High-Density Arrays

High-density grid arrays on a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.


Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra-Low Profile Arrays

SEARAY™SEARAY™ High-Density Open Pin Field Arrays

These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • Up to 500 I/Os in open pin field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 17 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Series
V
  • JSO
  • SEAF
  • SEAFP
  • SEAFP-RA
  • SEAF-RA
  • SEAM
  • SEAMI
  • SEAMP
  • SEAM-RA
  • SEAR
  • UBPS
  • UBPT
SEARAY™

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
Series
V
  • JSO
  • SEAF8
  • SEAF8-RA
  • SEAM8
  • UBPS
  • UBPT
SEARAY™ 0.80 mm

Low Profile One-Piece ArraysLow Profile One-Piece Compression Arrays

High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

Features
  • 1.27 mm and 2 mm standard body heights
  • 1.00 mm pitch
  • Dual compression or single compression with solder balls
  • 100 – 400 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
Series
V
  • GMI
Low Profile One-Piece Arrays

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
Series
V
  • JSO
  • LPAF
  • LPAM
LP Array™

ExaMAX®Samtec ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 28 Gbps electrical performance while offering a migration path to 56 Gbps.

Features
  • Enables 28 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
Series
V
  • EBDM-RA
  • EBTF-RA
  • EBTM
  • EGBF
  • EGBM
  • EPTS
  • EPTT
ExaMAX®

SkyRay™SkyRay™ High-Speed Elevated Arrays

This three-piece system features crosstalk-canceling technology delivering 28+ Gbps performance at elevated stack heights.

Features
  • Three-piece system
  • Crosstalk canceling technology
  • 28+ Gbps solution
  • 35 mm standard stack height aids in system airflow
  • Three-piece system reduces thermal mass during processing
  • 50, 100, and 150 differential pairs
  • 18 mm – 40 mm stack heights available
  • 1.50 mm x 1.75 mm pitch
  • Dual sourced By Hirose®
Series
V
  • TPAF
  • TPAR
SkyRay™

DP Array®Dedicated Differential Pair DP Array®

Dedicated differential pair, high-density arrays designed for performance up to a terabit per connector.

Features
  • Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
  • No return paths needed
  • Fewer board layers required
  • Performance: Up to 4 GHz per pair (up to a terabit per connector)
  • Up to 168 usable pairs
  • 10 mm stack height
  • Lower insertion / extraction forces
  • Solder crimp termination
Series
V
  • DPAF
  • DPAM
DP Array®

HD MezzHD Mezz

Elevated high-density open pin field arrays up to 35 mm stack heights.

Features
  • Application specific capability to stack heights from 20 mm to 35 mm
  • Open pin field design
  • Performance: Up to 9 GHz / 18 Gbps
  • Integrated guide posts to minimize contact damage when mating and unmating
  • Solder charge terminations for ease of processing
  • 2.00 mm x 1.20 mm pitch
  • Up to 299 I/Os
  • Intermateable with Molex HD Mezz Arrays
  • HD Mezz is a trademark of Molex Incorporated
Series
V
  • HDAF
  • HDAM
HD Mezz

Our friends at Connector Supplier keep the world up-to-date on everything in the connector universe.  They recently ran an article from Samtec entitled Rugged Industrial Interconnects:  The Design Behind The Description. Many industrial electronics OEM designers use the word “rug...
It seems FPGAs are getting bigger and faster all the time. FPGA vendors continue to integrate more transceivers running at higher speeds in their newest ICs.  As an example, the Xilinx Virtex UltraScale+ VU13P FPGA contains 128 GTY transceivers running data rates up to 32.75 Gbps...
Every year Samtec releases a new catalog showcasing our full line of products. The latest F-217 Full Line Catalog features new products and technology that enable us to provide overall system optimization from Silicon-to-Silicon. The combination of Samtec’s ultra fast, ultra dens...
The growth in high-speed serial channel data rates has no end in sight.  28 Gbps design starts abound across the industry.  56 Gbps PAM-4 solutions are coming down the road, whether silicon, interconnect or high-speed copper and optical cables. On the optical front, the front-pan...
In last month’s update, we brought you an updated way to order your samples from our Solutionator parametric search tool. In February, we rolled that out on an even larger scale, with this feature being added to a new full-part technical specifications page experience (more about...
View Full Site