Micro Flyover On-Board Optical Engine, FireFly™

Micro Flyover On-Board Optical Engine, FireFly™

Future-proof system with interchangeability of FireFly™ copper and optical using the same micro connector system for up to 28 Gbps per lane in x4 and x12 configurations.


FAMILY OVERVIEW

firefly video

FireFly Micro Flyover System™ is the first interconnect system that gives a designer the flexibility of using micro footprint high-performance optical and low-cost copper interconnects interchangeably with the same connector system.

Samtec FireFly copper and optical cable systems provide the flexibility to achieve higher data rates to 28 Gbps and/or greater distances, simplifying board design and enhancing performance.

FireFly Product Explorer

FireFly explorer

The system’s miniature footprint allows for greater density and closer proximity to the IC, enabling chip-to-chip, board-to-board, on-board and system-to-system connectivity.

firefly poster

The Firefly™ Micro Flyover System™ is the first interconnect system that gives designers a choice of using either micro footprint optical or copper interconnects to meet today's data rate requirements and the next generation.

FEATURES

Future Proof

FireFly™ copper and optical systems are interchangeable using the same high-performance connector set.

FireFly Copper

  • Performance to 28 Gbps
  • 8 or 12 differential pairs
  • 100 Ω, 34 or 36 AWG Eye Speed® twinax cable
  • Variety of end 2 termination options
  • Low-profile housing for space savings
  • Low-cost solution for seamless integration of new and existing designs
  • Standard copper (ECUE), optimized copper (ECUE-2) and PCIe®-Over-FireFly copper (PCUE) assemblies available
ECUE Twinax Ribbon Cable

FireFly Optical

  • Performance to 28 Gbps
  • x4 and x12 designs
  • OM3 multi-mode fiber
  • Variety of End 2 options and heat sinks for various cooling processes
  • Extended Temperature FireFly with a -40 ºC to +85 ºC range for military and industrial applications (ETUO)
  • PCIe®-Over-Fiber optical cable system with Gen 3 data transfer rates to 100 m (PCUO)
  • PCIe®-Over-Fiber adaptor card supports transparent and non-transparent bridging (PCOA)
ECUO Active Optical Cable

Highest Density

The industry-leading miniature footprint of FireFly™ allows for greater density and closer proximity to the IC, which simplifies board layout and enhances signal integrity. Performance from 14 Gbps to 28 Gbps can be achieved in the same footprint covering an area of only 0.63 square inches for an aggregate 265 Gbps/in².

highest density

Ease of Routing

The two-piece board level interconnect system consists of a micro high-speed edge card connector, and a positive latch connector for power and control signal communications. Isolating the signal and power in this manner helps ease trace routing, compared to array systems.

UEC5 – High-Speed Edge Card Connector
  • Gen 1 – up to 20 Gbps
  • Gen 2 – 20+ Gbps
UCC8 – Positive Latch Connector
firefly connector systems

Ease of Assembly

The rugged two-piece edge card socket system, with weld tabs, latch locking mechanism, and loading guides, provides simplified mating and unmating of the cable assembly, compared to compression systems, which utilize mechanical screw downs and hardware.

Unlike existing optical engine-based solutions, thermal operating conditions are acknowledged and designed for by including an integral heat sink. This integral heat sink further simplifies the assembly process. Standard heat sinks are available in several designs, including finned, flat, fiber-groove for multi-row configurations, and custom designs, for conduction or convection cooling.

firefly easy mating

Signal Integrity

By taking the data connections "off-board" with Samtec Flyover® cables, the signal integrity design is made significantly easier, and the electrical performance improved.

Routing data above lossy board materials and other signal degrading components negates the need for the layout complexities that are required to design for high speed signaling.

kaovg hsc angle

28 Gbps FireFly™ Evaluation Kit

The 28 Gbps FireFly™ Evaluation Kit provides system designers, optical and SI engineers an easy-to-use solution for testing the FireFly™ Micro Flyover System™. Rated up to 28 Gbps per lane in x4 and x12 configurations, this kit allows the designer real-time evaluation of an actively running copper or optical FireFly™ system in their lab.

The 28 Gbps FireFly™ Evaluation Kit delivers a high-quality system with robust optical, electrical and mechanical design.

Part Number: REF-209623-01

firefly fik test

Development Kits

14 Gbps FireFlyTM FMC Module

Samtec's 14 Gbps FireFlyTM FMC Module provides up to 140 Gbps full-duplex bandwidth over 10 channels from an FPGA to an industry-standard multi-mode fiber optic cable. The optical engines in FireFlyTM provide adjustable power levels to support cable lengths up to 100 m.

As a VITA 57.1 FMC, the module can be used for optical data communication on any FPGA development board supporting high-speed multi-gigabit transceivers. It can run system data or BERT testing on all channels in parallel. This makes evaluation and development with an FPGA much easier and is an ideal substitute for 28G test equipment.

Part Number: REF-193429-01

firefly fmc module
25/28 Gbps FireFlyTM FMC+ Module

Samtec's 25/28 Gbps FireFlyTM FMC+ Module provides up to 448 Gbps full-duplex bandwidth over 16 channels from an FPGA to an industry-standard multi-mode fiber optic cable. The optical engines in FireFlyTM provide adjustable power levels to support cable lengths up to 100 m.

As a VITA 57.4 FMC+ solution, the Samtec 25/28 Gbps FireFlyTM FMC+ Module can be used for optical data communication on any FPGA development board supporting high-speed multi-gigabit transceivers. It can run system data or BERT testing on all channels in parallel. This makes evaluation and development with an FPGA much easier.

Part Number: REF-200772-XX-XX-01

firefly fmcp module
28 Gbps FireFlyTM Evaluation Kit

Samtec's 28 Gbps FireFlyTM Evaluation Kit provides system designers, optical and SI engineers an easy-to-use solution for testing the FireFlyTM Micro Flyover SystemTM. Rated up to 28 Gbps per lane in x4 and x12 configurations, this kit allows the designer real-time evaluation of an actively running copper or optical FireFlyTM system in their lab.

The 28 Gbps FireFlyTM Evaluation Kit delivers a high-quality system with robust optical, electrical and mechanical design.

Part Number: REF-209623-01

firefly evaluation kit

VIDEOS

Samtec Optical Group Tech Center HD

FireFly™ Micro Flyover System™

Products

ECUO

FireFly™ Active Optical Micro Flyover System™ Cable Assembly

Features
  • FireFly™ optical cable system
  • 56 Gbps PAM4 SerDes Characterization
  • Data connection is taken "off board" for easier routing
  • Interchangeable with FireFly™ copper
  • Choice of data rate: 14 Gbps, 16 Gbps, 25 Gbps, 28 Gbps
  • Designed for on-board or on-package placement
  • Variety of integral heat sink, fiber type and End 2 options
  • FireFly™ Evaluation and Development Kits available. Visit samtec.com/kits.
  • For more information, contact [email protected]
FireFly™ Active Optical Micro Flyover System™ Cable Assembly

PCUO

PCIe®-Over-Fiber, FireFly™ Optical Cable Assembly

Features
  • Meets PCIe® 3.0 and 4.0 specifications
  • 56 Gbps PAM4 SerDes Characterization
  • Transmits PCIe® signals up to 100 m
  • x4, x8 and x16 PCIe® micro optical engines
  • Transparent and non-transparent bridging
  • Proven 850 nm VCSEL technology
  • Compatible PCIe® adaptor card available (PCOA Series)
PCIe®-Over-Fiber, FireFly™ Optical Cable Assembly

ETUO

FireFly™ Extended Temperature Active Optical Micro Flyover® Cable Assembly

Features
  • Extended temperature range from -40 ºC to +85 ºC
  • 56 Gbps PAM4 SerDes Characterization
  • High-speed performance to 10.3125 Gbps per channel
  • Data connection is taken "off board" for easier routing
  • Integral heat sink provides optimal cooling for thermal operating conditions
  • Variety of fiber type and End 2 options
  • For more information, contact [email protected]
FireFly™ Extended Temperature Active Optical Micro Flyover® Cable Assembly

ETMO

IN DEVELOPMENT: FireFly™ Extreme Environment Active Optical Micro Flyover® Cable Assembly

Features
  • Sealed and Parylene-Coated for exposed military, aerospace and submersible applications
  • Ruggedized for tin whisker mitigation and fungal resistance
  • Operates in harsh environments including salt fog, blowing sand and dust, jet fuel exposure, altitudes up to 65,000 feet
  • Extended temperature range from -40 ºC to +85 ºC
  • High-speed performance to 25.7 Gbps per channel performance
  • Dual power mode for interoperability with legacy optical modules
  • Integral heat sink provides optimal cooling for thermal operating conditions
  • Variety of fiber type and End 2 options
  • For more information, contact [email protected]
IN DEVELOPMENT: FireFly™ Extreme Environment Active Optical Micro Flyover® Cable Assembly

PTUO

Extended Temp PCIe®-Over-Fiber, FireFly™ Optical Cable Assembly

Features
  • Extended temperature range from -40 ºC to +85 ºC
  • Meets PCIe® 3.0 specifications; PCIe® 4.0 version in development
  • High-performance signal quality with BER better than 1E-12
  • Transmits PCIe® signals up to 100 m
  • Transparent and non-transparent bridging
  • Allows nontraditional FPGA/ASIC end points
Extended Temp PCIe®-Over-Fiber, FireFly™ Optical Cable Assembly

ECUE

FireFly™ Low Profile Micro Flyover System™ Cable Assembly

Features
  • FireFly™ copper cable system
  • Data connection is taken "off board" for easier routing
  • Interchangeable with FireFly™ optical
  • Designed for on-board or on-package placement
  • Wide variety of End 2 options
  • 28 Gbps performance
  • Multiple signal mapping options
  • Low-cost solution for seamless integration of new and existing architectures
  • For more information, contact [email protected]
FireFly™ Low Profile Micro Flyover System™ Cable Assembly

PCUE

PCIe®-Over-FireFly™ Copper Cable Assembly

Features
  • PCIe®-Over-FireFly™ copper system
  • x4 duplex system
  • Meets PCIe® 3.0 and 4.0 specifications
  • Data connection is taken "off board" for easier routing
  • Mates with the same 2-piece connector system as other FireFly™ systems
  • 34 AWG twinax ribbon cable
PCIe®-Over-FireFly™ Copper Cable Assembly

UEC5-1

Up To 20 Gbps FireFly™ Edge Card Socket Assembly

Features
  • Up to 20 Gbps performance
  • Rugged Edge Rate® contact system
  • Low profile right-angle design
  • Available in 19 positions
  • Standard alignment pins and surface mount tails
  • Selective gold plated contacts
  • PCB footprints are not interchangeable for UEC5-1 and UEC5-2 data rate versions
Up To 20 Gbps FireFly™ Edge Card Socket Assembly

UEC5-2

20+ Gbps FireFly™ Edge Card Socket Assembly

Features
  • 20+ Gbps performance
  • Rugged Edge Rate® contact system
  • Low profile right-angle design
  • Available in 19 positions
  • Selective gold plated contacts
  • Standard alignment pins and surface mount tails
  • PCB footprints are not interchangeable for UEC5-1 and UEC5-2 data rate versions
20+ Gbps FireFly™ Edge Card Socket Assembly

UCC8

FireFly™ Positive Latching Receptacle

Features
  • Power and low-speed control signal communications
  • Available in 10 positions
  • Selective gold plated contacts
  • Standard alignment pins and weld tabs
  • Part of the 2-piece connector set for FireFly™ optical and copper systems
FireFly™ Positive Latching Receptacle

PCOA

PCI Express®-Over-Fiber FireFly™ Adaptor Card

Features
  • Uses PCUO FireFly™ optical cable assemblies
  • 56 Gbps PAM4 SerDes Characterization
  • Supports PCIe® 3.0/4.0 platform
  • PCIe® x16 edge card connector
  • x16, x8, dual x8, x4, dual x4 and quad x4 configurations
  • Transparent or non-transparent bridging
  • Reconfigurable host or target operation
PCI Express®-Over-Fiber FireFly™ Adaptor Card

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