Hochgeschwindigkeits-Interposer bis zu 56 Gbit/s NRZ mit einem ultraniedrigen Profil mit hochdichten Einfach- oder Dualkompressionskontakten und extremer Designflexibilität.

SUPERNOVA™ Niedrigprofil-Kompressions-Interposer​​​​​​​SUPERNOVA™ Niedrigprofil-Kompressions-Interposer​​​​​​​

Einteilige Niedrigprofil-Hochgeschwindigkeitsinterposer mit einer Gehäusehöhe von 1.27 mm und Dual-Kompressionskontakten.

  • 1.27 mm Standard-Gehäusehöhe
  • 1.00-mm-Raster
  • Duale Kompressionskontakte
  • 100–300 Kontakte
  • Ideal für kostengünstige Board-Module, Modul-zu-Board und LGA-Schnittstellen
  • Minimiert Probleme infolge von thermischer Ausdehnung
  • Analog Over Array™-fähig
  • GMI
SUPERNOVA™ Niedrigprofil-Kompressions-Interposer​​​​​​​

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