NovaRay® Micro Rugged Backplane system combines ultra-high density with an offset footprint for optimal signal integrity performance to 112 Gbps PAM4.
NovaRay® Micro Rugged Backplane system supports blind mate applications with optional guidance and keying, plus standard weld tabs for a secure connection to the board. The ultra-high density design allows for up to 128 differential pairs in a single connector with configurable signal banks for design flexibility. For performance up to 112 Gbps PAM4, the trusted NovaRay® wafer design eliminates intra-pair skew along with large continuous ground blades between and surrounding the differential pairs, which remove resonances.
IN DEVELOPMENT: 0.80 mm NovaRay® Micro Rugged Backplane Vertical Socket
IN DEVELOPMENT: 0.80 mm NovaRay® Micro Rugged Backplane Right-Angle Header