Si-Fly® LP 112 Gbps PAM4, Low Profile High-Density Cable Assembly

Si-Fly® LP is Samtec's lowest profile Flyover® cable solution capable of residing adjacent to the IC package, under heat sinks or other cooling hardware with performance to 112 Gbps PAM4.

Familienübersicht

Si-Fly™

The extremely low 4.0 mm profile allows Si-Fly™ to be placed adjacent to the IC package and under heat sinks or other cooling hardware for design flexibility. The high-density 8 or 16 pair configurations offer optimal solutions for routing 4 or 8 channels at 112 Gbps PAM4 data rates and are PCIe® 6.0/CXL® 3.1 capable.

Eigenschaften

Ultra Low Profile

  • Up to 16 pairs in an incredibly low 4 mm profile
  • Minimum 8.4 mm height required for mating
Si-Fly Mating

Downloads und Ressourcen

Literatur

Si-Fly® eBrochure

Si-Fly® eBrochure

PDF herunterladen

Produkte

CPC

IN DEVELOPMENT: Copper Si-Fly® LP Low-Profile, High-Density Cable System
Eigenschaften
  • Ultra-low profile interconnect adjacent to the IC package

  • Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB

  • 112 Gbps PAM4 per lane

  • PCIe® 6.0/CXL® 3.1-fähig

  • 5x the reach of traditional PCB solutions

  • Eludes the BGA and routes signals directly from the silicon package through a long-reach cable

Serien-Abbildung für CPC-

CPI

IN DEVELOPMENT: Si-Fly® LP Low-Profile, High-Density Interconnect
Eigenschaften
  • Ultra-low profile interconnect adjacent to the IC package

  • Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB

  • 112 Gbps PAM4 per lane

  • PCIe® 6.0/CXL® 3.1-fähig

  • 5x the reach of traditional PCB solutions

  • Eludes the BGA and routes signals directly from the silicon package through a long-reach cable

Serien-Abbildung für CPI-

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