Connectors
High-Speed Board-to-Board
28+ Gbps Solutions
28+ Gbps Solutions

High-speed interconnects that support 28+ Gbps requirements

28+ Gbps Solutions

Samtec has developed a full line of connector products that are designed to support serial speeds of 28 Gbps or more.

FEATURES

  • 0.40 mm, 0.50 mm, 0.80 mm, 0.635 mm, 1.00 mm, .050" or 2.00 mm pitch
  • Pin counts from 10 to 500
  • Stack heights from 1 mm to 30 mm
  • Vertical and horizontal orientations

SERIES

ERF5

0.50 mm Edge Rate® Rugged High-Speed Socket Strip

Features
  • Rugged Edge Rate® contact
  • Smooth broad milled contact surface for increased wear life
  • Positions: Up to 150
  • Stack height: 7.00 mm - 12.00 mm
  • Final Inch® break out region data available
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.50 mm Edge Rate® Rugged High-Speed Socket Strip

ERF8

0.80 mm Edge Rate® Rugged High-Speed Socket Strip

Features
  • Rugged Edge Rate® contact
  • Smooth broad milled contact surface for increased wear life
  • Positions: Up to 200
  • Stack Height: 7.00 mm - 16.00 mm
  • Final Inch® break out region data available
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Edge Rate® Rugged High-Speed Socket Strip

ERM5

0.50 mm Edge Rate® Rugged High-Speed Terminal Strip

Features
  • Rugged Edge Rate® contact
  • Smooth broad milled contact surface for increased wear life
  • Positions: Up to 150
  • Stack height: 7.00 mm - 12.00 mm
  • Final Inch® break out region data available
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.50 mm Edge Rate® Rugged High-Speed Terminal Strip

ERM8

0.80 mm Edge Rate® Rugged High-Speed Terminal Strip

Features
  • Rugged Edge Rate® contact
  • Smooth broad milled contact surface for increased wear life
  • Positions: Up to 200
  • Stack Height: 7.00 mm - 16.00 mm
  • Final Inch® break out region data available
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Edge Rate® Rugged High-Speed Terminal Strip

HSEC8-DV

0.80 mm Edge Rate® High-Speed Edge Card Connector, Vertical

Features
  • Rugged Edge Rate® contact
  • Single-ended and differential pairs
  • Card slot: .062" (1.60 mm)
  • Pass-through option available (HSEC8-PE)
  • Optional board locks and cable latching features
  • Optional weld tab for mechanical strength
  • Samtec 28+ Gbps Solution
  • Extended Life Product™ (E.L.P.™)
Downloads
More Information
0.80 mm Edge Rate® High-Speed Edge Card Connector, Vertical

HSEC8-DV

0.80 mm Edge Rate® High-Speed Edge Card Connector, Vertical

Features
  • Rugged Edge Rate® contact
  • Single-ended and differential pairs
  • Card slot: .062" (1.60 mm)
  • Pass-through option available (HSEC8-PE)
  • Optional board locks and cable latching features
  • Optional weld tab for mechanical strength
  • Samtec 28+ Gbps Solution
  • Extended Life Product™ (E.L.P.™)
Downloads
More Information
0.80 mm Edge Rate® High-Speed Edge Card Connector, Vertical

HSEC8-PV

0.80 mm Edge Rate® High-Speed Edge Card Power Combo Connector

Features
  • Rugged Edge Rate® contact
  • Card slot: .062" (1.60 mm)
  • Choice of 2 or 4 power banks
  • Optional weld tab for mechanical strength
  • Samtec 28+ Gbps Solution
  • Extended Life Product™ (E.L.P.™)
  • UL: File # E111594
Downloads
More Information
0.80 mm Edge Rate® High-Speed Edge Card Power Combo Connector

HSEC8-PV

0.80 mm Edge Rate® High-Speed Edge Card Power Combo Connector

Features
  • Rugged Edge Rate® contact
  • Card slot: .062" (1.60 mm)
  • Choice of 2 or 4 power banks
  • Optional weld tab for mechanical strength
  • Samtec 28+ Gbps Solution
  • Extended Life Product™ (E.L.P.™)
  • UL: File # E111594
Downloads
More Information
0.80 mm Edge Rate® High-Speed Edge Card Power Combo Connector

LPAF

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

Features
  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
Downloads
More Information
.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

LPAM

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

Features
  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
Downloads
More Information
.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

LSEM

0.80 mm Razor Beam™ High-Speed Hermaphroditic Terminal/Socket Strip

Features
  • Six stack height options from 6.00 mm to 12.00 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Self-mating system reduces inventory cost
  • Up to 100 I/Os
  • Vertical and right-angle orientations
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Razor Beam™ High-Speed Hermaphroditic Terminal/Socket Strip

MEC2-DV

2.00 mm Mini Edge Card Connector, Vertical

Features
  • 2.00 mm (.0787") pitch
  • Accepts .062" (1.60 mm) and .093" (2.36 mm) thick cards
  • Double row design up to 100 pins polarized
  • Rugged weld tab option
  • Samtec 28+ Gbps Solution
Downloads
More Information
2.00 mm Mini Edge Card Connector, Vertical

MECF-DV

.050" Mini Edge Card Connector, Vertical

Features
  • .050" (1.27 mm) pitch
  • Accepts .062" (1.60 mm) and .093" (2.36 mm) thick cards
  • Double row design up to 100 pins polarized
  • Rugged weld tab option
  • Samtec 28+ Gbps Solution
Downloads
More Information
.050" Mini Edge Card Connector, Vertical

QFS

0.635 mm Q2™ High-Speed Rugged Ground Plane Socket Strip

Features
  • 0.635 mm pitch (.025")
  • Up to 208 positions
  • Guide post option
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.635 mm Q2™ High-Speed Rugged Ground Plane Socket Strip

QMS

0.635 mm Q2™ High-Speed Rugged Ground Plane Terminal Strip

Features
  • 0.635 mm pitch (.025")
  • Up to 208 positions
  • Guide post option
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.635 mm Q2™ High-Speed Rugged Ground Plane Terminal Strip

QRF8

0.80 mm Q Rate® Slim Body Ground Plane Socket

Features
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Slim 4.60 mm width
  • Extended Life Product™ (E.L.P.™)
  • 7 mm - 14 mm stack heights
  • Up to 156 positions
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Q Rate® Slim Body Ground Plane Socket

QRF8-DP

0.80 mm Q Rate® High-Speed Ground Plane Slim Body Socket Strip, Differential Pair

Features
  • Performance: Up to 10 GHz / 20 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Slim 4.60 mm width
  • 7 mm - 14 mm stack heights
  • Up to 108 positions
Downloads
More Information
0.80 mm Q Rate® High-Speed Ground Plane Slim Body Socket Strip, Differential Pair

QRF8-RA

0.80 mm Q Rate® High-Speed Ground Plane Slim Body Socket Strip, Right-Angle

Features
  • Performance: Up to 16 GHz / 32 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Low profile (5.13 mm)
  • Up to 156 positions
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Q Rate® High-Speed Ground Plane Slim Body Socket Strip, Right-Angle

QRM8

0.80 mm Q Rate® Slim Body Ground Plane Header

Features
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Slim 4.60 mm width
  • Extended Life Product™ (E.L.P.™)
  • 7 mm - 14 mm stack heights
  • Up to 156 positions
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Q Rate® Slim Body Ground Plane Header

QRM8-DP

0.80 mm Q Rate® High-Speed Ground Plane Slim Body Terminal Strip, Differential Pair

Features
  • Performance: Up to 10 GHz / 20 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Slim 4.60 mm width
  • 7 mm - 14 mm stack heights
  • Up to 108 positions
Downloads
More Information
0.80 mm Q Rate® High-Speed Ground Plane Slim Body Terminal Strip, Differential Pair

QRM8-RA

0.80 mm Q Rate® High-Speed Ground Plane Slim Body Terminal Strip, Right-Angle

Features
  • Performance: Up to 16 GHz / 32 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Low profile (5.13 mm)
  • Up to 156 positions
  • Dual sourced By Hirose®
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Q Rate® High-Speed Ground Plane Slim Body Terminal Strip, Right-Angle

QSE

0.80 mm Q Strip® High-Speed Ground Plane Socket Strip

Features
  • 0.80 mm (.0315") pitch
  • Up to 200 positions
  • 5 mm - 30 mm stack heights
  • Extended Life Product™ (E.L.P.™)
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Q Strip® High-Speed Ground Plane Socket Strip

QSH

0.50 mm Q Strip® High-Speed Ground Plane Socket Strip

Features
  • 0.50 mm (.0197") pitch
  • Up to 300 positions
  • 5 mm - 30 mm stack heights
  • Extended Life Product™ (E.L.P.™)
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.50 mm Q Strip® High-Speed Ground Plane Socket Strip

QTE

0.80 mm Q Strip® High-Speed Ground Plane Terminal Strip

Features
  • 0.80 mm (.0315") pitch
  • Up to 200 positions
  • 5 mm - 30 mm stack heights
  • Extended Life Product™ (E.L.P.™)
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Q Strip® High-Speed Ground Plane Terminal Strip

QTH

0.50 mm Q Strip® High-Speed Ground Plane Terminal Strip

Features
  • 0.50 mm (.0197") pitch
  • Up to 300 positions
  • 5 mm - 30 mm stack heights
  • Extended Life Product™ (E.L.P.™)
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.50 mm Q Strip® High-Speed Ground Plane Terminal Strip

SEAF

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm - 17.5 mm stack heights
  • Dual sourced by Molex®
  • Samtec 28+ Gbps Solution
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
Downloads
More Information
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

SEAF8

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features
  • 0.80 mm (.0315") pitch
  • 50% board space savings versus .050" pitch SEARAY™
  • Rugged Edge Rate® contact system
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm and 10 mm stack heights
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

SEAM

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Dual sourced by Molex®
  • 7 mm - 17.5 mm stack heights
  • Samtec 28+ Gbps Solution
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
Downloads
More Information
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

SEAM8

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Features
  • 0.80 mm (.0315") pitch
  • 50% board space savings versus .050" pitch SEARAY™
  • Rugged Edge Rate® contact system
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm and 10 mm stack heights
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

SEAMI

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm

Features
  • High-density open-pin-field array
  • Samtec 28+ Gbps Solution
  • 85 ohm tuned
Downloads
More Information
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm

SEM

0.80 mm Tiger Eye™ Micro Socket Strip

Features
  • Pitch: 0.80 mm (.0315")
  • Contact System: Tiger Eye™
  • Orientation: Vertical
  • Termination: Surface mount
  • Application: Polarized double row multi-finger Beryllium Copper contact system to 100 pins
  • Special Features: Locking Clip and Weld Tab options available for most rugged requirements
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Tiger Eye™ Micro Socket Strip

SS4

0.40 mm Razor Beam™ LP Ultra Fine Pitch Socket Strip

Features
  • Samtec 28+ Gbps Solution
  • Ultra fine 0.40 mm pitch
  • Stack heights from 4 mm - 6 mm
  • Slim footprint
  • Up to 100 I/Os
Downloads
More Information
0.40 mm Razor Beam™ LP Ultra Fine Pitch Socket Strip

SS5

0.50 mm Razor Beam™ LP Slim Socket Strip

Features
  • Ultra fine 0.50 mm pitch
  • Samtec 28+ Gbps Solution
  • Slim body design for increased board space savings
  • Ultra low mated stack heights down to 4 mm
  • Up to 160 I/Os
  • UL: File # E111594
Downloads
More Information
0.50 mm Razor Beam™ LP Slim Socket Strip

ST4

0.40 mm Razor Beam™ LP Ultra Fine Pitch Terminal Strip

Features
  • Samtec 28+ Gbps Solution
  • Ultra fine 0.40 mm pitch
  • Stack heights from 4 mm - 6 mm
  • Slim footprint
  • Up to 100 I/Os
Downloads
More Information
0.40 mm Razor Beam™ LP Ultra Fine Pitch Terminal Strip

ST5

0.50 mm Razor Beam™ LP Slim Terminal Strip

Features
  • Ultra fine 0.50 mm pitch
  • Samtec 28+ Gbps Solution
  • Slim body design for increased board space savings
  • Ultra low mated stack heights down to 4 mm
  • Up to 160 I/Os
  • UL: File # E111594
Downloads
More Information
0.50 mm Razor Beam™ LP Slim Terminal Strip

TEM

0.80 mm Tiger Eye™ Micro Terminal Strip

Features
  • Pitch: 0.80 mm (.0315")
  • Contact System: 0.31 mm (.012") diameter post
  • Orientation: Vertical, horizontal
  • Termination: Surface mount
  • Application: Mating with high-reliability Tiger Eye™ contact sockets
  • Special Features: Locking Clip and Weld Tab options available for most rugged requirements
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Tiger Eye™ Micro Terminal Strip

TPAF

1.50 mm x 1.75 mm High-Speed Elevated Array Receptacle

Features
  • Up to 300 signals, 150 pairs
  • BGA (solder ball) technology
  • Low profile keeps thermal mass low for reflow processing
  • Dual sourced by Hirose® IT5
  • Selective gold Plating
  • UL: File # E111594
Downloads
More Information
1.50 mm x 1.75 mm High-Speed Elevated Array Receptacle

TPAR

1.50 mm X 1.75 mm High-Speed Elevated Array Riser

Features
  • Up to 300 signals, 150 pairs
  • 35 mm stack height standard, 18-40 mm stack height available
  • Dual sourced by Hirose® IT5
  • Selective gold Plating
  • UL: File # E111594
Downloads
More Information
1.50 mm X 1.75 mm High-Speed Elevated Array Riser

ZA1

1.00 mm Ultra Low Profile Micro Array

Features
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os
  • 1.00 mm (.0394") pitch
  • Samtec 28+ Gbps Solution
Downloads
More Information
1.00 mm Ultra Low Profile Micro Array

ZA8

0.80 mm Ultra Low Profile Micro Array

Features
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os
  • 0.80 mm (.0315") pitch
  • Samtec 28+ Gbps Solution
Downloads
More Information
0.80 mm Ultra Low Profile Micro Array

More 28+ Gbps Solutions

SAMTEC Blog

You can do a lot in three minutes.  From counting to 180 to making toast, the possibilities are endless.  However, our good friend Steve Leibson at Xilinx, encourages you to use your three minutes to take a look at our new video featuring Samtec’s FQSFP cable on Xilinx VCU118 FPG...
[Read More]
The battle for next-generation optical transceivers remains active. The three leading specifications duking it out include COBO, OSFP and QSFP-DD.  While all have their pros and cons, the industry continues to sort out the best solutions for the front panel and mid-board optical ...
[Read More]
Glass Weave Skew. For most people it probably sounds like a progressive rock band. But we’re talking about Glass Weave Skew and differential signals. Brandon Gore, Senior Staff Signal Integrity Engineer, and the Manager of Samtec’s Signal Integrity Group, R&D Hub recently present...
[Read More]
Who doesn’t like something new? Maybe it’s that new smell, a new flavor, or a new feature that draws you in each and every time. Well, we love new things around here and are excited to share the new Product Overview Guide. It might not smell or taste new, but it is packed with ne...
[Read More]
With our last web update, we brought you continued Phase 2 updates to our new our on-site search capabilities, as well as several updates to key content pages. In August, we continued the tweaks to our new on-site search, and also released a new experience for our Microelectronic...
[Read More]
© 2017 Samtec. All rights reserved.

SPEAK WITH A REPRESENTATIVE

1-800-726-8329

1-800-SAMTEC-9

1-812-944-6733

WEBSITE OR PRODUCT SUPPORT

eCustomerService@samtec.com

Live Chat

ABOUT US

CONTACT US

Samtec Logo

© 2017 Samtec. All rights reserved.

View Full Site