High-speed interconnects that support 28+ Gbps requirements

28+ Gbps Solutions

Samtec has developed a full line of connector products that are designed to support serial speeds of 28 Gbps or more.

FEATURES

  • 0.40 mm, 0.50 mm, 0.80 mm, 0.635 mm, 1.00 mm, .050" or 2.00 mm pitch
  • Pin counts from 10 to 500
  • Stack heights from 1 mm to 30 mm
  • Vertical and horizontal orientations

SERIES

ERF5

0.50 mm Edge Rate® Rugged High-Speed Socket Strip

Features
  • Rugged Edge Rate® contact
  • Smooth broad milled contact surface for increased wear life
  • Positions: Up to 150
  • Stack height: 7.00 mm - 12.00 mm
  • Final Inch® break out region data available
  • Samtec 28+ Gbps Solution
0.50 mm Edge Rate® Rugged High-Speed Socket Strip

ERF8

0.80 mm Edge Rate® Rugged High-Speed Socket Strip

Features
  • Rugged Edge Rate® contact
  • Smooth broad milled contact surface for increased wear life
  • Positions: Up to 200
  • Stack Height: 7.00 mm - 16.00 mm
  • Final Inch® break out region data available
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
0.80 mm Edge Rate® Rugged High-Speed Socket Strip

ERM5

0.50 mm Edge Rate® Rugged High-Speed Terminal Strip

Features
  • Rugged Edge Rate® contact
  • Smooth broad milled contact surface for increased wear life
  • Positions: Up to 150
  • Stack height: 7.00 mm - 12.00 mm
  • Final Inch® break out region data available
  • Samtec 28+ Gbps Solution
0.50 mm Edge Rate® Rugged High-Speed Terminal Strip

ERM8

0.80 mm Edge Rate® Rugged High-Speed Terminal Strip

Features
  • Rugged Edge Rate® contact
  • Smooth broad milled contact surface for increased wear life
  • Positions: Up to 200
  • Stack Height: 7.00 mm - 16.00 mm
  • Final Inch® break out region data available
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
0.80 mm Edge Rate® Rugged High-Speed Terminal Strip

HSEC8-DV

0.80 mm Edge Rate® High-Speed Edge Card Connector, Vertical

Features
  • Rugged Edge Rate® contact
  • Single-ended and differential pairs
  • Card slot: .062" (1.60 mm)
  • Pass-through option available (HSEC8-PE)
  • Optional board locks and cable latching features
  • Optional weld tab for mechanical strength
  • Samtec 28+ Gbps Solution
  • Extended Life Product™ (E.L.P.™)
0.80 mm Edge Rate® High-Speed Edge Card Connector, Vertical

HSEC8-DV

0.80 mm Edge Rate® High-Speed Edge Card Connector, Vertical

Features
  • Rugged Edge Rate® contact
  • Single-ended and differential pairs
  • Card slot: .062" (1.60 mm)
  • Pass-through option available (HSEC8-PE)
  • Optional board locks and cable latching features
  • Optional weld tab for mechanical strength
  • Samtec 28+ Gbps Solution
  • Extended Life Product™ (E.L.P.™)
0.80 mm Edge Rate® High-Speed Edge Card Connector, Vertical

HSEC8-PV

0.80 mm Edge Rate® High-Speed Edge Card Power Combo Connector

Features
  • Rugged Edge Rate® contact
  • Card slot: .062" (1.60 mm)
  • Choice of 2 or 4 power banks
  • Optional weld tab for mechanical strength
  • Samtec 28+ Gbps Solution
  • Extended Life Product™ (E.L.P.™)
  • UL: File # E111594
0.80 mm Edge Rate® High-Speed Edge Card Power Combo Connector

HSEC8-PV

0.80 mm Edge Rate® High-Speed Edge Card Power Combo Connector

Features
  • Rugged Edge Rate® contact
  • Card slot: .062" (1.60 mm)
  • Choice of 2 or 4 power banks
  • Optional weld tab for mechanical strength
  • Samtec 28+ Gbps Solution
  • Extended Life Product™ (E.L.P.™)
  • UL: File # E111594
0.80 mm Edge Rate® High-Speed Edge Card Power Combo Connector

LPAF

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

Features
  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

LPAM

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

Features
  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

LSEM

0.80 mm Razor Beam™ High-Speed Hermaphroditic Terminal/Socket Strip

Features
  • Six stack height options from 6.00 mm to 12.00 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Self-mating system reduces inventory cost
  • Up to 100 I/Os
  • Vertical and right-angle orientations
  • Samtec 28+ Gbps Solution
0.80 mm Razor Beam™ High-Speed Hermaphroditic Terminal/Socket Strip

MEC2-DV

2.00 mm Mini Edge Card Connector, Vertical

Features
  • 2.00 mm (.0787") pitch
  • Accepts .062" (1.60 mm) and .093" (2.36 mm) thick cards
  • Double row design up to 100 pins polarized
  • Rugged weld tab option
  • Samtec 28+ Gbps Solution
2.00 mm Mini Edge Card Connector, Vertical

MECF-DV

.050" Mini Edge Card Connector, Vertical

Features
  • .050" (1.27 mm) pitch
  • Accepts .062" (1.60 mm) and .093" (2.36 mm) thick cards
  • Double row design up to 100 pins polarized
  • Rugged weld tab option
  • Samtec 28+ Gbps Solution
.050" Mini Edge Card Connector, Vertical

QFS

0.635 mm Q2™ High-Speed Rugged Ground Plane Socket Strip

Features
  • 0.635 mm pitch (.025")
  • Up to 208 positions
  • Guide post option
  • Samtec 28+ Gbps Solution
0.635 mm Q2™ High-Speed Rugged Ground Plane Socket Strip

QMS

0.635 mm Q2™ High-Speed Rugged Ground Plane Terminal Strip

Features
  • 0.635 mm pitch (.025")
  • Up to 208 positions
  • Guide post option
  • Samtec 28+ Gbps Solution
0.635 mm Q2™ High-Speed Rugged Ground Plane Terminal Strip

QRF8

0.80 mm Q Rate® Slim Body Ground Plane Socket

Features
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Slim 4.60 mm width
  • Extended Life Product™ (E.L.P.™)
  • 7 mm - 14 mm stack heights
  • Up to 156 positions
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
0.80 mm Q Rate® Slim Body Ground Plane Socket

QRF8-DP

0.80 mm Q Rate® High-Speed Ground Plane Slim Body Socket Strip, Differential Pair

Features
  • Performance: Up to 10 GHz / 20 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Slim 4.60 mm width
  • 7 mm - 14 mm stack heights
  • Up to 108 positions
0.80 mm Q Rate® High-Speed Ground Plane Slim Body Socket Strip, Differential Pair

QRF8-RA

0.80 mm Q Rate® High-Speed Ground Plane Slim Body Socket Strip, Right-Angle

Features
  • Performance: Up to 16 GHz / 32 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Low profile (5.13 mm)
  • Up to 156 positions
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
0.80 mm Q Rate® High-Speed Ground Plane Slim Body Socket Strip, Right-Angle

QRM8

0.80 mm Q Rate® Slim Body Ground Plane Header

Features
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Slim 4.60 mm width
  • Extended Life Product™ (E.L.P.™)
  • 7 mm - 14 mm stack heights
  • Up to 156 positions
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
0.80 mm Q Rate® Slim Body Ground Plane Header

QRM8-DP

0.80 mm Q Rate® High-Speed Ground Plane Slim Body Terminal Strip, Differential Pair

Features
  • Performance: Up to 10 GHz / 20 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Slim 4.60 mm width
  • 7 mm - 14 mm stack heights
  • Up to 108 positions
0.80 mm Q Rate®  High-Speed Ground Plane Slim Body Terminal Strip, Differential Pair

QRM8-RA

0.80 mm Q Rate® High-Speed Ground Plane Slim Body Terminal Strip, Right-Angle

Features
  • Performance: Up to 16 GHz / 32 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Low profile (5.13 mm)
  • Up to 156 positions
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
0.80 mm Q Rate® High-Speed Ground Plane Slim Body Terminal Strip, Right-Angle

QSE

0.80 mm Q Strip® High-Speed Ground Plane Socket Strip

Features
  • 0.80 mm (.0315") pitch
  • Up to 200 positions
  • 5 mm - 30 mm stack heights
  • Extended Life Product™ (E.L.P.™)
  • Samtec 28+ Gbps Solution
0.80 mm Q Strip® High-Speed Ground Plane Socket Strip

QSH

0.50 mm Q Strip® High-Speed Ground Plane Socket Strip

Features
  • 0.50 mm (.0197") pitch
  • Up to 300 positions
  • 5 mm - 30 mm stack heights
  • Extended Life Product™ (E.L.P.™)
  • Samtec 28+ Gbps Solution
0.50 mm Q Strip® High-Speed Ground Plane Socket Strip

QTE

0.80 mm Q Strip® High-Speed Ground Plane Terminal Strip

Features
  • 0.80 mm (.0315") pitch
  • Up to 200 positions
  • 5 mm - 30 mm stack heights
  • Extended Life Product™ (E.L.P.™)
  • Samtec 28+ Gbps Solution
0.80 mm Q Strip® High-Speed Ground Plane Terminal Strip

QTH

0.50 mm Q Strip® High-Speed Ground Plane Terminal Strip

Features
  • 0.50 mm (.0197") pitch
  • Up to 300 positions
  • 5 mm - 30 mm stack heights
  • Extended Life Product™ (E.L.P.™)
  • Samtec 28+ Gbps Solution
0.50 mm Q Strip® High-Speed Ground Plane Terminal Strip

SEAF

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm - 17.5 mm stack heights
  • Dual sourced by Molex®
  • Samtec 28+ Gbps Solution
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

SEAF8

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features
  • 0.80 mm (.0315") pitch
  • 50% board space savings versus .050" pitch SEARAY™
  • Rugged Edge Rate® contact system
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm and 10 mm stack heights
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

SEAM

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Dual sourced by Molex®
  • 7 mm - 17.5 mm stack heights
  • Samtec 28+ Gbps Solution
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

SEAM8

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Features
  • 0.80 mm (.0315") pitch
  • 50% board space savings versus .050" pitch SEARAY™
  • Rugged Edge Rate® contact system
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm and 10 mm stack heights
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

SEAMI

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm

Features
  • High-density open-pin-field array
  • Samtec 28+ Gbps Solution
  • 85 ohm tuned
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm

SEM

0.80 mm Tiger Eye™ Micro Socket Strip

Features
  • Pitch: 0.80 mm (.0315")
  • Contact System: Tiger Eye™
  • Orientation: Vertical
  • Termination: Surface mount
  • Application: Polarized double row multi-finger Beryllium Copper contact system to 100 pins
  • Special Features: Locking Clip and Weld Tab options available for most rugged requirements
  • Samtec 28+ Gbps Solution
0.80 mm Tiger Eye™ Micro Socket Strip

SS4

0.40 mm Razor Beam™ LP Ultra Fine Pitch Socket Strip

Features
  • Samtec 28+ Gbps Solution
  • Ultra fine 0.40 mm pitch
  • Stack heights from 4 mm - 6 mm
  • Slim footprint
  • Up to 100 I/Os
0.40 mm Razor Beam™ LP Ultra Fine Pitch Socket Strip

SS5

0.50 mm Razor Beam™ LP Slim Socket Strip

Features
  • Ultra fine 0.50 mm pitch
  • Samtec 28+ Gbps Solution
  • Slim body design for increased board space savings
  • Ultra low mated stack heights down to 4 mm
  • Up to 160 I/Os
  • UL: File # E111594
0.50 mm Razor Beam™ LP Slim Socket Strip

ST4

0.40 mm Razor Beam™ LP Ultra Fine Pitch Terminal Strip

Features
  • Samtec 28+ Gbps Solution
  • Ultra fine 0.40 mm pitch
  • Stack heights from 4 mm - 6 mm
  • Slim footprint
  • Up to 100 I/Os
0.40 mm Razor Beam™ LP Ultra Fine Pitch Terminal Strip

ST5

0.50 mm Razor Beam™ LP Slim Terminal Strip

Features
  • Ultra fine 0.50 mm pitch
  • Samtec 28+ Gbps Solution
  • Slim body design for increased board space savings
  • Ultra low mated stack heights down to 4 mm
  • Up to 160 I/Os
  • UL: File # E111594
0.50 mm Razor Beam™ LP Slim Terminal Strip

TEM

0.80 mm Tiger Eye™ Micro Terminal Strip

Features
  • Pitch: 0.80 mm (.0315")
  • Contact System: 0.31 mm (.012") diameter post
  • Orientation: Vertical, horizontal
  • Termination: Surface mount
  • Application: Mating with high-reliability Tiger Eye™ contact sockets
  • Special Features: Locking Clip and Weld Tab options available for most rugged requirements
  • Samtec 28+ Gbps Solution
0.80 mm Tiger Eye™ Micro Terminal Strip

TPAF

1.50 mm x 1.75 mm High-Speed Elevated Array Receptacle

Features
  • Up to 300 signals, 150 pairs
  • BGA (solder ball) technology
  • Low profile keeps thermal mass low for reflow processing
  • Dual sourced by Hirose® IT5
  • Selective gold Plating
  • UL: File # E111594
1.50 mm x 1.75 mm High-Speed Elevated Array Receptacle

TPAR

1.50 mm X 1.75 mm High-Speed Elevated Array Riser

Features
  • Up to 300 signals, 150 pairs
  • 35 mm stack height standard, 18-40 mm stack height available
  • Dual sourced by Hirose® IT5
  • Selective gold Plating
  • UL: File # E111594
1.50 mm X 1.75 mm High-Speed Elevated Array Riser

ZA1

1.00 mm Ultra Low Profile Micro Array

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 1.00 mm (.0394") pitch
  • Performance up to 14 Gbps
1.00 mm Ultra Low Profile Micro Array

ZA8

0.80 mm Ultra Low Profile Micro Array

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 0.80 mm (.0315") pitch
  • Performance up to 14 Gbps
0.80 mm Ultra Low Profile Micro Array

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