High-Density Arrays

High-density grid arrays on a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.

ExaMAX®Samtec ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 28 Gbps electrical performance while offering a migration path to 56 Gbps.

  • Enables 28 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
  • EBTM
  • EGBF
  • EGBM
  • EPTS
  • EPTT

SEARAY™SEARAY™ High-Density Open Pin Field Arrays

These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • Up to 500 I/Os in open pin field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 17 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • JSO
  • SEAF
  • SEAM
  • SEAR
  • UBPS
  • UBPT
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SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
  • JSO
  • SEAF8
  • SEAF8-RA
  • SEAM8
  • UBPS
  • UBPT
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SEARAY™ 0.80 mm

Z-Ray® Ultra Low Profile InterposersZ-Ray® Ultra Low Profile Interposers

Z-Ray® ultra low profile, high-density one-piece arrays with compression contacts.

  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra Low Profile Interposers

SkyRay™SkyRay™ High-Speed Elevated Arrays

This three-piece system features crosstalk-canceling technology delivering 28+ Gbps performance at elevated stack heights.

  • Three-piece system
  • Crosstalk canceling technology
  • 28+ Gbps solution
  • 35 mm standard stack height aids in system airflow
  • Three-piece system reduces thermal mass during processing
  • 50, 100, and 150 differential pairs
  • 18 mm – 40 mm stack heights available
  • 1.50 mm x 1.75 mm pitch
  • Dual sourced By Hirose®
  • TPAF
  • TPAR
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DP Array®Dedicated Differential Pair DP Array®

Dedicated differential pair, high-density arrays designed for performance up to a terabit per connector.

  • Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
  • No return paths needed
  • Fewer board layers required
  • Performance: Up to 4 GHz per pair (up to a terabit per connector)
  • Up to 168 usable pairs
  • 10 mm stack height
  • Lower insertion / extraction forces
  • Solder crimp termination
  • DPAF
  • DPAM
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DP Array®

HD MezzHD Mezz

Elevated high-density open pin field arrays up to 35 mm stack heights.

  • Application specific capability to stack heights from 20 mm to 35 mm
  • Open pin field design
  • Performance: Up to 9 GHz / 18 Gbps
  • Integrated guide posts to minimize contact damage when mating and unmating
  • Solder charge terminations for ease of processing
  • 2.00 mm x 1.20 mm pitch
  • Up to 299 I/Os
  • Intermateable with Molex HD Mezz Arrays
  • HD Mezz is a trademark of Molex Incorporated
  • HDAF
  • HDAM
HD Mezz

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
  • JSO
  • LPAF
  • LPAM
LP Array™

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Samtec proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System optimized for high-density and high-speed performance. The scalable ExaMAX® system meets today’s data rates while providing a future-proof path for next generation architectures. The ExaMA...
Engineers need constant updates on the latest technology trends, design tips, new product information and other relevant design-oriented topics.  The latest version of Avnet’s AXIOM online magazine is a great source dedicated to these purposes. The latest issue of AXIOM focuses o...
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