Accelerate® HP Extreme Density Cable System

Accelerate® HP Extreme Density Cable System

AcceleRate® HP cable assembly is the industry’s highest density 112 Gbps PAM4 rated solution for cable-to-board applications.


Family Overview

The AcceleRate® HP cable system provides an excellent mix of density and performance. The 0.635 mm pitch board connector uses Samtec’s popular AcceleRate® contacts with a staggered row-to-row spacing of 2.2 mm x 2.4 mm, allowing adequate routing lanes for optimized differential pair traces.

The cable assembly features Samtec’s optimized direct attach technology for impedance control and lower losses through Eye Speed® ultra low skew twinax cable. The addition of a retention shroud provides a robust cabled interconnect.

Accelerate HP Cable

FEATURES

Features

  • Industry’s highest density 112 Gbps PAM4 cable-to-board system
  • 32 to 72 differential pairs (up to 96 pairs on roadmap)
  • 4 or 6 rows (8 rows on roadmap)
  • 34 AWG ultra low skew twinax
  • BGA solder ball attach for simplified processing
  • Rugged squeeze latch for quick disconnect or locking tabs for maximum density (removal tool required)
  • Single-ended micro coax configuration and right-angle in development
ARP6

Cable-On-Substrate

Samtec is the first to achieve a direct-to-chip package solution with the industry’s highest density 112 Gbps PAM4 interconnect.

The AcceleRate® HP cable-on-substrate solution provides greater design flexibility with the cable assembly plugging directly into the connector on the chip package, or transition board. Signals are routed directly from the chip through the cable, eliminating PCB routing for improved signal integrity, greater signal reach and simplified design.

Ideal for AI, high-performance computing (HPC) and data center applications.

Cable Accelerate HP Mojo Rig

Products

ARP6

AcceleRate® HP High-Density, High-Performance Cable System

Features
  • Industry's highest density 112 Gbps PAM4 cable-to-board system
  • 0.635 mm contact pitch; 2.20 x 2.40 mm pitch row-to-row
  • 8 or 12 pairs per row; 4 or 6 rows (8 rows on roadmap)
  • 34 AWG ultra low skew twinax
  • 92 Ω differential pair signal routing
  • Rugged squeeze latch for quick disconnect or locking tabs for maximum density (removal tool required)
AcceleRate® HP High-Density, High-Performance Cable System

APF6-L

AcceleRate® HP Socket for ARP6 Series, 0.635 mm Pitch

Features
  • Industry's highest density 112 Gbps PAM4 cable-to-board system
  • Designed to mate with AcceleRate® HP cable assembly (ARP6)
  • 0.635 mm contact pitch; 2.20 x 2.40 mm pitch row-to-row
  • BGA solder ball attach for simplified processing
  • Rugged squeeze latch for quick disconnect or locking tabs for maximum density (removal tool required)
AcceleRate® HP Socket for ARP6 Series, 0.635 mm Pitch

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