Connectors

Connectors

Samtec offers the largest variety of board-to-board interconnects in the industry. Popular applications include high speed mezzanine and high density array systems, high speed edge card and backplane systems, and micro pitch board stacking systems down to 0.40 mm pitch and 1 mm stack height. Micro rugged products feature Samtec’s Tiger Eye™ contact system on a variety of pitches, as well as high power strips and signal/power combination connectors to 60A/blade. Standard board-to-board header and socket systems are available in a variety of pitch, density, stack height, and orientation.

High-Speed Board-to-Board

High-Speed Board-to-Board

Mezzanine systems with integral ground planes, high-density arrays, ExaMAX® backplane interconnects, rugged Edge Rate® systems and high-speed performance to 28+ Gbps.

Micro Pitch Board-To-Board

Micro Pitch Board-To-Board

Interconnect systems with pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

Rugged / Power

Rugged / Power

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

Edge Card Connector Systems

Edge Card Connector Systems

High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Standard Board-To-Board

Standard Board-To-Board

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

Backplane / Micro Backplane

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 28 Gbps performance, and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

Industry Standards

Industry Standards

Certified or compliant to most industry standards, including VITA, PCIe®, PC/104™, QSFP+, InfiniBand™, JTAG, etc.

Cadillac vs. Ford.  Fast food vs. fine dining.  24k gold vs. 25₵ plastic.  The difference between all of these things: standards. Standards are what define the choices we make each and every day as to what we will invest our time and money in. But what do standards, in this case,...
Last week I posted a blog about a paper on Interconnect Susceptibility To Galvanic Corrosion.  The paper was prepared David Scopelliti, a longtime friend of Samtec.  As I mentioned there, Dave has a wealth of test, application, industry, and processing knowledge, and is well-resp...
At the end of every year, avid readers, editors, engineers, and fellow electronics nerds of EDN magazine vote on their top 100 products.  From DACs to smart cameras, debug software to single-board computers, all aspects of the electronic world are fair game in EDN’s Hot 100. Avne...
Our longtime friend Dave Scopelliti has prepared a succinct paper where he shares his insights on the issue of Galvanic (Electrolytic) Corrosion and interconnects.  Dave has a wealth of test, application, industry, and processing knowledge, and is well-respected and well-known in...
The web team at Samtec finished 2016 with several fairly significant updates. One major application, Solutionator, was given a new streamlined sampling feature that we know you’ll find extremely useful. We also rolled out the first version of the new way you’ll get your full part...
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