Board-to-Board Connectors

Board-to-Board Connectors

Samtec offers the largest variety of board-to-board connectors in the industry. Popular applications include high speed mezzanine and high density array systems, high speed edge card and backplane systems, and micro pitch board stacking systems down to 0.40 mm pitch and 1 mm stack height. Micro rugged products feature Samtec’s Tiger Eye™ contact system on a variety of pitches, as well as high power strips and signal/power combination connectors to 60A/blade. Standard board-to-board header and socket systems are available in a variety of pitch, density, stack height, and orientation.

High-Speed Board-to-Board Connectors

High-Speed Board-to-Board Connectors

Mezzanine systems with integral ground planes, high-density arrays, ExaMAX® backplane interconnects, rugged Edge Rate® systems and high-speed performance to 28+ Gbps.

Micro Pitch Board-To-Board

Micro Pitch Board-To-Board

Interconnect systems with fine pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

Rugged / Power

Rugged / Power

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

Edge Card Connector Systems

Edge Card Connector Systems

High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Standard Board-To-Board

Standard Board-To-Board

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

Backplane / Micro Backplane

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 28 Gbps performance, and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

Industry Standards

Industry Standards

Certified or compliant to most industry standards, including VITA, PCIe®, PC/104™, QSFP+, InfiniBand™, JTAG, etc.

The 15th annual Manufacturing Leadership Awards Gala, by the National Association of Manufacturers, took place on June 12, 2019. The Manufacturing Leadership Awards honor manufacturing companies and individual manufacturing leaders that are shaping the future of global manufactur...
During a recent visit to Seattle, I learned about the Great Seattle Fire of 1889. In less than 24 hours the entire business district, about 25 city blocks, its railway stations and several wharves were destroyed. Instead of moving the city to start over, they decided to rebuild, ...
Data, data, data is everywhere. From streaming video to edge computing, system designers are challenged to meet the needs of the networks (and consumers). From servers and switches to networking equipment, OEMs developing next-gen devices with high performance communications face...
I want to believe. Not only could Eugene Victor Tooms hibernate for 30-year stints, but he could squeeze and elongate his body to pass through narrow openings. In the supernatural thriller The X-Files, Tooms managed to fit through elevator shafts, air vents, chimneys, and almost ...
One topic that garnered much interest at the Samtec booth at the International Microwave Symposium was a dynamic stress test of Samtec’s microwave cable. This demonstration proves that our low-loss, microwave cable withstands high flex cycles and still maintains signal integrity....