High-Speed Board-to-Board Connectors

High speed connectors, mezzanine systems with integral ground planes, high-density arrays, backplane interconnects, rugged signal integrity optimized Edge Rate® systems and high-speed performance to 56 Gbps NRZ/112 Gbps PAM4.

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High Speed Mezzanine Connectors

High Speed Mezzanine Connectors

Build your mated connector set using Samtec's High-Speed Board-to-Board Solutionator®. Board-to-board high speed mezzanine connectors, strips, and systems to 28+ Gbps performance featuring integral ground planes, rugged signal integrity optimized Edge Rate® contacts, slim body and low profile stack heights.


Q Strip®Q Strip® High Speed Ground Plane Connectors, Mezzanine

Featuring an integral ground plane, Samtec Q Strip® high speed ground plane connectors are designed for high-speed board-to-board applications where signal integrity is essential.

Features
  • Performance: Up to 14.0 GHz /28 Gbps
  • Integral ground/power plane
  • Connector to connector retention options
  • Vertical, perpendicular, and coplanar applications
  • Contacts: Up to 180 I/Os
  • Stack height: 5 mm - 25 mm
Products
V
  • QSE
  • QSH
  • QSS
  • QTE
  • QTH
  • QTS
  • QSS-RA
  • QTS-RA
  • QSE-EM
  • QTH-RA
  • QSH-RA
Q Strip®

Q Pairs®Q Pairs® Differential Pair Mezzanine Connectors

Samtec Q Pairs® differential pair mezzanine connectors are designed for high-speed board-to-board applications where signal integrity is essential.

Features
  • Performance: Up to 10.5 GHz / 21 Gbps
  • Optimized for 100 ohm systems
  • Integral ground/power plane
  • Stack height: 5.00-25.00 mm
  • Contacts: Up to 100 pairs
Products
V
  • QSH-DP
  • QTH-DP
  • QSS-DP
  • QTS-DP
  • QSE-DP
  • QTE-DP
  • QSH-DP-RA
  • QTH-DP-RA
Q Pairs®

Q Rate®Q Rate® Slim, Rugged High-Speed Mezzanine Connectors

Samtec Q Rate® rugged high speed connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features
  • Performance to 28 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Products
V
  • QRF8
  • QRM8
  • QRF8-DP
  • QRF8-RA
  • QRM8-DP
  • QRM8-RA
Q Rate®

Q2™Q2™ Rugged, Shielded, High-Speed Mezzanine Connectors

These rugged, shielded, high-speed mezzanine connectors feature a ground plane and high-wipe contacts.

Features
  • Performance to 25 Gbps NRZ
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power combo option
  • Contacts: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Products
V
  • QFS
  • QMS
  • QFS-DP
  • QMS-DP
  • QFS-RA
  • QMS-RA
  • QFS-EM
  • QMS-EM
  • QFS-PC
  • QMS-PC
  • QFSS
  • QMSS
  • QFSS-DP
  • QMSS-DP
  • QFSS-PC
  • QMSS-PC
  • QFSS-DP-PC
  • QMSS-DP-PC
Q2™

Edge Rate®Edge Rate® High-Speed Rugged High-Cycle Connectors

Edge Rate® rugged high cycle connectors feature contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • 1.5 mm contact wipe
  • Robust when "zippered" during unmating
  • Up to 56 Gbps PAM4 performance
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • Stack heights from 5 mm to 18 mm
  • Extremely slim 2.5 mm body width on 0.635 mm pitch system
  • 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Products
V
  • ERM8
  • ERF8
  • ERM8-RA
  • ERF8-RA
  • ERM8-EM
  • ERF8-EM
  • ERM8-S
  • ERF8-S
  • ERM5
  • ERF5
  • ERF5-RA
  • ERF6
  • ERM6
Edge Rate®

Razor Beam™Razor Beam™ Fine Pitch Self Mating Connectors

High-speed, high-density Razor Beam™ fine pitch self mating connectors reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • Razor Beam™ contacts for high-speed and fine-pitch systems
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Shielded option for EMI protection
  • Self-mating connectors reduce inventory costs and can be interchanged for varying stack heights
  • 10 stack height options from 5 mm to 12 mm
  • Up to 100 contacts
  • Parallel, perpendicular and coplanar systems
  • Audible click when mated
  • Lubricated option available
Products
V
  • LSHM
  • LSHM-S
  • LSS
  • LSEM
  • JSO
Razor Beam™

Rugged High Speed Connectors

Rugged High Speed Connectors

Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. Rugged high speed connectors with rugged Edge Rate® contacts, increased insertion depths, and rugged designs for contact protection during mating and unmating.


Q2™Q2™ Rugged/High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features
  • Performance to 25 Gbps NRZ
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power combo option
  • Contacts: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Products
V
  • QFS
  • QMS
  • QFS-DP
  • QMS-DP
  • QFS-RA
  • QMS-RA
  • QFS-EM
  • QMS-EM
  • QFS-PC
  • QMS-PC
  • QFSS
  • QMSS
  • QFSS-DP
  • QMSS-DP
  • QFSS-PC
  • QMSS-PC
  • QFSS-DP-PC
  • QMSS-DP-PC
Help Me Choose?
Q2™

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • 1.5 mm contact wipe
  • Robust when "zippered" during unmating
  • Up to 56 Gbps PAM4 performance
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • Stack heights from 5 mm to 18 mm
  • Extremely slim 2.5 mm body width on 0.635 mm pitch system
  • 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Products
V
  • ERM8
  • ERF8
  • ERM8-RA
  • ERF8-RA
  • ERM8-EM
  • ERF8-EM
  • ERM8-S
  • ERF8-S
  • ERM5
  • ERF5
  • ERF5-RA
  • ERF6
  • ERM6
Help Me Choose?
Edge Rate®

Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects

Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features
  • Performance to 28 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Products
V
  • QRF8
  • QRM8
  • QRF8-DP
  • QRF8-RA
  • QRM8-DP
  • QRM8-RA
Help Me Choose?
Q Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • Razor Beam™ contacts for high-speed and fine-pitch systems
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Shielded option for EMI protection
  • Self-mating connectors reduce inventory costs and can be interchanged for varying stack heights
  • 10 stack height options from 5 mm to 12 mm
  • Up to 100 contacts
  • Parallel, perpendicular and coplanar systems
  • Audible click when mated
  • Lubricated option available
Products
V
  • LSHM
  • LSHM-S
  • LSS
  • LSEM
  • JSO
Help Me Choose?
Razor Beam™

Floating Contact SystemHigh Speed Floating Connectors

These high speed floating connectors provide 0.50 mm of float in the X and Y directions to minimize mating alignment errors.

Features
  • Provides 0.50 mm (.0197") float in X and Y directions
  • Ideal for multiple connectors on a board
  • Up to 60 floating contacts
  • Choice of body height and right-angle design
Products
V
  • FT5
  • FS5
Floating Contact System

High Density Connectors and Arrays

High Density Connectors and Arrays

Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. These high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.


NovaRay®NovaRay® 112 Gbps PAM4 Array, Extreme Density Arrays

NovaRay® combines extreme density and performance for this 112 Gbps PAM4 array per channel in 40% less space than traditional arrays.

Features
  • 112 Gbps PAM4 per channel
  • 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
  • PCIe® 6.0 capable
  • Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control
  • Two points of contact ensure a more reliable connection
  • 92 Ω solution addresses both 85 Ω and 100 Ω applications
  • Analog Over Array™ capable
Products
V
  • NVAM
  • NVAF
  • GPSO
  • NVAC
  • NVAM-CT
NovaRay®

AcceleRate® HP High-Performance ArraysAcceleRate® HP High-Performance Arrays

AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design. View the full line of AcceleRate® products.

Features
  • 0.635 mm pitch open-pin-field array
  • 56 Gbps NRZ/112 Gbps PAM4 performance
  • Cost optimized solution
  • Low-profile 5 mm and up to 10 mm stack heights
  • Up to 400 total pins available; roadmap to 1,000+ pins
  • Data rate compatible with PCIe® 6.0 and 100 GbE
  • Analog Over Array™ capable
  • View the full line of AcceleRate® products
Products
V
  • APM6
  • APF6
  • APF6-RA
  • GPSO
AcceleRate® HP High-Performance Arrays

AcceleRate® HDAcceleRate® HD Ultra-Dense, Slim Body Arrays

These 0.635 mm pitch high-density, open-pin-field arrays feature up to 400 high-speed Edge Rate® contacts in a slim, low-profile design. View the full line of AcceleRate® products.

Features
  • Incredibly dense with up to 400 total I/Os
  • Low profile 5 mm to 16 mm stack heights
  • Slim 5 mm width
  • 4-row design; 10 - 60 and 100 positions per row (40 - 400 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
  • PCIe® 6.0 capable
  • Additional stack heights in development
  • View the full line of AcceleRate® products
Products
V
  • ADM6
  • ADF6
  • GPSO
AcceleRate® HD

AcceleRate® mPAcceleRate® mP High-Density, High-Speed Power/Signal Arrays

These 0.635 mm pitch power/signal arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for 22 Amps/blade and simplified breakout region (BOR).

Features
  • Best in class density for power and signal
  • Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding
  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
  • PCIe® 6.0 capable
  • Up to 22 Amps per power blade
  • Open-pin-field for grounding and routing flexibility
  • High-density multi-row design
  • Low profile 5 mm stack height; up to 16 mm in development
  • 4 or 8 total power blades; up to 10 in development
  • 60 or 240 total signal positions; additional position counts in development
  • 0.635 mm signal pitch
  • Optional alignment pins and weld tabs for a secure connection to the board
  • Polarized guide posts for blind mating
  • View the full line of AcceleRate® products
Products
V
  • UDF6
  • UDM6
AcceleRate® mP

SEARAY™SEARAY™ High Density Open Pin Field Arrays

These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • 56 Gbps PAM4 performance
  • Up to 560 I/Os in open pin field design
  • 1.27 mm (.050") pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • Analog Over Array™ capable
  • 7 - 18.5 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • Standards: VITA 47, VITA 57.1 FMC, VITA 57.4 FMC+, VITA 74 VNX, PISMO™ 2
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Products
V
  • SEAF
  • SEAM
  • SEAF-RA
  • SEAM-RA
  • SEAMP
  • SEAFP
  • SEAFP-RA
  • SEAR
  • SEAMI
  • JSO
  • GPPK
  • GPSK
SEARAY™

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch arrays
  • 28 Gbps NRZ/56 Gbps PAM4 performance
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Final Inch® certified for Break Out Region trace routing recommendations
  • Analog Over Array™ capable
Products
V
  • SEAM8
  • SEAF8
  • SEAF8-RA
  • JSO
SEARAY™ 0.80 mm

LP Array™LP Array™ Low Profile Open-Pin-Field High-Density Array

These low profile open-pin-field arrays feature as low as a 4 mm stack height and up to 400 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 400 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • 28 Gbps NRZ/56 Gbps PAM4 performance
  • Analog Over Array™ capable
Products
V
  • JSO
  • LPAF
  • LPAM
LP Array™

SUPERNOVA™ Low Profile One-Piece ArraysSUPERNOVA™ Low Profile One-Piece Compression Arrays

High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

Features
  • 1.27 mm standard body height
  • 1.00 mm pitch
  • Dual compression or single compression with solder balls
  • 100 – 300 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
  • Analog Over Array™ capable
Products
V
  • GMI
SUPERNOVA™ Low Profile One-Piece Arrays

ExaMAX®Samtec ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.

Features
  • Enables 56 Gbps PAM4 electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 24 - 72 pairs (board connectors) and 16 - 96 pairs (cable assemblies)
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
  • Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
  • Stub free mating
  • Press-fit termination
  • Power and Guide Modules available
Products
V
  • EBTM
  • EBTM-RA
  • EBTF-RA
  • EBDM-RA
  • EBCM
  • EBCF
  • EGBM
  • EGBF
  • EPTT
  • EPTS
  • EBCL
  • EBCB
ExaMAX®

HD MezzHD Mezz Array

Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.

Features
  • Application specific capability to stack heights from 20 mm to 35 mm
  • Open pin field design
  • Performance: Up to 9 GHz / 18 Gbps
  • Integrated guide posts to minimize contact damage when mating and unmating
  • Solder charge terminations for ease of processing
  • 2.00 mm x 1.20 mm pitch
  • Up to 299 I/Os
  • Intermateable with Molex HD Mezz Arrays
  • HD Mezz is a trademark of Molex Incorporated
Products
V
  • HDAF
  • HDAM
HD Mezz

Ultra Micro

Ultra Micro

Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. Ultra fine pitch, ultra-low profile and ultra-slim body connectors with 28+ Gbps performance.


Micro Blade & BeamMicro Blade & Beam Ultra Fine Pitch Connectors

0.40 mm and 0.50 mm pitch Micro Blade & Beam ultra slim, ultra low profile connectors.

Features
  • Ultra fine pitch – 0.40 mm and 0.50 mm
  • Ultra low stack down to 2.00 mm
  • Slim body design for increased board space savings
Products
V
  • SS4
  • ST4
  • SS5
  • ST5
  • SLH
  • TLH
Micro Blade & Beam

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • 1.5 mm contact wipe
  • Robust when "zippered" during unmating
  • Up to 56 Gbps PAM4 performance
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • Stack heights from 5 mm to 18 mm
  • Extremely slim 2.5 mm body width on 0.635 mm pitch system
  • 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Products
V
  • ERM8
  • ERF8
  • ERM8-RA
  • ERF8-RA
  • ERM8-EM
  • ERF8-EM
  • ERM8-S
  • ERF8-S
  • ERM5
  • ERF5
  • ERF5-RA
  • ERM6
  • ERF6
Edge Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • Razor Beam™ contacts for high-speed and fine-pitch systems
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Shielded option for EMI protection
  • Self-mating connectors reduce inventory costs and can be interchanged for varying stack heights
  • 10 stack height options from 5 mm to 12 mm
  • Up to 100 contacts
  • Parallel, perpendicular and coplanar systems
  • Audible click when mated
  • Lubricated option available
Products
V
  • LSHM
  • LSHM-S
  • LSS
  • LSEM
  • JSO
Razor Beam™

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch arrays
  • 28 Gbps NRZ/56 Gbps PAM4 performance
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations
  • Analog Over Array™ capable
Products
V
  • SEAM8
  • SEAF8
  • SEAF8-RA
  • JSO
SEARAY™ 0.80 mm

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 400 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 400 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • 28 Gbps NRZ/56 Gbps PAM4 performance
  • Analog Over Array™ capable
Products
V
  • JSO
  • LPAF
  • LPAM
LP Array™

Compression Interposers

Compression Interposers

High-speed interposers up to 56 Gbps NRZ featuring an ultra-low profile with high-density single or dual compression contacts and extreme design flexibility.


SUPERNOVA™ Low Profile Compression InterposersSUPERNOVA™ Low Profile Compression Interposers

High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.

Features
  • 1.27 mm standard body height
  • 1.00 mm pitch
  • Dual compression contacts
  • 100 – 300 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
  • Analog Over Array™ capable
Products
V
  • GMI
SUPERNOVA™ Low Profile Compression Interposers

High-Isolation

High-Isolation

Cost saving, high-performance RF solutions for board-to-board and cable-to-board applications.


Board-to-Board RF ConnectorsBoard-to-Board RF Connectors

Samtec offers RF Board-to-board connectors with stack height options from 4.22 mm (.166”) to 10 mm (.394”). Solutions include high-density multi-position blocks, SMPM/SMP with axial and radial float for blind-mate or misalignment applications, and high-isolation low-cost systems.

Features
  • Space-saving designs: high-density, low-profile
  • Ganged, multi-position SMPM blocks to 65 GHz
  • Miniature push-on connectors with bullet adaptors
  • Ganged, micro-miniature jacks/plugs with 5 mm (.1969”) pitch
  • IsoRate® high-isolation systems at half the cost of traditional machined RF connectors
Products
V
  • GPPC
  • GPPB
  • PRFIA
  • SMPM-ST-TH
  • SMP-TH
  • SMP-B
  • IJ5
  • IP5
  • GRF1-J
  • GRF1-P
  • GRF7-J
  • GRF7-P
Board-to-Board RF Connectors

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