Rugged / Power
Rugged high power connectors designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.
Micro Rugged Board-to-Board
Micro Rugged Board-to-Board
Micro pitch interconnects with high-reliability Tiger Eye™ and rugged Edge Rate® contact systems for high mating cycles, high-shock and vibration applications; integral ground/power plane interconnects with increased contact wipe and insertion depth for rugged applications; self-mating interconnects with mating/unmating forces 4-6x greater than typical micro pitch connectors.
Rugged Tiger Eye™ SystemsRugged Tiger Eye™ Systems
These rugged, high-reliability, high-cycle interconnects feature Samtec's Tiger Eye™ contact system.
Features
- High-reliability Tiger Eye™ three-finger BeCu contact system
- Optional locking and latching systems for higher withdrawal force
- Extended Life Product™ testing available
- Standard and cost-saving designs
Edge Rate®Edge Rate® Connector Strips
Rugged Edge Rate® contact systems optimized for signal integrity performance.
Features
- Edge Rate® contacts optimized for signal integrity performance
- 1.5 mm contact wipe
- Robust when "zippered" during unmating
- Up to 56 Gbps PAM4 performance
- 0.50 mm, 0.635 mm or 0.80 mm pitch systems
- Stack heights from 5 mm to 18 mm
- Extremely slim 2.5 mm body width on 0.635 mm pitch system
- 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Razor Beam™Razor Beam™
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
Features
- 0.50 mm, 0.635 mm or 0.80 mm pitch systems
- Razor Beam™ contacts for high-speed and fine-pitch systems
- Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
- Shielded option for EMI protection
- Self-mating connectors reduce inventory costs and can be interchanged for varying stack heights
- 10 stack height options from 5 mm to 12 mm
- Up to 100 contacts
- Parallel, perpendicular and coplanar systems
- Audible click when mated
- Lubricated option available
Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.
Features
- Performance to 28 Gbps
- Rugged Edge Rate® contacts
- Integral ground/power plane
- Up to 156 positions
- Slim footprint (less than 5.00 mm wide)
Q2™ Rugged, High-Speed SystemsQ2™ Rugged, High-Speed Interconnects
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.
Features
- Performance to 25 Gbps NRZ
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
- Power combo option
- Contacts: Up to 208 I/Os
- Stack height: 10.00 mm - 16.00 mm
Floating Contact SystemFloating Contact System
High-speed floating contact system minimizes mating alignment errors.
Features
- Provides 0.50 mm (.0197") float in X and Y directions
- Ideal for multiple connectors on a board
- Up to 60 floating contacts
- Choice of body height and right-angle design
Power/Signal Systems
Power/Signal Systems
High power and signal connectors. Combination board-to-board systems up to 60 A, in vertical and right-angle orientations with high-density power blades and small form factor designs.
Signal/Power Edge Rate® ComboSignal/Power Edge Rate® Combo Edge Card System
Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank.
Features
- Power blades rated up to 60 A per power bank
- Rugged Edge Rate® contact system
- Accepts 1.60mm (.062") thick cards
- Available with 40, 60 and 80 signal pins
- Choice of 2 or 4 power banks
- Optional weld tab for mechanical strength
Power / Q2™ Signal ComboPower / Q2™ Signal Combo
Q2™ power and signal combination interconnects with integral ground plane.
Features
- High-speed Q2™ contacts with power end option
- Vertical and right-angle orientations
- Up to 8 power pins per end as an application specific option
- Optional shielding
- Stack Height: 10.00 mm and 11.00 mm
- Contacts: Up to 156 signals, up to 4 power per end
PowerStrip™PowerStrip™
PowerStrip™/30 and PowerStrip™/40 combination signal and power systems.
Features
- Performance to 31.4 A per power blade
- Up to 8 power blades and 80 signal pins
- High-power dual blade contact system
- Rugged screw down and locking clip options
AcceleRate® mPAcceleRate® mP High-Density, High-Speed Power/Signal Arrays
These 0.635 mm pitch power/signal arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for 22 Amps/blade and simplified breakout region (BOR). View the full line of AcceleRate® products.
Features
- Best in class density for power and signal
- Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding
- Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
- PCIe® 6.0/CXL™ 3.1 capable
- Up to 22 Amps per power blade
- Open-pin-field for grounding and routing flexibility
- High-density multi-row design
- Low profile 5 mm stack height; up to 16 mm in development
- 4 or 8 total power blades; up to 10 in development
- 60 or 240 total signal positions; additional position counts in development
- 0.635 mm signal pitch
- Optional alignment pins and weld tabs for a secure connection to the board
- Polarized guide posts for blind mating
- View the full line of AcceleRate® products
EXTreme Ten60Power™EXTreme Ten60Power™
A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.
Features
- Performance to 60 A per power blade
- Rugged 10 mm low profile design (right-angle orientation)
- 3 or 5 signal rows in the same form factor
- Available with 0 to 40 signal pins
- Up to 20 total DC power blades or 12 total AC power blades
- AC-DC power combos and split power options available
- Press-fit tails option for ease of board termination (ET60S only)
- Modules can be configured to accommodate most any design
- For coplanar or perpendicular applications
- Hot plug option available
- Dual sourced by Molex®
EXTreme LPHPower™EXTreme LPHPower™
High-power, low profile system.
Features
- Performance to 30 A per power blade
- Extremely low 7.50 mm profile (right-angle)
- Double stacked power blades for high-density
- Socket mates with standard .062" (1.60 mm) PCB card
ExaMAX®ExaMAX® High-Speed Backplane System
ExaMAX® high-speed backplane interconnects deliver 64 Gbps PAM4 (32 Gbps NRZ) electrical performance.
Features
- Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
- PCIe® 6.0/CXL™ 3.1 capable
- Allows designers to optimize density or minimize board layer count
- Two reliable points of contact, even when subjected to angled mating
- Meets Telcordia GR-1217 CORE specification
- Individual signal wafers with staggered differential pair design; 24 - 72 pairs (board connectors) and 16 - 96 pairs (cable assemblies)
- One-piece embossed ground structure on each signal wafer to reduce crosstalk
- Lowest mating force on the market: 0.36 N max per contact
- Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
- Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
- Stub free mating
- Press-fit termination
- Power and Guide Modules available
XCede® HDXCede® HD High-Density Backplane System
Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.
Features
- Small form factor provides significant space savings
- Modular design provides flexibility in applications
- High-performance system
- High-density backplane system – up to 84 differential pairs per linear inch
- 1.80 mm column pitch
- 3-, 4- and 6-pair designs
- 4, 6 or 8 columns
- 12 - 48 pairs
- Multiple signal/ground pin staging options
- Integrated power, guidance, keying and side walls available
- 85 Ω and 100 Ω options
- Three levels of sequencing enable hot plugging
- Cost-effective designs available for low-speed applications
Power Connectors and Systems
Power Connectors and Systems
High power connectors and rugged connector interconnects up to 60 A, available in small form factors and elevated designs with power blades or individually shrouded power pins.
Power Mate® and Mini Mate® SystemsHigh Power Isolated Connectors, Power Mate® and Mini Mate® Systems
High power isolated connectors, board-to-board power socket and terminal strips with individually shrouded contacts.
Features
- Power Mate® system with polarized guide posts
- Mini Mate® system with reliable Tiger Buy™ contacts
- Individually shrouded contacts
- Elevated stack heights
Flexible Power Stacking SystemsFlexible Power Stacking Systems
Standard and high-temp connector strips with Power Eye contacts for applications up to 15 A per pin.
Features
- Three-finger BeCu power eye contact
- Flexible stack heights and pin counts
- Standard and high-temp systems
- Rugged locking clip option
mPOWER® Ultra Micro Power ConnectorsmPOWER® Ultra Micro Power Connectors
Micro 2.00 mm pitch power blade interconnects with up to 18 Amps for board-to-board, cable-to-board and board-to-board applications.
Features
- One product family that supports cable-to-board, cable-to-cable and cable-to-panel applications
- Up to 18 A per blade
- 40% space savings compared to traditional power systems
- 2 – 10 power blades on a 2.00 mm pitch
- 5 mm to 16 mm, 18 mm & 20 mm stack heights
- Discrete wire cable assemblies, with rugged latching, simplify board layout and deliver power directly to active components in the system
PowerStrip™ High-Power SystemsPowerStrip™ High-Power Systems
High-power systems for performance up to 58.7 A per contact.
Features
- Current Rating: 23 A - 58.7 A per power blade
- Right-angle and vertical orientations
- Power/Signal combos available
- Cable assemblies available
- "Hinged" for unique mating in any orientation from 0° to 90° and space confined applications
- Optional locking clips or screw downs
- Ideal for blind mating
- Space saving
- Up to 10 total power blades
EXTreme Ten60Power™EXTreme Ten60Power™ 60 Amp Power Connectors
60 amp power connectors featuring a modular high power and signal combo for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.
Features
- Performance to 60 A per power blade
- Rugged 10 mm low profile design (right-angle orientation)
- 3 or 5 signal rows in the same form factor
- Available with 0 to 40 signal pins
- Up to 20 total DC power blades or 12 total AC power blades
- AC-DC power combos and split power options available
- Press-fit tails option for ease of board termination (ET60S only)
- Modules can be configured to accommodate most any design
- For coplanar or perpendicular applications
- Hot plug option available
- Dual sourced by Molex®
EXTreme LPHPower™EXTreme LPHPower™
High-power, low profile system.
Features
- Performance to 30 A per power blade
- Extremely low 7.50 mm profile (right-angle)
- Double stacked power blades for high-density
- Socket mates with standard .062" (1.60 mm) PCB card
One Piece Rugged & Power
One Piece Rugged & Power
One piece connectors, rugged and power connectors, with robust design and mechanical hold-downs for high-shock and vibration applications, available in a variety of pitch designs with profiles from 1.65 mm to 10 mm.
Micro Pitch One-PieceMicro Pitch One-Piece
1.00 mm and .050" pitch one-piece interfaces for rugged and power applications.
Features
- For high-shock, vibration, rugged applications
- Elevated and low profiles from 3 mm to 10 mm
- Optional screw mounts and alignment pins
- Single and double row designs
.100" (2.54 mm) Pitch One-Piece Connectors.100" (2.54 mm) Pitch One-Piece Connectors
.100" (2.54 mm) rugged one-piece connectors for superior power or signal performance and reliability.
Features
- Power or signal applications
- Large contact deflection
- Vertical and right-angle designs
- Elevated profile
Extended Life Products
Extended Life Products
E.L.P.™ products are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions. These connectors pass 10 year Mixed Flowing Gas (MFG) and achieve high mating cycles (250 to 2,500).
E.L.P.™ High Mating Cycle ConnectorsE.L.P.™ High Mating Cycle Connectors
These high mating cycle connectors are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions.
Features
- Passed 10 year Mixed Flowing Gas (MFG)
- High-mating cycles (250 to 2,500)
- Variety of high-reliability, rugged contact systems
- Various connector types and pitches available
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