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三角形警报 Our manufacturing capacity has been influenced by this pandemic, but our global operations team has been working tirelessly to maximize our output and minimize the impact to all our customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. You can access real-time lead times online within your account, chat, or call us anytime for the latest information. ×

>Si-Fly 112 Gbps PAM4,轻薄型高密度电缆系统

Si-Fly 112 Gbps PAM4,轻薄型高密度电缆系统

Si-Fly使用直连技术来躲避BGA,并通过长程电缆直接路由来自硅封装的信号。


系列概述

Samtec - 直连IC封装

Samtec的Si-Fly电缆系统的超高密度设计和封装上即可直连技术可实现了25.6 TB的总数据速率,路径高达51.2 TB。信号通道避开了BGA,并通过长程电缆直接路由来自IC封装的信号,从而使拓扑范围提升至传统PCB的5倍。

特色

直连IC封装

超高密度,带直连 IC 封装技术
直连

极高的通道性能

实现 51.2 TB 总数据速率 2023
极高的通道性能

~与传统PCB相比,范围增加了5倍

铜Si-Fly 22-英寸路程对比PCB 4.5-英寸路程。

与传统的PCB拓扑相比,Si-Fly可实现更长的路程及更好的性能。

信号完整性

长程比较:Si-Fly对比Megtron 7 PCB

以112 Gbps PAM4测量,允损为IEEE 802.3cK。

测试设置:点击此处

Firefly简易对接

Samtec提供两种封装上即可直连的解决方案:

  • FireFly(现可提供)
  • Si-Fly(正在开发)
解决方案

下载

文献

Si-Fly™电子手册 

Si-Fly™电子手册 

获取

系列

CPC

铜制Si-Fly™轻薄型高密度电缆系统

特色
  • Si-Fly™铜制Flyover®电缆组件;光学元件已划入路线图
  • 直连到IC封装
  • 超高密度实现了25.6 TB总数据速率,路径高达51.2 TB
  • 每通道112 Gbps PAM4
  • 路程是传统PCB解决方案的5倍
  • 避开BGA并通过长程电缆直接路由来自硅封装的信号
铜制Si-Fly™轻薄型高密度电缆系统

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