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triangle alert Our manufacturing capacity has been influenced by this pandemic, but our global operations team has been working tirelessly to maximize our output and minimize the impact to all our customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. You can access real-time lead times online within your account, chat, or call us anytime for the latest information. ×

High-Speed Interconnect Solutions


Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.

High-Speed
Performance

Application
Flexibility

Signal Integrity
Support

High-Speed Interconnect Solutions


Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.

High-Speed
Performance

  • Speeds to 112 Gbps PAM4
  • More than 4.0 Tbps of
    aggregate bandwidth
  • Extremely low crosstalk to 40 GHz

Application
Flexibility

  • 10-3,000 positions
  • 0.33 mm - 40 mm stack heights
  • Vertical, right-angle, edge mount

Signal Integrity
Support

  • Free test reports, models, app notes,
    Break Out Region
  • Easy access to live EE support
  • Online tools: Simulator™
    and Channelyzer®

High-Speed Performance


High speeds & increased bandwidth with optimized signal integrity

16 Gbps
guide posts
28 Gbps
board standoffs

Speeds for now
and the future

High-Speed Performance


High speeds & increased bandwidth with optimized signal integrity

16 Gbps
guide posts
28 Gbps
board standoffs

Speeds for now
and the future

Application FLexibility


A wide range of options to meet the demands of any high-speed, high-density application

High-Density Arrays
Pitch: 0.65, 0.80, 1.00 and 1.27 mm. Pin Count: 8 - 720 positions. Stack Height: 0.33 - 40 mm. Options: Right-angle, press-fit, 85 Ω tuned, mating/alignment hardware, standoffs, mating cables.
Edge Rate® Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 10 - 200 positions. Stack Height: 5 - 18 mm. Options: Right-angle, edge mount, differential pair, hot swap, latching, guide post, 360º shielding, mating cables.
Ground Plane Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 40 - 156 positions. Stack Height: 5 - 25 mm. Options: Right-angle, edge mount, differential pair, plastic/metal guide post, power, retention, RF, shielding, mating cable.
Ultra Micro Interconnects
Pitch: 0.40, 0.50 0.635 and 0.80 mm. Pin Count: 10 - 400 positions. Stack Height: 2 - 12 mm. Options:  Standard or reverse right-angle, 360º shielding, alignment pin, locking, mating cable.
Edge Card Systems
Pitch: 0.50, 0.60, 0.635, 0.80, 1.00, 1.27 and 2.00 mm. Pin Count: 10 - 300 positions. Orientation: Vertical, right-angle, edge mount, pass-through. Options:  Power/signal combo, press-fit, PCI Express®, justification beam, differential pair, locking, latching, mating cable.
High-Speed Backplane Systems
Pitch: 1.80 and 2.00 mm. Pin Count: 12 – 72 pairs (3, 4 & 6 pairs/column). Columns: 6, 8, 10 & 12. Options: Vertical, right-angle, coplanar, direct mate orthogonal, cable assembly, power, guidance, keying, staging, end walls.

Application FLexibility


A wide range of options to meet the demands of any high-speed, high-density application

High-Density Arrays
Pitch: 0.65, 0.80, 1.00 and 1.27 mm. Pin Count: 8 - 720 positions. Stack Height: 0.33 - 40 mm. Options: Right-angle, press-fit, 85 Ω tuned, mating/alignment hardware, standoffs, mating cables.
Edge Rate® Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 10 - 200 positions. Stack Height: 5 - 18 mm. Options: Right-angle, edge mount, differential pair, hot swap, latching, guide post, 360º shielding, mating cables.
Ground Plane Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 40 - 156 positions. Stack Height: 5 - 25 mm. Options: Right-angle, edge mount, differential pair, plastic/metal guide post, power, retention, RF, shielding, mating cable.
Ultra Micro Interconnects
Pitch: 0.40, 0.50 0.635 and 0.80 mm. Pin Count: 10 - 400 positions. Stack Height: 2 - 12 mm. Options:  Standard or reverse right-angle, 360º shielding, alignment pin, locking, mating cable.
Edge Card Systems
Pitch: 0.50, 0.60, 0.635, 0.80, 1.00, 1.27 and 2.00 mm. Pin Count: 10 - 300 positions. Orientation: Vertical, right-angle, edge mount, pass-through. Options:  Power/signal combo, press-fit, PCI Express®, justification beam, differential pair, locking, latching, mating cable.
High-Speed Backplane Systems
Pitch: 1.80 and 2.00 mm. Pin Count: 12 – 72 pairs (3, 4 & 6 pairs/column). Columns: 6, 8, 10 & 12. Options: Vertical, right-angle, coplanar, direct mate orthogonal, cable assembly, power, guidance, keying, staging, end walls.

Signal Integrity Support


In-house signal integrity expertise for complex applications

White Papers
Test Reports
Electrical/Mechanical Models
Electrical/Mechanical Models
Break out Region
Break out Region

Online Tools

Solutionator LogoShadow
Simulator LogoShadow
Channelyzer LogoShadow

samtec technology centers

High-Performance System Design & Support from Silicon-to-Silicon™


system optimization sig

System SIGNAL INTEGRITY

Full channel signal and power integrity analysis, testing and validation services
sig@samtec.com

system optimization sog

OPTICs

R&D, design, development and support of micro optical engines and assemblies
optics@samtec.com

system optimization aid

Advanced
Interconnects

High precision stamping, plating, molding and automated assembly
asg@samtec.com

system optimization sme

microelectronics

Advanced IC packaging design, support and manufacturing capabilities
sme@samtec.com

system optimization hsc1

HIGH–SPEED CABLE

In-house R&D and manufacturing of precision extruded cable and assemblies
hdr@samtec.com

system optimization rf

PRECISION RF

RF interconnect design and development expertise, with testing to 70 GHz
rftechnicalgroup@samtec.com

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