Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. These high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.
NovaRay® combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.
AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design. View the full line of AcceleRate® products.
These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.
These low profile open-pin-field arrays feature as low as a 4 mm stack height and up to 400 total I/Os.
High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.
ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.
Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.