Connectors

Connectors

Samtec offers the largest variety of board-to-board interconnects in the industry. Popular applications include high speed mezzanine and high density array systems, high speed edge card and backplane systems, and micro pitch board stacking systems down to 0.40 mm pitch and 1 mm stack height. Micro rugged products feature Samtec’s Tiger Eye™ contact system on a variety of pitches, as well as high power strips and signal/power combination connectors to 60A/blade. Standard board-to-board header and socket systems are available in a variety of pitch, density, stack height, and orientation.

High-Speed Board-to-Board

High-Speed Board-to-Board

Mezzanine systems with integral ground planes, high-density arrays, ExaMAX® backplane interconnects, rugged Edge Rate® systems and high-speed performance to 28+ Gbps.

Micro Pitch Board-To-Board

Micro Pitch Board-To-Board

Interconnect systems with pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

Rugged / Power

Rugged / Power

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

Edge Card Connector Systems

Edge Card Connector Systems

High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Standard Board-To-Board

Standard Board-To-Board

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

Backplane / Micro Backplane

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 28 Gbps performance, and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

Industry Standards

Industry Standards

Certified or compliant to most industry standards, including VITA, PCIe®, PC/104™, QSFP+, InfiniBand™, JTAG, etc.

November completed another solid month of web updates to Samtec.com. While there was no new application software released, we took this time to make a few key upgrades to some of our existing software to continue to enhance your user experience. Here are the major web updates for...
Designers periodically ask us for a “general bandwidth performance rating” to compare two or more interconnect systems. Of course numerous variables affect the signal integrity performance of an interconnect, so a one-size-fits-all approximation definitely does not fit all. Now, ...
Samtec proudly announces the release of a high-speed board-to-board connector family compliant to the ANSI/VITA 57.4-2016 standard. Samtec’s family of FMC+ connectors helps support the expanded interface and faster speeds of the latest FMC+ applications. The new ANSI/VITA 57.4-20...
Samtec’s FireFly™ Micro Flyover System™ continues to gain industry acceptance in mid-board copper and optical cable assembly systems. The ECUO series can be found in a number of applications requiring standard temperature ranges. The popularity of ECUO has established a need for ...
The newest version of Solutionator, our parametric search tool that allows you to design a mated set in a minute or less, has been rolling for a couple of months now on Samtec.com. As we detailed in this introductory post, Solutionator boasts several powerful features to help you...
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