Connectors

Connectors

Samtec offers the largest variety of board-to-board interconnects in the industry. Popular applications include high speed mezzanine and high density array systems, high speed edge card and backplane systems, and micro pitch board stacking systems down to 0.40 mm pitch and 1 mm stack height. Micro rugged products feature Samtec’s Tiger Eye™ contact system on a variety of pitches, as well as high power strips and signal/power combination connectors to 60A/blade. Standard board-to-board header and socket systems are available in a variety of pitch, density, stack height, and orientation.

High-Speed Board-to-Board

High-Speed Board-to-Board

Mezzanine systems with integral ground planes, high-density arrays, ExaMAX® backplane interconnects, rugged Edge Rate® systems and high-speed performance to 28+ Gbps.

Micro Pitch Board-To-Board

Micro Pitch Board-To-Board

Interconnect systems with pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

Rugged / Power

Rugged / Power

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

Edge Card Connector Systems

Edge Card Connector Systems

High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Standard Board-To-Board

Standard Board-To-Board

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

Backplane / Micro Backplane

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 28 Gbps performance, and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

Industry Standards

Industry Standards

Certified or compliant to most industry standards, including VITA, PCIe®, PC/104™, QSFP+, InfiniBand™, JTAG, etc.

One of several demonstrations at DesignCon 2017 shows the variety of Samtec interconnects supporting the Xilinx® Virtex® UltraScale+ FPGA VCU118 Development Kit.  Included in the kit is an FMC+ Active Loopback Card, which carries Samtec’s direct attach Flyover™ QSFP28. In the Fly...
In this video, Kevin Burt of Samtec’s Optical Group explains one of Samtec’s product demonstrations at DesignCon 2017.  The demo features a disaggregated computing platform with PCIe® Gen 3 fabric enabled by the patented FireFly™ mid-board optical technology. PCIe® Over Fiber PCI...
At DesignCon 2017, Jim Nadolny, Samtec’s Principle SI and EMI Engineer, presented(1) a technical paper entitled “Design of Flyover QSFP28 (FQSFP Series) for 56+ Gbps Applications.” This white paper discusses the Flyover QSFP (FQSFP) approach for 56+ Gbps applications to overcome ...
In our previous web update post, we rolled out a new streamlined sampling feature for our Solutionator® parametric search tool, which gave users the capability to place a sample request very quickly by filling out all required sampling information on a single screen. This month, ...
As the demand for bandwidth increases, so does the demand for higher capacity products with faster transmission capabilities. In response to these demands, Samtec has expanded the FireFly™ Micro Flyover Optical product line to solve more complex design hurdles. Benefits such as c...
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