Board-to-Board Connectors

Board-to-Board Connectors

Samtec offers the largest variety of board-to-board connectors in the industry. Popular applications include high speed mezzanine and high density array systems, high speed edge card and backplane systems, and micro pitch board stacking systems down to 0.40 mm pitch and 1 mm stack height. Micro rugged products feature Samtec’s Tiger Eye™ contact system on a variety of pitches, as well as high power strips and signal/power combination connectors to 60A/blade. Standard board-to-board header and socket systems are available in a variety of pitch, density, stack height, and orientation.

High-Speed Board-to-Board Connectors

High-Speed Board-to-Board Connectors

Mezzanine systems with integral ground planes, high-density arrays, ExaMAX® backplane interconnects, rugged Edge Rate® systems and high-speed performance to 28+ Gbps.

Micro Pitch Board-To-Board

Micro Pitch Board-To-Board

Interconnect systems with fine pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

Rugged / Power

Rugged / Power

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

Edge Card Connector Systems

Edge Card Connector Systems

High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Standard Board-To-Board

Standard Board-To-Board

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

Backplane / Micro Backplane

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 28 Gbps performance, and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

Industry Standards

Industry Standards

Certified or compliant to most industry standards, including VITA, PCIe®, PC/104™, QSFP+, InfiniBand™, JTAG, etc.

Readers of the Samtec blog are familiar with the benefits of FMC and FMC+. These popular interfaces define a compact electro-mechanical expansion interface for a daughter card to an FPGA baseboard or other device with re-configurable I/O capability. VITA 57.1 has been around for ...
In February, we rolled out several back-end performance updates to Samtec.com, as well as a few upgraded applications. Here are the major updates to Samtec.com for February 2019. Updated Experience for mPOWER™ Family Page The mPOWER™ connector system is the ultimate micro, high-p...
Edge Rate®, one of Samtec’s most popular high speed, high bandwidth interconnect systems, also saves space on your PCB. Edge Rate is both the name of the contact system and the product family. The contact system is designed for high speed, high cycle, rugged applications.  With s...
Long Reach Backplane Cable This live demonstration from DesignCon 2019 shows how Samtec’s ExaMAX® backplane connector, combined with Samtec Flyover® technology, achieves high density and very long reach. Here, the reach is five meters for a rack-to-rack interconnect system. In th...
By popular request, we have just recently released a brand new standalone videos page that you can use to browse, search, and filter through all of the videos that are featured throughout Samtec.com. You can search by keyword, and/or use the filters we have provided to pair down ...