Samtec Flyover® technology can help extend signal reach and density to achieve next-gen speeds by routing signals via ultra-low skew twinax cable versus through lossy PCB.
As bandwidth requirements rapidly increase, Flyover® systems break the constraints of traditional signaling substrate and hardware offerings, resulting in a cost-effective, high-performance and heat efficient answer to the challenges of 56 Gbps bandwidths and beyond.
These direct attach Flyover® QSFP cable assemblies improve signal integrity and increase signal path length at higher data rates.
NovaRay® combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.
High density Novaray® I/O solutions are in development for the industry’s fastest contact system.View Product Roadmap
AcceleRate® is the industry's slimmest cable system with direct attach technology and ultra low skew twinax cable for 56 Gbps PAM4 speeds. View the full line of AcceleRate® products.
Higher pin counts, higher density and right-angle solutions are in development for the industry’s slimmest high-speed cable system.View Product Roadmap
Ultra-high-density, on-package pluggable interconnect that eludes the BGA and enables extreme channel performance to 112 Gbps PAM4 and beyond.
Extreme channel performance with a pathway to 51.2 TB in 512 lanes at 112 Gbps PAM 4 per lane.View Product Roadmap
Future-proof system with interchangeability of FireFly™ copper and optical using the same micro connector system for up to 28 Gbps per lane.
ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.
ExaMAX® increases architectural flexibility by overcoming the limitations of a traditional connector-to-connector backplane.See High-Density Application Example