Flyover®
Technology

Flyover® Technology
High-Density • Design Flexibility • High Reliability

Samtec Flyover® technology can help extend signal reach and density to achieve next-gen speeds by routing signals via ultra-low skew twinax cable versus through lossy PCB.

Flyover Technology Logo

As bandwidth requirements rapidly increase, Flyover® systems break the constraints of traditional signaling substrate and hardware offerings, resulting in a cost-effective, high-performance and heat efficient answer to the challenges of 56 Gbps bandwidths and beyond.

Flyover Technology Brochure

Flyover® Technology Brochure

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Samtec Flyover Cable Technology

ULTRA LOW SKEW
CABLE TECHNOLOGY

  • Ideal for 28–112+ Gbps applications
  • Tight coupling between signal conductors
  • Ultra low skew twinax < 3.5 ps/meter
More Flyover® Advantages
Ultra Low Skew

Flyover QSFP Cable SystemsFlyover® QSFP Cable Systems

These direct attach Flyover® QSFP cable assemblies improve signal integrity and increase signal path length at higher data rates.

Features
  • Compatible with all MSA QSFP pluggables
  • 4 or 8 channel systems
  • Eye Speed® 100 ohm twinax cable
  • Press-fit tails for low speed signals/power to PCB
  • No re-timers required for reduced cost and power consumption
  • Improved thermal dissipation by allowing ICs to be placed in preferred locations
  • Multiple end 2 options available
  • Belly-to-belly mating for maximum density (FQSFP-DD Series)
features
Products
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  • FQSFP
  • FQSFP-DD
  • FQSFP-D8
  • QSFPC
  • QSFPC-DD
  • QSFPC-D8
  • HS-QSFP
  • HS-QSFP-DD
  • HS-QSFP-D8
  • LP-FQSFP
Flyover QSFP Cable Systems
features

NovaRay®NovaRay® 112 Gbps PAM4, Extreme Density Arrays

NovaRay® combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.

Features
  • 112 Gbps PAM4 per channel
  • 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
  • Innovative, fully shielded differential pair design enables extremely low crosstalk (to 40 GHz) and tight impedance control
  • 112 differential pairs per square inch
  • Two points of contact ensure a more reliable connection
  • 92 Ω solution addresses both 85 Ω and 100 Ω applications
features
Products
V
  • NVAM
  • NVAF
  • GPSO
  • NVAC
  • NVAM-C
NovaRay®
features

Novaray® Product Roadmap

High density Novaray® I/O solutions are in development for the industry’s fastest contact system.

View Product Roadmap

AcceleRate®AcceleRate® Slim Direct Attach Cable Assemblies

AcceleRate® is the industry’s slimmest cable system with direct attach technology and ultra low skew twinax cable for 56 Gbps PAM4 speeds.

Features
  • Incredibly slim 7.6 mm width
  • High-density 2-row design
  • 34 AWG, 100 Ω Eye Speed® ultra low skew twinax cable
  • 8, 16 and 24 differential pair options available
  • Two rows of high-density contacts directly soldered to the cable
  • Improved signal integrity by eliminating transition board and its variability
features
Products
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  • ARC6
  • ARF6
  • ARF6-RA
AcceleRate®

Accelerate® Product RoadMap

Higher pin counts, higher density and right-angle solutions are in development for the industry’s slimmest high-speed cable system.

View Product Roadmap

Si-Fly™Si-Fly™ 112 Gbps, Low-Profile High-Density Cable System

Ultra-high-density, on-package pluggable interconnect that eludes the BGA and enables extreme channel performance to 112 Gbps PAM4 and beyond.

Features
  • 25.6 TB aggregate, path to 51.2 TB
  • On-package, pluggable interconnect
  • Ultra-high density
  • Uses direct connect technology to elude the BGA and route signals directly from the silicon package through a long-reach cable
  • 5x the reach of traditional PCB solutions
  • Copper in development, optical solution on the roadmap
features
Products
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  • CPC
  • CPI
Si-Fly™

SI-FLY Product RoadMap

Extreme channel performance with a pathway to 51.2 TB in 512 lanes at 112 Gbps PAM 4 per lane.

View Product Roadmap

Firefly™ Micro Flyover System™FireFly™ Micro Flyover System™

Future-proof system with interchangeability of FireFly™ copper and optical using the same micro connector system for up to 28 Gbps per lane.

Features
  • High-speed performance to 28 Gbps per lane
  • x4 and x12 designs
  • Variety of integral heat sink and End 2 options
  • Interchangeability of copper and optical
  • Micro rugged two-piece connector
  • Extended temperature and PCIe®-Over-Fiber solutions
features
Products
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  • ECUO
  • PCUO
  • ETUO
  • ECUE
  • PCUE
  • UEC5-1
  • UEC5-2
  • UCC8
  • PCOA
Firefly™ Micro Flyover System™

ExaMAX®Samtec ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.

Features
  • Enables 56 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
  • Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
Products
V
  • EBTM
  • EBTF-RA
  • EBDM-RA
  • EBCM
  • EBCF
  • EBCL
  • EBCB
  • EGBM
  • EGBF
  • EPTT
  • EPTS
ExaMAX®
features

High-Density Application

ExaMAX® increases architectural flexibility by overcoming the limitations of a traditional connector-to-connector backplane.

See High-Density Application Example

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