Connectors

Connectors

Samtec offers the largest variety of board-to-board interconnects in the industry. Popular applications include high speed mezzanine and high density array systems, high speed edge card and backplane systems, and micro pitch board stacking systems down to 0.40 mm pitch and 1 mm stack height. Micro rugged products feature Samtec’s Tiger Eye™ contact system on a variety of pitches, as well as high power strips and signal/power combination connectors to 60A/blade. Standard board-to-board header and socket systems are available in a variety of pitch, density, stack height, and orientation.

High-Speed Board-to-Board

High-Speed Board-to-Board

Mezzanine systems with integral ground planes, high-density arrays, ExaMAX® backplane interconnects, rugged Edge Rate® systems and high-speed performance to 28+ Gbps.

Micro Pitch Board-To-Board

Micro Pitch Board-To-Board

Interconnect systems with pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

Rugged / Power

Rugged / Power

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

Edge Card Connector Systems

Edge Card Connector Systems

High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Standard Board-To-Board

Standard Board-To-Board

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

Backplane / Micro Backplane

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 28 Gbps performance, and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

Industry Standards

Industry Standards

Certified or compliant to most industry standards, including VITA, PCIe®, PC/104™, QSFP+, InfiniBand™, JTAG, etc.

SEARAY™ is a family of high speed, high density connectors. SEARAY gives designers tons of design flexibility, much more than any other array product in the connector industry. DESIGN FLEXIBILITY SEARAY is on a 1.27 mm X 1.27 mm grid. This is an open pin field grid array, which m...
Samtec’s FFSD, FFMD Series are micro-pitch, high reliability, high cycle IDC cable assemblies. TIGER EYE™ CONTACT The connector systems incorporate the Tiger Eye™ contact. Tiger Eye is a rugged contact for micro pitch interconnects; it is ideal for high reliability and high matin...
In this short video, Steve Groothuis, Chief Technology Officer for Samtec Microelectronics, explains Glass Core Technology (GCT), why it matters in advanced substrate packaging, and the solutions it provides. GCT is a proprietary process that leverages the performance benefits of...
Since we released Samtec Solutionator 2.0, our updated parametric search tool, the most requested feature from users has been the ability to export the results of the data grid. We’re happy to announce that with our most recent update, you can now export up to 1,000 rows of data ...
Interconnects for the military/aerospace industry are used in a variety of applications, including communication and navigation equipment, radar, airborne, marine and space guidance control, and electronic warfare, to name a few. While Samtec products are used in commercial appli...
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