Rugged / Power Connectors

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

Micro Rugged Board-to-Board

Micro Rugged Board-to-Board

Micro pitch interconnects with high-reliability Tiger Eye™ and rugged Edge Rate® contact systems for high mating cycles, high-shock and vibration applications; integral ground/power plane interconnects with increased contact wipe and insertion depth for rugged applications; self-mating interconnects with mating/unmating forces 4-6x greater than typical micro pitch connectors.


Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
Edge Rate®

Floating Contact SystemFloating Contact System

High-speed floating contact system minimizes mating alignment errors.

Features
  • Provides 0.50 mm (.0197") float in X and Y directions
  • Ideal for multiple connectors on a board
  • Up to 60 floating contacts
  • Choice of body height and right-angle design
Series
V
  • FS5
  • FT5
Floating Contact System

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • JSO
  • LSEM
  • LSHM
  • LSS
Razor Beam™

Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects

Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features
  • Performance: Up to 15 GHz / 30 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Series
V
  • QRF8
  • QRF8-DP
  • QRF8-RA
  • QRM8
  • QRM8-DP
  • QRM8-RA
Q Rate®

Q2™ Rugged, High-Speed SystemsQ2™ Rugged, High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features
  • Performance: Up to 8.5 GHz / 17 Gbps
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power and RF ends options
  • Contacts: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Series
V
  • QFS
  • QFS-DP
  • QFS-EM
  • QFS-PC
  • QFS-RA
  • QFSS
  • QFSS-DP
  • QFSS-DP-PC
  • QFSS-PC
  • QMS
  • QMS-DP
  • QMS-EM
  • QMS-PC
  • QMS-RA
  • QMSS
  • QMSS-DP
  • QMSS-DP-PC
  • QMSS-PC
Q2™ Rugged, High-Speed Systems

Rugged Tiger Eye™ SystemsRugged Tiger Eye™ Systems

These rugged, high-reliability, high-cycle interconnects feature Samtec's Tiger Eye™ contact system.

Features
  • High-reliability Tiger Eye™ three-finger BeCu contact system
  • Optional locking and latching systems for higher withdrawal force
  • Extended Life Product™ testing available
  • Standard and cost-saving designs
Series
V
  • FOLC
  • FSH
  • MOLC
  • S2M
  • SEM
  • SEML
  • SEMS
  • SFC
  • SFM
  • SFMC
  • SFMH
  • SFML
  • SMM
  • T2M
  • TEM
  • TEMS
  • TFC
  • TFM
  • TFML
  • TMM
Rugged Tiger Eye™ Systems

Power/Signal Systems

Power/Signal Systems

High power/signal combination board-to-board systems up to 60 A, in vertical and right-angle orientations with high-density power blades and small form factor designs.


Power / Q2™ Signal ComboPower / Q2™ Signal Combo

Q2™ power and signal combination interconnects with integral ground plane.

Features
  • Current Rating: 2.7A per power pin
  • High-speed Q2™ contacts with power end option
  • Vertical and right-angle orientations
  • Up to 8 power pins per end as an application specific option
  • Optional shielding
  • Stack Height: 10.00 mm and 11.00 mm
  • Contacts: Up to 156 signals, up to 4 power per end
Series
V
  • HPFC
  • HPMC
  • PCS2
  • PCT2
  • QFS
  • QMS
Power / Q2™ Signal Combo

PowerStrip™PowerStrip™

PowerStrip™/30 and PowerStrip™/40 combination signal and power systems.

Features
  • Performance up to 31.4 A per power blade
  • Up to 8 power blades and 80 signal pins
  • High-power dual blade contact system
  • Rugged screw down and locking clip options
Series
V
  • MPSC
  • MPTC
  • PESC
  • PETC
PowerStrip™

Signal/Power Edge Rate® ComboSignal/Power Edge Rate® Combo Edge Card System

Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank.

Features
  • Power blades rated up to 60 A per power bank
  • Rugged Edge Rate® contact system
  • Accepts 1.60mm (.062") thick cards
  • Available with 40, 60 and 80 signal pins
  • Choice of 2 or 4 power banks
  • Optional weld tab for mechanical strength
Series
V
  • HSEC8-PV
Signal/Power Edge Rate® Combo

EXTreme Ten60Power™EXTreme Ten60Power™

A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.

Features
  • Performance up to 60 A per power blade
  • Rugged 10 mm low profile design (right-angle orientation)
  • .100" (2.54 mm) pitch signal pins; .217" (5.50 mm) pitch power blades
  • Available with 0 or 24 signal pins
  • Up to 12 DC power blades
  • Press-fit tails option for ease of board termination (ET60S only)
  • Modules can be configured to accommodate most any design
  • For coplanar or perpendicular applications
  • Hot plug option available
  • Dual sourced by Molex®
Series
V
  • ET60S
  • ET60T
EXTreme Ten60Power™

EXTreme LPHPower™EXTreme LPHPower™

High-power, low profile system.

Features
  • Performance up to 30 A per power blade
  • Extremely low 7.50 mm profile (right-angle)
  • Double stacked power blades for high-density
  • Socket mates with standard .062" (1.60 mm) PCB card
Series
V
  • LPHS
  • LPHT
EXTreme LPHPower™

Power Systems

Power Systems

High-power interconnects up to 60 A, available in small form factors and elevated designs with power blades or individually shrouded power pins.


PowerStrip™ High-Power SystemsPowerStrip™ High-Power Systems

High-power systems for performance up to 58.7 A per contact.

Features
  • Current Rating: 23 A - 58.7 A per power blade
  • Right-angle and vertical orientations
  • Power/Signal combos available
  • Cable assemblies available
  • "Hinged" for unique mating in any orientation from 0° to 90° and space confined applications
  • Optional locking clips or screw downs
  • Ideal for blind mating
  • Space saving
  • Up to 10 total power blades
Series
V
  • FMPS
  • FMPT
  • MPPT
  • MPS
  • MPT
  • PES
  • PET
  • UPPT
  • UPS
  • UPT
PowerStrip™ High-Power Systems

EXTreme Ten60Power™EXTreme Ten60Power™

A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.

Features
  • Performance up to 60 A per power blade
  • Rugged 10 mm low profile design (right-angle orientation)
  • .100" (2.54 mm) pitch signal pins; .217" (5.50 mm) pitch power blades
  • Available with 0 or 24 signal pins
  • Up to 12 DC power blades
  • Press-fit tails option for ease of board termination (ET60S only)
  • Modules can be configured to accommodate most any design
  • For coplanar or perpendicular applications
  • Hot plug option available
  • Dual sourced by Molex®
Series
V
  • ET60S
  • ET60T
EXTreme Ten60Power™

EXTreme LPHPower™EXTreme LPHPower™

High-power, low profile system.

Features
  • Performance up to 30 A per power blade
  • Extremely low 7.50 mm profile (right-angle)
  • Double stacked power blades for high-density
  • Socket mates with standard .062" (1.60 mm) PCB card
Series
V
  • LPHS
  • LPHT
EXTreme LPHPower™

Power Mate® and Mini Mate® SystemsPower Mate® and Mini Mate® Systems

Board-to-board power socket and terminal strips with individually shrouded contacts.

Features
  • Power Mate® system with polarized guide posts
  • Mini Mate® system with reliable Tiger Buy™ contacts
  • Individually shrouded contacts
  • Elevated stack heights
Series
V
  • IPBS
  • IPBT
  • IPS1
  • IPT1
Power Mate® and Mini Mate® Systems

Flexible Power Stacking SystemsFlexible Power Stacking Systems

Standard and high-temp connector strips with Power Eye contacts for applications up to 15 A per pin.

Features
  • Three-finger BeCu power eye contact
  • Flexible stack heights and pin counts
  • Standard and high-temp systems
  • Rugged locking clip option
Series
V
  • FHP
  • FWJ
  • HFWJ
  • HPF
  • HPM
  • HPW
  • JW
Flexible Power Stacking Systems

One-Piece Rugged & Power

One-Piece Rugged & Power

One-piece connectors with robust design and mechanical hold-downs for high-shock and vibration applications, available in a variety of pitch designs with profiles from 1.65 mm to 10 mm.


.100" (2.54 mm) Pitch One-Piece Interfaces.100" (2.54 mm) Pitch One-Piece Interfaces

Rugged one-piece interfaces for superior power or signal performance and reliability.

Features
  • Power or signal applications
  • Large contact deflection
  • Vertical and right-angle designs
  • Elevated profile
Series
V
  • SIB
  • SIR1
.100" (2.54 mm) Pitch One-Piece Interfaces

Micro Pitch One-PieceMicro Pitch One-Piece

1.00 mm and .050" pitch one-piece interfaces for rugged and power applications.

Features
  • For high-shock, vibration, rugged applications
  • Elevated and low profiles from 3 mm to 10 mm
  • Optional screw mounts and alignment pins
  • Single and double row designs
Series
V
  • FSI
  • SEI
  • SIBF
Micro Pitch One-Piece

Extended Life Products

Extended Life Products

E.L.P.™ products are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions. These connectors pass 10 year Mixed Flowing Gas (MFG) and achieve high mating cycles (250 to 2,500).


E.L.P.™ ProductsE.L.P.™ Products

Products tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions.

Features
  • Passed 10 year Mixed Flowing Gas (MFG)
  • High-mating cycles (250 to 2,500)
  • Variety of high-reliability, rugged contact systems
  • Various connector types and pitches available
Series
V
  • BCS
  • BSE
  • BSH
  • BSS
  • BTE
  • BTH
  • BTS
  • CLM
  • CLP
  • CLT
  • ERF8
  • ERM8
  • FLE
  • FTMH
  • FTSH
  • HSEC8-DV
  • HSEC8-EM
  • HSEC8-PV
  • HSEC8-RA
  • QRF8
  • QRM8
  • QSE
  • QSH
  • QSS
  • QTE
  • QTH
  • QTS
  • SEAF
  • SEAM
  • SEM
  • SFM
  • SMM
  • SSM
  • TEM
  • TFM
  • TMM
  • TMMH
  • TSM
  • TSW
E.L.P.™ Products

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