Si-Fly 112 Gbps PAM4,轻薄型高密度电缆系统

Si-Fly 112 Gbps PAM4,轻薄型高密度电缆系统

Si-Fly™是Samtec最为轻薄的Flyover®电缆解决方案,可置于芯片旁或直接置于基板上。


系列概述

Si-Fly系列

3.8毫米的超轻薄外型使Si-Fly™可置于IC封装附近、散热器或其他冷却硬件下方,从而使设计更为灵活。高密度的8或16对配置,以112 Gbps PAM4数据速率为4或8通道路由提供最佳解决方案,同时支持PCIe® 6.0。

特色

超轻薄型

  • 最多16对,3.4mm极度轻薄外型
  • 对接要求最小8.4 mm高度
Si-Fly对接

极高的通道性能

可在2023年实现51.2 TB总数据速率
极高的通道性能

~与传统PCB相比,范围增加了5倍

铜Si-Fly 22-英寸路程对比PCB 4.5-英寸路程。

与传统的PCB拓扑相比,Si-Fly可实现更长的路程及更好的性能。

信号完整性

长程比较:Si-Fly对比Megtron 7 PCB

以112 Gbps PAM4测量,允损为IEEE 802.3cK。

测试设置:点击此处

Firefly简易对接

联合封装配置

联合封装的互连配置可满足先进的112G+数据速率要求。这种选择避开了BGA,通过长程电缆路由来自硅封装的信号,支持5倍于传统PCB解决方案的信号覆盖范围。
直连

下载和资源

资料

Si-Fly™电子手册 

Si-Fly™电子手册 

获取

产品

CPC

开发中:铜制Si-Fly™轻薄型高密度电缆系统

特色
  • 与IC封装相邻的超薄型互连器
  • 超高密度实现了25.6 TB总数据速率,路径高达51.2 TB
  • 每通道112 Gbps PAM4
  • PCIe® 6.0/CXL™ 3.1 capable
  • 路程是传统PCB解决方案的5倍
  • 避开BGA并通过长程电缆直接路由来自硅封装的信号
开发中:铜制Si-Fly™轻薄型高密度电缆系统

CPI

开发中:Si-Fly™轻薄型高密度互连器

特色
  • 与IC封装相邻的超薄型互连器
  • 超高密度实现了25.6 TB总数据速率,路径高达51.2 TB
  • 每通道112 Gbps PAM4
  • PCIe® 6.0/CXL™ 3.1 capable
  • 路程是传统PCB解决方案的5倍
  • 避开BGA并通过长程电缆直接路由来自硅封装的信号
开发中:Si-Fly™轻薄型高密度互连器

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