High-Density Arrays

High-density grid arrays on a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.

ExaMAX®Samtec ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 28 Gbps electrical performance while offering a migration path to 56 Gbps.

  • Enables 28 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
  • EBTM
  • EGBF
  • EGBM
  • EPTS
  • EPTT

SEARAY™SEARAY™ High-Density Open Pin Field Arrays

These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • Up to 500 I/Os in open pin field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 17 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • JSO
  • SEAF
  • SEAM
  • SEAR
  • UBPS
  • UBPT
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SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
  • JSO
  • SEAF8
  • SEAF8-RA
  • SEAM8
  • UBPS
  • UBPT
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SEARAY™ 0.80 mm

Z-Ray® Ultra Low Profile InterposersZ-Ray® Ultra Low Profile Interposers

Z-Ray® ultra low profile, high-density one-piece arrays with compression contacts.

  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra Low Profile Interposers

SkyRay™SkyRay™ High-Speed Elevated Arrays

This three-piece system features crosstalk-canceling technology delivering 28+ Gbps performance at elevated stack heights.

  • Three-piece system
  • Crosstalk canceling technology
  • 28+ Gbps solution
  • 35 mm standard stack height aids in system airflow
  • Three-piece system reduces thermal mass during processing
  • 50, 100, and 150 differential pairs
  • 18 mm – 40 mm stack heights available
  • 1.50 mm x 1.75 mm pitch
  • Dual sourced By Hirose®
  • TPAF
  • TPAR
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DP Array®Dedicated Differential Pair DP Array®

Dedicated differential pair, high-density arrays designed for performance up to a terabit per connector.

  • Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
  • No return paths needed
  • Fewer board layers required
  • Performance: Up to 4 GHz per pair (up to a terabit per connector)
  • Up to 168 usable pairs
  • 10 mm stack height
  • Lower insertion / extraction forces
  • Solder crimp termination
  • DPAF
  • DPAM
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DP Array®

HD MezzHD Mezz

Elevated high-density open pin field arrays up to 35 mm stack heights.

  • Application specific capability to stack heights from 20 mm to 35 mm
  • Open pin field design
  • Performance: Up to 9 GHz / 18 Gbps
  • Integrated guide posts to minimize contact damage when mating and unmating
  • Solder charge terminations for ease of processing
  • 2.00 mm x 1.20 mm pitch
  • Up to 299 I/Os
  • Intermateable with Molex HD Mezz Arrays
  • HD Mezz is a trademark of Molex Incorporated
  • HDAF
  • HDAM
HD Mezz

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
  • JSO
  • LPAF
  • LPAM
LP Array™

IMAPS – International Microelectronics Assembly and Packaging Society – in one of the biggest events of the year in the IC Package and Assembly industry. Last week at IMAPS 2016, Samtec Microelectronics highlighted our world-class complex package and assembly capabilities and our...
Engineers constantly face challenges routing multi-gigabit transceivers  (MGTs) throughout their systems.  The new Avnet Zynq Transceiver Evaluation Kit (AZTEK) provides a low-cost reference design that streamlines evaluation of FPGA SoC MGTs that require transmission of large am...
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Engineers need constant updates on the latest technology trends, design tips, new product information and other relevant design-oriented topics.  The latest version of Avnet’s AXIOM online magazine is a great source dedicated to these purposes. The latest issue of AXIOM focuses o...
Samtec is pleased to announce a new ChalkTalk entitled “Expanding the Backplane Ecosystem.” Hosted by EEJournal, this newly released ChalkTalk details the growing backplane connector portfolio from Samtec. Samtec entered the backplane connector market by licensing FCI’s ExaMAX® H...
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