High-Speed Interconnect Solutions


Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.

High-Speed
Performance

Application
Flexibility

Signal Integrity
Support

High-Speed Interconnect Solutions


Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.

High-Speed
Performance

  • Speeds to 112 Gbps PAM4
  • More than 4.0 Tbps of
    aggregate bandwidth
  • Extremely low crosstalk to 40 GHz

Application
Flexibility

  • 10-3,000 positions
  • 0.33 mm - 40 mm stack heights
  • Vertical, right-angle, edge mount

Signal Integrity
Support

  • Free test reports, models, app notes,
    Break Out Region
  • Easy access to live EE support
  • Online tools: Simulator™
    and Channelyzer®

High-Speed Performance


High speeds & increased bandwidth with optimized signal integrity

16 Gbps
guide posts
28 Gbps
board standoffs

Speeds for now
and the future

High-Speed Performance


High speeds & increased bandwidth with optimized signal integrity

16 Gbps
guide posts
28 Gbps
board standoffs

Speeds for now
and the future

Application FLexibility


A wide range of options to meet the demands of any high-speed, high-density application

High-Density Arrays
Pitch: 0.65, 0.80, 1.00 and 1.27 mm. Pin Count: 8 - 720 positions. Stack Height: 0.33 - 40 mm. Options: Right-angle, press-fit, 85 Ω tuned, mating/alignment hardware, standoffs, mating cables.
Edge Rate® Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 10 - 200 positions. Stack Height: 5 - 18 mm. Options: Right-angle, edge mount, differential pair, hot swap, latching, guide post, 360º shielding, mating cables.
Ground Plane Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 40 - 156 positions. Stack Height: 5 - 25 mm. Options: Right-angle, edge mount, differential pair, plastic/metal guide post, power, retention, RF, shielding, mating cable.
Ultra Micro Interconnects
Pitch: 0.40, 0.50 0.635 and 0.80 mm. Pin Count: 10 - 400 positions. Stack Height: 2 - 12 mm. Options:  Standard or reverse right-angle, 360º shielding, alignment pin, locking, mating cable.
Edge Card Systems
Pitch: 0.50, 0.60, 0.635, 0.80, 1.00, 1.27 and 2.00 mm. Pin Count: 10 - 300 positions. Orientation: Vertical, right-angle, edge mount, pass-through. Options:  Power/signal combo, press-fit, PCI Express®, justification beam, differential pair, locking, latching, mating cable.
High-Speed Backplane Systems
Pitch: 1.80 and 2.00 mm. Pin Count: 12 – 72 pairs (3, 4 & 6 pairs/column). Columns: 6, 8, 10 & 12. Options: Vertical, right-angle, coplanar, direct mate orthogonal, cable assembly, power, guidance, keying, staging, end walls.

Application FLexibility


A wide range of options to meet the demands of any high-speed, high-density application

High-Density Arrays
Pitch: 0.65, 0.80, 1.00 and 1.27 mm. Pin Count: 8 - 720 positions. Stack Height: 0.33 - 40 mm. Options: Right-angle, press-fit, 85 Ω tuned, mating/alignment hardware, standoffs, mating cables.
Edge Rate® Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 10 - 200 positions. Stack Height: 5 - 18 mm. Options: Right-angle, edge mount, differential pair, hot swap, latching, guide post, 360º shielding, mating cables.
Ground Plane Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 40 - 156 positions. Stack Height: 5 - 25 mm. Options: Right-angle, edge mount, differential pair, plastic/metal guide post, power, retention, RF, shielding, mating cable.
Ultra Micro Interconnects
Pitch: 0.40, 0.50 0.635 and 0.80 mm. Pin Count: 10 - 400 positions. Stack Height: 2 - 12 mm. Options:  Standard or reverse right-angle, 360º shielding, alignment pin, locking, mating cable.
Edge Card Systems
Pitch: 0.50, 0.60, 0.635, 0.80, 1.00, 1.27 and 2.00 mm. Pin Count: 10 - 300 positions. Orientation: Vertical, right-angle, edge mount, pass-through. Options:  Power/signal combo, press-fit, PCI Express®, justification beam, differential pair, locking, latching, mating cable.
High-Speed Backplane Systems
Pitch: 1.80 and 2.00 mm. Pin Count: 12 – 72 pairs (3, 4 & 6 pairs/column). Columns: 6, 8, 10 & 12. Options: Vertical, right-angle, coplanar, direct mate orthogonal, cable assembly, power, guidance, keying, staging, end walls.

Signal Integrity Support


In-house signal integrity expertise for complex applications

White Papers
Test Reports
Electrical/Mechanical Models
Electrical/Mechanical Models
Break out Region
Break out Region

Online Tools

Solutionator LogoShadow
Simulator LogoShadow
Channelyzer LogoShadow

samtec technology centers

High-Performance System Design & Support from Silicon-to-Silicon™


system optimization sig

System SIGNAL INTEGRITY

Full channel signal and power integrity analysis, testing and validation services
sig@samtec.com

system optimization sog

OPTICs

R&D, design, development and support of micro optical engines and assemblies
optics@samtec.com

system optimization aid

Advanced
Interconnects

High precision stamping, plating, molding and automated assembly
asg@samtec.com

system optimization sme

microelectronics

Advanced IC packaging design, support and manufacturing capabilities
sme@samtec.com

system optimization hsc1

HIGH–SPEED CABLE

In-house R&D and manufacturing of precision extruded cable and assemblies
hdr@samtec.com

system optimization rf

PRECISION RF

RF interconnect design and development expertise, with testing to 70 GHz
RFGroup@samtec.com

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