Edge Card Connector Systems Connectors

High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Micro Backplane Systems

Micro Backplane Systems

High-speed edge card interconnects are available in a variety of pitches and orientations. Micro backplane right-angle board-to-board systems include high-density arrays, integral ground plane connectors and rugged Edge Rate® interconnects.


Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
Edge Rate®

High-Speed Edge CardHigh-Speed Edge Card

High-speed edge card sockets with rugged Edge Rate® contacts.

Features
  • Performance: Up to 14 GHz/pair
  • Rugged Edge Rate® contacts
  • Single ended, differential pairs
  • Vertical, right-angle, edgemount
  • Optional board locks, cable latching features
  • Optional weld tab for mechanical strength
  • RU8 system for elevated board stacking
Series
V
  • HSC8
  • HSEC8-DV
  • HSEC8-EM
  • HSEC8-PV
  • HSEC8-RA
  • RU8
High-Speed Edge Card

Micro Edge Card SystemsMicro Edge Card Systems

Micro pitch edge card sockets in a variety of centerlines and orientations.

Features
  • Performance: Up to 14.5 GHz / 29 Gbps
  • Solutions for .062" (1.60 mm), and .093" (2.36 mm) thick cards
  • Choice of pitch: 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, 2.00 mm
  • Vertical, right-angle, edge mount
  • Available in surface mount and through-hole
Series
V
  • BEC5C
  • MEC1
  • MEC1-EM
  • MEC1-RA
  • MEC2-DV
  • MEC5-DV
  • MEC5-RA
  • MEC6-DV
  • MEC6-RA
  • MEC8-DV
  • MEC8-EM
  • MEC8-RA
  • MEC8-VP
  • MECF-DV
Micro Edge Card Systems

Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects

Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features
  • Performance: Up to 15 GHz / 30 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Series
V
  • QRF8
  • QRF8-DP
  • QRF8-RA
  • QRM8
  • QRM8-DP
  • QRM8-RA
Q Rate®

Q Strip®Q Strip® High-Speed Interconnects

Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential.

Features
  • Performance: Up to 14.0 GHz /28 Gbps
  • Integral ground/power plane
  • Connector to connector retention options
  • Vertical, perpendicular, and coplanar applications
  • Contacts: Up to 180 I/Os
  • Stack height: 5.00 mm - 25.00 mm
Series
V
  • QSE
  • QSH
  • QSS
  • QSS-RA
  • QTE
  • QTH
  • QTS
  • QTS-RA
Q Strip®

Q2™Q2™ Rugged, High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features
  • Performance: Up to 8.5 GHz / 17 Gbps
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power and RF ends options
  • Contacts: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Series
V
  • QFS
  • QFS-DP
  • QFS-EM
  • QFS-PC
  • QFS-RA
  • QFSS
  • QFSS-DP
  • QFSS-DP-PC
  • QFSS-PC
  • QMS
  • QMS-DP
  • QMS-EM
  • QMS-PC
  • QMS-RA
  • QMSS
  • QMSS-DP
  • QMSS-DP-PC
  • QMSS-PC
Q2™

SEARAY™SEARAY™ High-Density Open Pin Field Arrays

These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • Up to 500 I/Os in open pin field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 17 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Series
V
  • JSO
  • SEAF
  • SEAFP
  • SEAFP-RA
  • SEAF-RA
  • SEAM
  • SEAMI
  • SEAMP
  • SEAM-RA
  • SEAR
  • UBPS
  • UBPT
SEARAY™

High-Speed Card Systems

High-Speed Card Systems

High-speed edge card sockets in vertical, right-angle, and edge mount designs with choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm and 2.00 mm pitch.


High-Speed (0.80 mm) Pitch Edge CardHigh-Speed (0.80 mm) Pitch Edge Card

High-speed edge card sockets with rugged Edge Rate® contacts.

Features
  • Performance: Up to 18.5 GHz / 37 Gbps
  • Rugged Edge Rate® contacts
  • Card slot: 1.60 mm (.062")
  • Single-ended and differential pairs
  • Vertical, right-angle, edge mount
  • Optional board locks and cable latching features
  • Optional weld tab for mechanical strength
  • RU8 system for elevated board stacking
Series
V
  • HSC8
  • HSEC8-DV
  • HSEC8-EM
  • HSEC8-PV
  • HSEC8-RA
  • RU8
High-Speed (0.80 mm) Pitch Edge Card

Micro Edge Card SystemsMicro Edge Card Systems

Micro pitch edge card sockets in a variety of centerlines and orientations.

Features
  • Performance: Up to 14.5 GHz / 29 Gbps
  • Solutions for .062" (1.60 mm), and .093" (2.36 mm) thick cards
  • Choice of pitch: 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, 2.00 mm
  • Vertical, right-angle, edge mount
  • Available in surface mount and through-hole
Series
V
  • BEC5C
  • MEC1
  • MEC1-EM
  • MEC1-RA
  • MEC2-DV
  • MEC5-DV
  • MEC5-RA
  • MEC6-DV
  • MEC6-RA
  • MEC8-DV
  • MEC8-EM
  • MEC8-RA
  • MEC8-VP
  • MECF-DV
Micro Edge Card Systems

Micro TCA ConnectorsMicro TCA Connectors

Micro TCA edge card connector supports hot plugging and high-speed serial connections.

Features
  • Performance: Up to 12.0 GHz/24 Gbps
  • Compliant to µTCA™ standard architecture
  • Form/fit/function compatibility with Molex
  • Press-fit tails
  • Supports hot plugging and high-speed serial connections
  • Contacts: Up to 170 I/Os
  • Card slot: 1.60 mm (.063”)
Series
V
  • MTCA
Micro TCA Connectors

Mini Edge Card Guide SystemMini Edge Card System

Mini edge card sockets with optional card guides.

Features
  • Available with or without card guides
  • Various plating options
  • Contacts: Up to 50 I/Os
  • Card slot: .8mm (.0315”), 1.60 mm (.062”)
Series
V
  • MB1
Mini Edge Card Guide System

PCI Express® Edge CardPCI Express® Edge Card

High-speed edge card sockets designed for mating with PCI Express® jumpers and extenders.

Features
  • PCI Express® compatible system
  • Supports 1, 4, 8 and 16 PCI Express® links
  • Vertical or right-angle PCB mount and card edge mount
  • 1.00 mm (.0394") pitch
  • Alignment pins
  • 7 GHz / pin (14 Gbps / pin)
  • Accepts 1.60 mm (.062") card
  • Polarized
Series
V
  • PCIE
  • PCIEC
  • PCIE-LP
  • PCRF
PCI Express® Edge Card

Serial ATA Link Card SocketSerial ATA Link Card Socket

High-speed micro plane socket accommodates variable mating card thickness.

Features
  • Tremendous board stacking, routing flexibility
  • Mount in pairs onsame side or opposite side for easy routing
  • SATALink™ compatible
  • Variable mating card thickness
  • Low profile
  • Large deflection BeCu contact
Series
V
  • SAL1
Serial ATA Link Card Socket

SFP, SFP+ SystemsSFP, SFP+ Systems

Transceiver interface sockets and cages, single or ganged.

Features
  • Mates with SFP, SFP+, XFP, or ZENPAK transceivers
  • Connectors and cage available
  • 20, 30, or 70 I/Os
  • 2x10 position for SFP, SFP+ transceivers
  • 2X10, 2X15, 2X35 for XENPAK and XFP transceivers
  • Press-fit or through-hole solder leads on cages
  • Available individually or as a kit (SFPK Series)
Series
V
  • MECT
  • SFPC
  • SFPK
SFP, SFP+ Systems

1.00 mm Pitch High-Speed Edge Card1.00 mm Pitch High-Speed Edge Card

1.00 mm pitch high-speed edge card sockets with rugged Edge Rate® contacts and misalignment mitigation.

Features
  • Performance up to 14 GHz / 28 Gbps
  • Rugged Edge Rate® contacts decrease crosstalk and increase cycle life
  • 20 – 140 total pins
  • Accepts .062" (1.60 mm) thick cards
  • Optional weld tab and alignment pin
Series
V
  • HSEC1-DV
1.00 mm Pitch High-Speed Edge Card

MSA Transceivers

MSA Transceivers

Edge card socket and cage interface in 2x10, 2x15 or 2x35 positions for mating with SFP, SFP+, XFP and XENPAK transceivers.


SFP, SFP+ SystemsSFP, SFP+ Systems

Transceiver interface sockets and cages, single or ganged.

Features
  • Mates with SFP, SFP+, XFP, or ZENPAK transceivers
  • Connectors and cage available
  • 20, 30, or 70 I/Os
  • 2x10 position for SFP, SFP+ transceivers
  • 2X10, 2X15, 2X35 for XENPAK and XFP transceivers
  • Press-fit or through-hole solder leads on cages
  • Available individually or as a kit (SFPK Series)
Series
V
  • MECT
  • SFPC
  • SFPK
SFP, SFP+ Systems

PCI Express®

PCI Express®

High-speed edge card sockets support one, four, eight and sixteen PCI Express® links and mate with PCI Express® cable assemblies.


PCI Express® Edge CardPCI Express®

High-speed edge card sockets designed for mating with PCI Express® jumpers and extenders.

Features
  • PCI Express® compatible system
  • Supports 1, 4, 8 and 16 PCI Express® links
  • Vertical or right-angle PCB mount and card edge mount
  • 1.00 mm (.0394") pitch
  • Alignment pins
  • 7 GHz / pin (14 Gbps / pin)
  • Accepts 1.60 mm (.062") card
  • Polarized
Series
V
  • PCIE
  • PCIEC
  • PCIE-LP
  • PCRF
PCI Express® Edge Card

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