Mezzanine systems with integral ground planes, high-density arrays, backplane interconnects, rugged signal integrity optimized Edge Rate® systems and high-speed performance to 56 Gbps NRZ/112 Gbps PAM4.

Interconnect systems with fine pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

High-speed card edge connectors and systems on choice of 0.50 mm, 0.60 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

These Backplane Connectors and systems such as the ExaMAX® high-speed backplane system offer 56 Gbps PAM4 performance. XCede® HD high-density backplane solutions offer design flexibility and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

Certified or compliant to most industry standards, including VITA, PCIe®, PC/104™, QSFP+, InfiniBand™, JTAG, etc.