High-Density Arrays

High-density grid arrays on a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.


Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® High-Density, Ultra-Low Profile, Highly Customizable Arrays

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra-Low Profile Arrays

SEARAY™SEARAY™ High-Density Open Pin Field Arrays

These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • Up to 500 I/Os in open pin field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 17 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Series
V
  • JSO
  • SEAF
  • SEAFP
  • SEAFP-RA
  • SEAF-RA
  • SEAM
  • SEAMI
  • SEAMP
  • SEAM-RA
  • SEAR
  • UBPS
  • UBPT
SEARAY™

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
Series
V
  • JSO
  • SEAF8
  • SEAF8-RA
  • SEAM8
  • UBPS
  • UBPT
SEARAY™ 0.80 mm

NovaRay™NovaRay ™ 112 Gbps PAM4, Extreme Density Arrays

NovaRay™ combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.

Features
  • 112 Gbps PAM4 per channel
  • 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
  • Innovative, fully shielded differential pair design enables extremely low crosstalk (to 40 GHz) and tight impedance control
  • 112 differential pairs per square inch
  • Two points of contact ensure a more reliable connection
  • 92 Ω solution addresses both 85 Ω and 100 Ω applications
Series
V
  • NVAC
  • NVAF
  • NVAM
  • NVAM-C
NovaRay™

Low Profile One-Piece ArraysLow Profile One-Piece Compression Arrays

High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

Features
  • 1.27 mm and 2 mm standard body heights
  • 1.00 mm pitch
  • Dual compression or single compression with solder balls
  • 100 – 400 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
Series
V
  • GMI
Low Profile One-Piece Arrays

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
Series
V
  • JSO
  • LPAF
  • LPAM
LP Array™

ExaMAX®Samtec ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.

Features
  • Enables 56 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
Series
V
  • EBDM-RA
  • EBTF-RA
  • EBTM
  • EGBF
  • EGBM
  • EPTS
  • EPTT
ExaMAX®

SkyRay™SkyRay™ High-Speed Elevated Arrays

This three-piece system features crosstalk-canceling technology delivering 28+ Gbps performance at elevated stack heights.

Features
  • Three-piece system
  • Crosstalk canceling technology
  • 28+ Gbps solution
  • 35 mm standard stack height aids in system airflow
  • Three-piece system reduces thermal mass during processing
  • 50, 100, and 150 differential pairs
  • 18 mm – 40 mm stack heights available
  • 1.50 mm x 1.75 mm pitch
  • Dual sourced By Hirose®
Series
V
  • TPAF
  • TPAR
SkyRay™

DP Array®Dedicated Differential Pair DP Array®

Dedicated differential pair, high-density arrays designed for performance up to a terabit per connector.

Features
  • Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
  • No return paths needed
  • Fewer board layers required
  • Performance: Up to 4 GHz per pair (up to a terabit per connector)
  • Up to 168 usable pairs
  • 10 mm stack height
  • Lower insertion / extraction forces
  • Solder crimp termination
Series
V
  • DPAF
  • DPAM
DP Array®

HD MezzHD Mezz

Elevated high-density open pin field arrays up to 35 mm stack heights.

Features
  • Application specific capability to stack heights from 20 mm to 35 mm
  • Open pin field design
  • Performance: Up to 9 GHz / 18 Gbps
  • Integrated guide posts to minimize contact damage when mating and unmating
  • Solder charge terminations for ease of processing
  • 2.00 mm x 1.20 mm pitch
  • Up to 299 I/Os
  • Intermateable with Molex HD Mezz Arrays
  • HD Mezz is a trademark of Molex Incorporated
Series
V
  • HDAF
  • HDAM
HD Mezz

It’s been over a year since we last updated the Samtec homepage. As you may have already noticed, we recently took some time to refresh it. You can see a comparison below of the old homepage (top), vs the new homepage (bottom). The new update puts more attention on our high speed...
If you manufacture overseas and ship into the U.S.A, you may have a longer waiting time in Customs than you would prefer.  Some of this waiting time could be eliminated by becoming part of the Customs Trade Partnership Against Terrorism (C-TPAT), one layer of the U.S. Customs and...
Just about everybody wishes they had more time to pursue a hobby or a side project.  Some aspire to be painters or furniture makers.  Others like to rebuild cars.  Even others enjoy electronics in any form. The Maker Movement attracts and caters to tinkerers, hobbyists, students ...
Demand For High Data Rate As the need for bandwidth continues to increase, so does the need for higher data rates within a system. What was once one to three Gbps, then moved to 4 to 8 Gbps, and now we are approaching 28 Gbps and looking forward to 56 G. This trend was recently [...
Samtec is pleased to announce the new Silicon-to-Silicon Application Solutions Guide. This updated guide details the evolution of Samtec technologies, products and technical support available for next-gen system data rates. 56 Gbps PAM4. 56 Gbps NRZ. 112 Gbps PAM4. Whatever the d...
View Full Site