Rugged high power connectors designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.
Micro pitch interconnects with high-reliability Tiger Eye™ and rugged Edge Rate® contact systems for high mating cycles, high-shock and vibration applications; integral ground/power plane interconnects with increased contact wipe and insertion depth for rugged applications; self-mating interconnects with mating/unmating forces 4-6x greater than typical micro pitch connectors.
These rugged, high-reliability, high-cycle interconnects feature Samtec's Tiger Eye™ contact system.
Rugged Edge Rate® contact systems optimized for signal integrity performance.
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.
High-speed floating contact system minimizes mating alignment errors.
High power and signal connectors. Combination board-to-board systems up to 60 A, in vertical and right-angle orientations with high-density power blades and small form factor designs.
Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank.
Q2™ power and signal combination interconnects with integral ground plane.
PowerStrip™/30 and PowerStrip™/40 combination signal and power systems.
These 0.635 mm pitch power/signal arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for 22 Amps/blade and simplified breakout region (BOR). View the full line of AcceleRate® products.
A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.
High-power, low profile system.
ExaMAX® high-speed backplane interconnects deliver 64 Gbps PAM4 (32 Gbps NRZ) electrical performance.
Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.
High power connectors and rugged connector interconnects up to 60 A, available in small form factors and elevated designs with power blades or individually shrouded power pins.
High power isolated connectors, board-to-board power socket and terminal strips with individually shrouded contacts.
Standard and high-temp connector strips with Power Eye contacts for applications up to 15 A per pin.
Micro 2.00 mm pitch power blade interconnects with up to 18 Amps for board-to-board, cable-to-board and board-to-board applications.
High-power systems for performance up to 58.7 A per contact.
60 amp power connectors featuring a modular high power and signal combo for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.
High-power, low profile system.
One piece connectors, rugged and power connectors, with robust design and mechanical hold-downs for high-shock and vibration applications, available in a variety of pitch designs with profiles from 1.65 mm to 10 mm.
1.00 mm and .050" pitch one-piece interfaces for rugged and power applications.
.100" (2.54 mm) rugged one-piece connectors for superior power or signal performance and reliability.
E.L.P.™ products are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions. These connectors pass 10 year Mixed Flowing Gas (MFG) and achieve high mating cycles (250 to 2,500).
These high mating cycle connectors are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions.