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板到板连接器

板到板连接器

Samtec提供业内品种最齐全的板到板互连连接器。热门应用包括间距最小为0.40毫米、堆叠高度低至1毫米的高速夹层和高密度阵列系统、高速插卡和背板系统,以及微间距板堆叠系统。微型耐用型产品采用各种间距的Samtec Tiger Eye™端子系统,以及电流高达60A/刀片的高功率料带和信号/电源组合连接器。标准板到板插头和插座系统有多种间距、密度、堆叠高度和组装方向可供选择。

高速板到板连接器

高速板到板连接器

拥有佩带接地型连接器、高密度阵列、背板互连器、耐用型信号完整性优化Edge Rate®系统和高达56 Gbps NRZ/112 Gbps PAM4的高速性能的夹层系统。

耐用型/电源

耐用型/电源

专为满足高电流应用的需求而设计的电源互连连接器,以及具有高可靠性、高稳定性和长使用寿命的耐用型微型互连连接器。

插卡式连接器系统

插卡式连接器系统

可选择0.50 mm、0.60 mm、0.635 mm、0.80 mm、1.00 mm、1.27 mm或2.00 mm间距和多种组合方向的高速插卡式互连器。

标准板到板

标准板到板

适用于轻薄型、加高型、直通式和耐用型应用的.100"(2.54 mm)和2.00 mm间距板堆叠互连连接器。

背板/微型背板

背板/微型背板

ExaMAX®高速背板系统拥有插卡式插座、高密度阵列、佩带接地和耐用型Edge Rate®互连连接器,可实现{56 Gbps PAM4性能、XCede® HD高密度背板解决方案的设计灵活性和微型背板解决方案。

行业标准

行业标准

获得大多数行业标准的认证或者符合其要求,包括VITA、PCIe®、PC/104™、QSFP+、InfiniBand™、JTAG等。

While Samtec started as a connector company with a focus on two-piece, pin-and-socket board stacking systems, High-Speed Board Stacking connectors and High-Speed Cable Assemblies now make up a significant portion of our sales. To support development in this area, in December of 2...
In the manufacturing world there are standards for just about everything, and they all are typically there to ensure a product can perform as expected for the end application. Among these standards is IPC-A-610 covering solder joints for varying types of connector termination sty...
New Year’s resolutions. Many of us make them, whether it’s to continue a good habit, change a bad one or accomplish a new goal, improvement is the focus. The hardest part of this process is the time between making the plan and accomplishing it. Wouldn’t it be nice if we could jus...
2019 was a fun year for Samtec.com. We’re in a great place right now where we get to maintain current content and features while we’re building a lot of new stuff as well. The website is becoming more mature, but still developing rapidly. If you missed it, here is a look back at ...
While air cooling is still a commonly used method to cool data centers, the industry is seeing HPC, AI, and scientific computing market leaders investigating either conduction cooling, or full-scale immersion cooling, for their next generation designs. In this video from SuperCom...