triangle alert Samtec manufacturing capacity has been influenced by this pandemic. Our global operations team is working tirelessly to maximize output and minimize impact to customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. For the most up-to-date and accurate lead times use your My Samtec account, chat, or call us anytime for the latest information. ×
triangle alert Samtec manufacturing capacity has been influenced by this pandemic. Our global operations team is working tirelessly to maximize output and minimize impact to customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. For the most up-to-date and accurate lead times use your My Samtec account, chat, or call us anytime for the latest information. ×

Board-to-Board Connectors

Board-to-Board Connectors

Samtec offers the largest variety of board-to-board connectors in the industry. Popular applications include high speed mezzanine and high density array systems, high speed edge card and backplane systems, and micro pitch board stacking systems down to 0.40 mm pitch and 1 mm stack height. Micro rugged products feature Samtec’s Tiger Eye™ contact system on a variety of pitches, as well as high power strips and signal/power combination connectors to 60A/blade. Standard board-to-board header and socket systems are available in a variety of pitch, density, stack height, and orientation.

High-Speed Board-to-Board Connectors

High-Speed Board-to-Board Connectors

Mezzanine systems with integral ground planes, high-density arrays, backplane interconnects, rugged signal integrity optimized Edge Rate® systems and high-speed performance to 56 Gbps NRZ/112 Gbps PAM4.

Micro Pitch Board-To-Board

Micro Pitch Board-To-Board

Interconnect systems with fine pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

Rugged / Power

Rugged / Power

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

Edge Card Connector Systems

Edge Card Connector Systems

High-speed edge card interconnects on choice of 0.50 mm, 0.60 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Standard Board-To-Board

Standard Board-To-Board

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

Backplane / Micro Backplane

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 56 Gbps PAM4 performance, XCede® HD high-density backplane solutions for design flexibility and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

Industry Standards

Industry Standards

Certified or compliant to most industry standards, including VITA, PCIe®, PC/104™, QSFP+, InfiniBand™, JTAG, etc.

AI continues to shake up the tech industry. Nvidia’s plans to buy UK-based Arm Holdings from Japan-based SoftBank illustrates that point. Nvidia GPU chipsets make-up the majority of data-center focused AI hardware applications. The Arm Holding licensee ecosystem offers a new terr...
If you are involved with ISO 9001 then you probably know that “continuous improvement” is the name of the game. After all Rome wasn’t built in a day, and neither was Samtec’s newly updated Outgassing Guide. Our first version of the Outgassing Flyer was focused on the information ...
Samtec Signal Integrity R&D Manager Brandon Gore recently presented “IEEE Channel Operating Margin For Channel Analysis” as part of our gEEk® spEEk webinars. gEEk spEEk allows engineers to interact with Samtec’s engineering leaders and SI experts on a variety of selected SI-relat...
In August 2020, we rolled out a variety of content updates to Samtec.com, spent some time fortifying our Electrial Models offerings, and continued to upgrade our mobile experience. Here are the major updates to Samtec.com for August 2020. New PICMG Standards Page With over 25 yea...
EDI CON Online: Where High Frequency Meets High Speed The tagline of the event stays the same in 2020. Why mess with a good thing? Why change what is working? As with last year, EDI CON Online aims to bring RF, microwave, EMC/EMI, high-speed digital design and system integrator t...