中板光学系统

FireFly™ Micro Flyover System™是一种面向未来的盒内式中板光学互连解决方案,性能可达到每通道28 Gbps,而且可迁移至56 Gbps。该系统易于装配,设计可使用相同的高性能连接器套件实现铜缆和光缆的互换,可改善信号完整性,增加信号路径长度,以满足当今和下一代数据速率要求。凭借业界领先的微型封装,FireFly™支持更大的密度,可以更靠近IC,从而实现芯片到芯片、板到板、板载以及系统到系统的连接。


Firefly™ Micro Flyover System™FireFly™微型Flyover System™

面向未来的系统,支持FireFly™铜缆与光缆使用相同的微型连接器系统进行互换,每通道最高可达28 Gbps。

特色
  • 高速性能,每通道可达28 Gbps
  • x4和x12设计
  • 多种集成散热器和终端2方案
  • 铜缆与光纤互换性
  • 微型耐用型双件式连接器
  • 宽温光纤PCIe®解决方案
系列
V
  • ECUO
  • ETUO
  • PCUO
  • ECUE
  • PCUE
  • UEC5-1
  • UEC5-2
  • UCC8
  • PCOA
  • FIK-FIREFLY-XX
Firefly™ Micro Flyover System™

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