High-Speed Board-to-Board Connectors
High speed connectors, mezzanine systems with integral ground planes, high-density arrays, backplane interconnects, rugged signal integrity optimized Edge Rate® systems and high-speed performance to 56 Gbps NRZ/112 Gbps PAM4.
High Speed Mezzanine Connectors
High Speed Mezzanine Connectors
Build your mated connector set using Samtec's High-Speed Board-to-Board Solutionator®. Board-to-board high speed mezzanine connectors, strips, and systems to 28+ Gbps performance featuring integral ground planes, rugged signal integrity optimized Edge Rate® contacts, slim body and low profile stack heights.
Q Strip®Q Strip® High Speed Ground Plane Connectors, Mezzanine
Featuring an integral ground plane, Samtec Q Strip® high speed ground plane connectors are designed for high-speed board-to-board applications where signal integrity is essential.
Features
- Performance: Up to 14.0 GHz /28 Gbps
- Integral ground/power plane
- Connector to connector retention options
- Vertical, perpendicular, and coplanar applications
- Contacts: Up to 180 I/Os
- Stack height: 5 mm - 25 mm
Q Pairs®Q Pairs® Differential Pair Mezzanine Connectors
Samtec Q Pairs® differential pair mezzanine connectors are designed for high-speed board-to-board applications where signal integrity is essential.
Features
- Performance: Up to 10.5 GHz / 21 Gbps
- Optimized for 100 ohm systems
- Integral ground/power plane
- Stack height: 5.00-25.00 mm
- Contacts: Up to 100 pairs
Q Rate®Q Rate® Slim, Rugged High-Speed Mezzanine Connectors
Samtec Q Rate® rugged high speed connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.
Features
- Performance to 28 Gbps
- Rugged Edge Rate® contacts
- Integral ground/power plane
- Up to 156 positions
- Slim footprint (less than 5.00 mm wide)
Q2™Q2™ Rugged, Shielded, High-Speed Mezzanine Connectors
These rugged, shielded, high-speed mezzanine connectors feature a ground plane and high-wipe contacts.
Features
- Performance to 25 Gbps NRZ
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
- Power combo option
- Contacts: Up to 208 I/Os
- Stack height: 10.00 mm - 16.00 mm
Edge Rate®Edge Rate® High-Speed Rugged High-Cycle Connectors
Edge Rate® rugged high cycle connectors feature contact systems optimized for signal integrity performance.
Features
- Edge Rate® contacts optimized for signal integrity performance
- 1.5 mm contact wipe
- Robust when "zippered" during unmating
- Up to 56 Gbps PAM4 performance
- 0.50 mm, 0.635 mm or 0.80 mm pitch systems
- Stack heights from 5 mm to 18 mm
- Extremely slim 2.5 mm body width on 0.635 mm pitch system
- 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Razor Beam™Razor Beam™ Fine Pitch Self Mating Connectors
High-speed, high-density Razor Beam™ fine pitch self mating connectors reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
Features
- 10 stack height options from 5 mm to 12 mm
- Audible click when mated
- Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
- Up to 100 contacts
Rugged High Speed Connectors
Rugged High Speed Connectors
Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. Rugged high speed connectors with rugged Edge Rate® contacts, increased insertion depths, and rugged designs for contact protection during mating and unmating.
Q2™Q2™ Rugged/High-Speed Interconnects
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.
Features
- Performance to 25 Gbps NRZ
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
- Power combo option
- Contacts: Up to 208 I/Os
- Stack height: 10.00 mm - 16.00 mm
Edge Rate®Edge Rate® Connector Strips
Rugged Edge Rate® contact systems optimized for signal integrity performance.
Features
- Edge Rate® contacts optimized for signal integrity performance
- 1.5 mm contact wipe
- Robust when "zippered" during unmating
- Up to 56 Gbps PAM4 performance
- 0.50 mm, 0.635 mm or 0.80 mm pitch systems
- Stack heights from 5 mm to 18 mm
- Extremely slim 2.5 mm body width on 0.635 mm pitch system
- 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.
Features
- Performance to 28 Gbps
- Rugged Edge Rate® contacts
- Integral ground/power plane
- Up to 156 positions
- Slim footprint (less than 5.00 mm wide)
Razor Beam™Razor Beam™
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
Features
- 10 stack height options from 5 mm to 12 mm
- Audible click when mated
- Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
- Up to 100 contacts
Floating Contact SystemHigh Speed Floating Connectors
These high speed floating connectors provide 0.50 mm of float in the X and Y directions to minimize mating alignment errors.
Features
- Provides 0.50 mm (.0197") float in X and Y directions
- Ideal for multiple connectors on a board
- Up to 60 floating contacts
- Choice of body height and right-angle design
High Density Connectors and Arrays
High Density Connectors and Arrays
Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. These high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.
NovaRay®NovaRay® 112 Gbps PAM4 Array, Extreme Density Arrays
NovaRay® combines extreme density and performance for this 112 Gbps PAM4 array per channel in 40% less space than traditional arrays.
Features
- 112 Gbps PAM4 per channel
- 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
- Innovative, fully shielded differential pair design enables extremely low crosstalk (to 40 GHz) and tight impedance control
- 112 differential pairs per square inch
- Two points of contact ensure a more reliable connection
- 92 Ω solution addresses both 85 Ω and 100 Ω applications
AcceleRate® HP High-Performance ArraysAcceleRate® HP High-Performance Arrays
AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design. View the full line of AcceleRate® products.
Features
- 0.635 mm pitch open-pin-field array
- 56 Gbps NRZ/112 Gbps PAM4 performance
- Cost optimized solution
- Low-profile 5 mm and up to 10 mm stack heights
- Up to 400 total pins available; roadmap to 1,000+ pins
- Data rate compatible with PCIe® 5.0 and 100 GbE
- View the full line of AcceleRate® products
AcceleRate® HDAcceleRate® HD Ultra-Dense, Slim Body Multi Row Mezzanine Strips
These 0.635 mm pitch high-density arrays are multi row mezzanine strips that feature up to 240 high-speed Edge Rate® contacts in a slim, low-profile design. View the full line of AcceleRate® products.
Features
- Incredibly dense with up to 240 total I/Os; up to 400 I/Os in development
- Low profile 5 mm stack height
- Slim 5 mm width
- 4-row design; 10 - 60 positions per row (40 - 240 total positions)
- Edge Rate® contact system optimized for signal integrity performance
- Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
- Solder ball technology for simplified processing and self aligning
- Additional stack heights in development
- View the full line of AcceleRate® products
SEARAY™SEARAY™ High Density Open Pin Field Arrays
These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.
Features
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- 56 Gbps PAM4 performance
- Up to 560 I/Os in open pin field design
- 1.27 mm (.050") pitch
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- 7 - 18.5 mm stack heights
- Vertical, right-angle, press-fit
- Elevated systems to 40 mm
- 85 ohm systems
- Standards: VITA 47, VITA 57.1 FMC, VITA 57.4 FMC+, VITA 74 VNX, PISMO™ 2
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.
Features
- 0.80 mm (.0315") pitch grid
- 50% board space savings versus .050" (1.27 mm) pitch arrays
- 28 Gbps NRZ/56 Gbps PAM4 performance
- Rugged Edge Rate® contact system
- Up to 500 I/Os
- 7 mm and 10 mm stack heights
- Solder charge terminations for ease of processing
- Final Inch® certified for Break Out Region trace routing recommendations
LP Array™LP Array™ Low Profile Open-Pin-Field High-Density Array
These low profile open-pin-field arrays feature as low as a 4 mm stack height and up to 400 total I/Os.
Features
- 4 mm, 4.5 mm, 5 mm stack heights
- Up to 400 I/Os
- 4, 6 and 8 row designs
- .050" (1.27 mm) pitch
- Dual beam contact system
- Solder crimp termination for ease of processing
- 28 Gbps NRZ/56 Gbps PAM4 performance
Low Profile One-Piece ArraysLow Profile One-Piece Compression Arrays
High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.
Features
- 1.27 mm standard body height
- 1.00 mm pitch
- Dual compression or single compression with solder balls
- 100 – 300 total pins
- Ideal for low cost board stacking, module-to-board and LGA interfaces
- Minimizes thermal expansion issues
ExaMAX®Samtec ExaMAX® High-Speed Backplane System
ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.
Features
- Enables 56 Gbps PAM4 electrical performance on 2.00 mm column pitch
- Allows designers to optimize density or minimize board layer count
- Two reliable points of contact, even when subjected to angled mating
- Meets Telcordia GR-1217 CORE specification
- Individual signal wafers with staggered differential pair design; 24 - 72 pairs (board connectors) and 16 - 96 pairs (cable assemblies)
- One-piece embossed ground structure on each signal wafer to reduce crosstalk
- Lowest mating force on the market: 0.36 N max per contact
- Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
- Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
- Stub free mating
- Press-fit termination
- Power and Guide Modules available
HD MezzHD Mezz Array
Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.
Features
- Application specific capability to stack heights from 20 mm to 35 mm
- Open pin field design
- Performance: Up to 9 GHz / 18 Gbps
- Integrated guide posts to minimize contact damage when mating and unmating
- Solder charge terminations for ease of processing
- 2.00 mm x 1.20 mm pitch
- Up to 299 I/Os
- Intermateable with Molex HD Mezz Arrays
- HD Mezz is a trademark of Molex Incorporated
Ultra Micro
Ultra Micro
Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. Ultra fine pitch, ultra-low profile and ultra-slim body connectors with 28+ Gbps performance.
Micro Blade & BeamMicro Blade & Beam Ultra Fine Pitch Connectors
0.40 mm and 0.50 mm pitch Micro Blade & Beam ultra slim, ultra low profile connectors.
Features
- Ultra fine pitch – 0.40 mm and 0.50 mm
- Ultra low stack down to 2.00 mm
- Slim body design for increased board space savings
- Compatible with mPOWER™ for power/signal flexibility.
Edge Rate®Edge Rate® Connector Strips
Rugged Edge Rate® contact systems optimized for signal integrity performance.
Features
- Edge Rate® contacts optimized for signal integrity performance
- 1.5 mm contact wipe
- Robust when "zippered" during unmating
- Up to 56 Gbps PAM4 performance
- 0.50 mm, 0.635 mm or 0.80 mm pitch systems
- Stack heights from 5 mm to 18 mm
- Extremely slim 2.5 mm body width on 0.635 mm pitch system
- 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Razor Beam™Razor Beam™
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
Features
- 10 stack height options from 5 mm to 12 mm
- Audible click when mated
- Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
- Up to 100 contacts
SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.
Features
- 0.80 mm (.0315") pitch grid
- 50% board space savings versus .050" (1.27 mm) pitch arrays
- 28 Gbps NRZ/56 Gbps PAM4 performance
- Rugged Edge Rate® contact system
- Up to 500 I/Os
- 7 mm and 10 mm stack heights
- Solder charge terminations for ease of processing
- Samtec 28+ Gbps Solution
- Final Inch® certified for Break Out Region trace routing recommendations
LP Array™LP Array™ Low Profile Open-Pin-Field Arrays
Low profile open-pin-field arrays down to 4 mm stack height and up to 400 total I/Os.
Features
- 4 mm, 4.5 mm, 5 mm stack heights
- Up to 400 I/Os
- 4, 6 and 8 row designs
- .050" (1.27 mm) pitch
- Dual beam contact system
- Solder crimp termination for ease of processing
- 28 Gbps NRZ/56 Gbps PAM4 performance
Compression Interposers
Compression Interposers
High-speed interposers up to 56 Gbps NRZ featuring an ultra-low profile with high-density single or dual compression contacts and extreme design flexibility.
Low Profile Compression InterposersLow Profile Compression Interposers
High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.
Features
- 1.27 mm standard body height
- 1.00 mm pitch
- Dual compression contacts
- 100 – 300 total pins
- Ideal for low cost board stacking, module-to-board and LGA interfaces
- Minimizes thermal expansion issues
High-Isolation
High-Isolation
Cost saving, high-performance RF solutions for board-to-board and cable-to-board applications.
Board-to-Board RF ConnectorsBoard-to-Board RF Connectors
Samtec offers RF Board-to-board connectors with stack height options from 4.22 mm (.166”) to 10 mm (.394”). Solutions include high-density multi-position blocks, SMPM/SMP with axial and radial float for blind-mate or misalignment applications, and high-isolation low-cost systems.
Features
- Space-saving designs: high-density, low-profile
- Ganged, multi-position SMPM blocks to 65 GHz
- Miniature push-on connectors with bullet adaptors
- Ganged, micro-miniature jacks/plugs with 5 mm (.1969”) pitch
- IsoRate® high-isolation systems at half the cost of traditional machined RF connectors
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