features
  • Industry's highest density 112 Gbps PAM4 cable-to-board system
  • Data rate compatible with PCIe® 6.0/CXL® 3.1 and 100 GbE
  • 32 to 72 differential pairs (up to 96 pairs on roadmap)
  • 4 or 6 rows (8 rows on roadmap)
  • 34 AWG Eye Speed® Thinax™ ultra low skew twinax cable, or 34 AWG Eye Speed® ThinSE™ micro coax cable
  • Mixed differential pair and single-ended option available
  • Rugged squeeze latch for quick disconnect or locking tabs for maximum density (removal tool required)
  • Single-ended micro coax configuration and right-angle in development
  • Analog Over Array™ capable
  • View the full line of AcceleRate® products
Products
V
  • ARP6
  • APF6-L
  • APF6-T
AcceleRate® HP Cable System

AcceleRate®AcceleRate® Slim Direct Attach Cable Assemblies

AcceleRate® is the industry's slimmest direct attach cable system with ultra low skew twinax cable for 64 Gbps PAM4 speeds. View the full line of AcceleRate® products.

Features
  • Incredibly slim 7.6 mm width
  • High-density 2-row design
  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
  • PCIe® 6.0/CXL® 3.1 capable
  • 34 AWG, 100 Ω Eye Speed® ultra low skew twinax cable
  • 8, 16 and 24 differential pair options available
  • Two rows of high-density contacts directly soldered to the cable
  • Improved signal integrity by eliminating transition board and its variability
  • View the full line of AcceleRate® products
Products
V
  • ARC6
  • ARF6
  • ARF6-RA
AcceleRate®

NovaRay®NovaRay® 112 Gbps PAM4, Extreme Density Arrays

NovaRay® combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.

Features
  • 112 Gbps PAM4 per channel
  • 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
  • PCIe® 6.0/CXL® 3.1 capable
  • Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control
  • Two points of contact ensure a more reliable connection
  • 92 Ω solution addresses both 85 Ω and 100 Ω applications
Products
V
  • NVAC
  • NVAM-CT
  • NVAM
  • NVAF
  • GPSO
NovaRay®

Si-Fly™Si-Fly™ 112 Gbps, Low-Profile High-Density Cable System

Ultra-high-density, on-package pluggable interconnect that eludes the BGA and enables extreme channel performance to 112 Gbps PAM4 and beyond.

Features
  • 25.6 TB aggregate, path to 51.2 TB
  • PCIe® 6.0/CXL® 3.1 capable
  • On-package, pluggable interconnect
  • Ultra-high density
  • Uses direct connect technology to elude the BGA and route signals directly from the silicon package through a long-reach cable
  • 5x the reach of traditional PCB solutions
  • Copper in development, optical solution on the roadmap
Products
V
  • CPC
  • CPI
Si-Fly™

Edge Card Cable SystemsEdge Card Twinax High-Speed Cable Assemblies

These high-speed cable assemblies feature Eye Speed® 30 AWG twinax and 34 AWG ultra low skew twinax cable for optimized performance.

Features
  • Performance to 14 Gbps (ECDP), 16 Gbps (FEDP) and 64 Gbps PAM4/32 Gbps NRZ (GC6)
  • 100 ohm differential pair signal routing
  • Micro 0.50 mm, 0.60 mm and 0.80 mm pitch
  • .062" (1.60 mm) thick card
  • Rugged metal latching and shielding
  • Vertical and right-angle PCB connectors
Products
V
  • GC6
  • GC6-RF
  • HSEC6-DV
  • ECDP
  • HSEC8-DV
  • FEDP
  • FCDP-DV
  • FCDP-RA
Edge Card Cable Systems

FireFly™ Micro Flyover System™FireFly™ Micro Flyover System™

Future-proof system with interchangeability of FireFly™ copper and optical using the same micro connector system for up to 28 Gbps per lane.

Features
  • High-speed performance to 28 Gbps per lane
  • x4 and x12 designs
  • Variety of integral heat sink and End 2 options
  • Interchangeability of copper and optical
  • Micro rugged two-piece connector
  • Extended temperature and PCIe®-Over-Fiber solutions
Products
V
  • ECUO
  • PCUO
  • ETUO
  • ETMO
  • PTUO
  • ECUE
  • PCUE
  • UEC5-1
  • UEC5-2
  • UCC8
  • PCOA
FireFly™ Micro Flyover System™

Flyover QSFP Cable SystemsFlyover® QSFP Cable Systems, Cages, and Heat Sinks

These direct attach Flyover® QSFP cable assemblies improve signal integrity and increase signal path length at higher data rates. QSFP Cages and heat sinks are also available.

Features
  • Compatible with all MSA QSFP pluggables
  • 4 or 8 channel systems
  • Eye Speed® 100 ohm twinax cable
  • PCIe® 6.0/CXL® 3.1 capable
  • Press-fit tails for low speed signals/power to PCB
  • No re-timers required for reduced cost and power consumption
  • Improved thermal dissipation by allowing ICs to be placed in preferred locations
  • Multiple end 2 options available
  • Belly-to-belly mating for maximum density (FQSFP-DD Series)
Products
V
  • FQSFP
  • FQSFP-DD
  • FQSFP-D8
  • QSFPC
  • QSFPC-DD
  • QSFPC-D8
  • HS-QSFP
  • HS-QSFP-DD
  • HS-QSFP-D8
  • LP-FQSFP
Flyover QSFP Cable Systems

NovaRay® I/ONovaRay® I/O Extreme Performance Panel Mount Cable System

NovaRay® I/O uses Flyover® cable technology to route up to 3584 Gbps PAM4 aggregate data from the IC package to the panel and beyond.

Features
  • Highest aggregate data rate on the market - 3,584 Gbps PAM4
  • 16 & 32 diff pair configurations; accommodates PCIe® x4 or x8 plus sidebands
  • Cable-to-cable bulkhead panel connection using Flyover® cable technology
  • External Cable: 28 or 34 AWG twinax
  • Internal Cable: 34 AWG twinax
  • Single-Ended coax options also available
  • Full external EMI shielding
  • Multiple end 2 high-speed connector options available for your ASIC-adjacent Flyover® interconnect
Products
V
  • NVACE
  • NVACP
  • NVC
  • NVA3E
  • NVA3P
NovaRay® I/O

ExaMAX®Samtec ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane cable assemblies deliver 112 Gbps PAM electrical performance.

Features
  • Enables 112 Gbps PAM4 electrical performance on a 2.00 mm column pitch
  • PCIe® 6.0/CXL® 3.1 capable
  • Utilizes Samtec’s Eye Speed® ultra low skew twinax cable technology for improved signal integrity, increased flexibility and routability
  • 30 and 34 AWG to support various cable lengths
  • Two reliable points of contact with a 2.4 mm contact wipe
  • Highly customizable with modular flexibility
  • Reduce costs due to lower PCB layer counts
  • Wafer design increases isolation for reduced crosstalk; includes one sideband signal per column
  • 16 to 96 staggered differential pairs provide higher data rates
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Power and Guide Modules available
Products
V
  • EBTM
  • EBTF-RA
  • EBDM-RA
  • EBCM
  • EBCF
  • EBCL
  • EBCB
  • EGBM
  • EGBF
  • EPTT
  • EPTS
ExaMAX®

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