Connectors

Connectors

Samtec offers the largest variety of board-to-board interconnects in the industry. Popular applications include high speed mezzanine and high density array systems, high speed edge card and backplane systems, and micro pitch board stacking systems down to 0.40 mm pitch and 1 mm stack height. Micro rugged products feature Samtec’s Tiger Eye™ contact system on a variety of pitches, as well as high power strips and signal/power combination connectors to 60A/blade. Standard board-to-board header and socket systems are available in a variety of pitch, density, stack height, and orientation.

High-Speed Board-to-Board

High-Speed Board-to-Board

Mezzanine systems with integral ground planes, high-density arrays, ExaMAX® backplane interconnects, rugged Edge Rate® systems and high-speed performance to 28+ Gbps.

Micro Pitch Board-To-Board

Micro Pitch Board-To-Board

Interconnect systems with pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

Rugged / Power

Rugged / Power

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

Edge Card Connector Systems

Edge Card Connector Systems

High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Standard Board-To-Board

Standard Board-To-Board

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

Backplane / Micro Backplane

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 28 Gbps performance, and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

Industry Standards

Industry Standards

Certified or compliant to most industry standards, including VITA, PCIe®, PC/104™, QSFP+, InfiniBand™, JTAG, etc.

It seems FPGAs are getting bigger and faster all the time. FPGA vendors continue to integrate more transceivers running at higher speeds in their newest ICs.  As an example, the Xilinx Virtex UltraScale+ VU13P FPGA contains 128 GTY transceivers running data rates up to 32.75 Gbps...
Every year Samtec releases a new catalog showcasing our full line of products and 2017 was no exception. The latest F-217 Full Line Catalog features new products and technology that enable us to provide overall system optimization from Silicon-to-Silicon. The combination of Samte...
The growth in high-speed serial channel data rates has no end in sight.  28 Gbps design starts abound across the industry.  56 Gbps PAM-4 solutions are coming down the road, whether silicon, interconnect or high-speed copper and optical cables. On the optical front, the front-pan...
In last month’s update, we brought you an updated way to order your samples from our Solutionator parametric search tool. In February, we rolled that out on an even larger scale, with this feature being added to a new full-part technical specifications page experience (more about...
OFC 2017, The Optical Networking and Communication Conference & Exhibition, is a global forum and exhibition for optical communications and networking possibilities. Samtec will showcase the latest FireFly™ Optical Cable Systems, including new PCIe® Over Fiber, extended temperatu...
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