Gute Isolierung

Kosteneffiziente, hochleistungsfähige HF-Lösungen für Board-zu-Board- und Kabel-zu-Board-Applikationen.

Board-zu-Board RF-SteckverbinderBoard-zu-Board RF-Steckverbinder

Samtec bietet RF-Board-zu-Board-Steckverbinder mit Bauteilhöhen-Optionen von 4.22 mm (.166") bis 10 mm (.394") an. Zu den Lösungen gehören Multipositionsblöcke mit hoher Dichte, SMPM/SMP mit axialem und radialem Spiel für Blind-Mate- oder Fehlausrichtungs-Anwendungen sowie kostengünstige Systeme mit guter Isolierung.

  • Platzsparende Designs: hohe Dichte, niedriges Profil
  • Aneinandergereihte, Multipositions-SMPM-Blöcke bis 65 GHz
  • Miniatur-Push-On-Steckverbinder mit Kugeladaptern
  • Gruppierte Mikro-Miniatur-Buchsen/Stecker mit 5 mm (0,1969") Raster
  • IsoRate®-Systeme mit guter Isolierung zur Hälfte der Kosten herkömmlicher gedrehter RF-Steckverbinder
  • GPPC
  • GPPB
  • SMP-TH
  • SMP-B
  • IJ5
  • IP5
  • GRF1-J
  • GRF1-P
  • GRF7-J
  • GRF7-P
Board-zu-Board RF-Steckverbinder

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